Patents by Inventor Shingo Tabei

Shingo Tabei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITION AND METHOD FOR TREATING TEXTILES
    Publication number: 20130316606
    Abstract: A curable composition useful for treating textiles to impart thereto upon the curing of one or more textile use-enhancing characteristics includes a first macromonomer (i) which is a polysiloxane possessing two or more terminal functional groups selected from the group consisting of hydroxyl, alkoxy and combinations thereof, a second macromonomer (ii) which is a polysiloxane containing two or more hydrosilyl (?C—SiH) groups, catalyst (iii) and, optionally, one more additional component(s) (iv) such as surfactant(s), water, etc.
    Type: Application
    Filed: May 24, 2013
    Publication date: November 28, 2013
    Applicant: Momentive Performance Materials Inc.
    Inventors: Wanchao Jiang, Shingo TABEI, Mark LEATHERMAN, Renwei WANG, Yong LONG
  • Durable non-fluorine water repellent agent and process for preparing same
    Patent number: 8329255
    Abstract: The present invention provides a crosslinkable polysiloxane-containing composition and a process for treating a textile with the composition whereby desirable properties, such as water repellency and durability, are enhanced.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: December 11, 2012
    Assignee: Momentive Performance Materials Inc.
    Inventors: Wanchao Jiang, Yong Long, Shingo Tabei, Uche Kelechi Anyanwu, Mark D. Leatherman, Zhipeng Zheng
  • Heat dissipating material and semiconductor device using same
    Patent number: 8221645
    Abstract: Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: July 17, 2012
    Assignee: Momentive Performance Materials Japan LLC
    Inventors: Shingo Tabei, Chisato Hoshino
  • Heat dissipating material and semiconductor device using same
    Patent number: 8187490
    Abstract: Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: May 29, 2012
    Assignee: Momentive Performance Materials Japan LLC
    Inventors: Shingo Tabei, Chisato Hoshino
  • Durable Non-Fluorine Water Repellent Agent and Process for Preparing Same
    Publication number: 20120114928
    Abstract: The present invention provides a crosslinkable polysiloxane-containing composition and a process for treating a textile with the composition whereby desirable properties, such as water repellency and durability, are enhanced.
    Type: Application
    Filed: November 5, 2010
    Publication date: May 10, 2012
    Applicant: Momentive Performance Materials Inc.
    Inventors: Wanchao Jiang, Yong Long, Shingo Tabei, Uche Kelechi Anyanwu, Mark D. Leatherman, Zhipeng Zheng
  • HEAT DISSIPATING MATERIAL AND SEMICONDUCTOR DEVICE USING SAME
    Publication number: 20120007017
    Abstract: Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.
    Type: Application
    Filed: September 22, 2011
    Publication date: January 12, 2012
    Inventors: Shingo Tabei, Chisato Hoshino
  • HEAT DISSIPATING MATERIAL AND SEMICONDUCTOR DEVICE USING SAME
    Publication number: 20100220446
    Abstract: Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.
    Type: Application
    Filed: January 25, 2007
    Publication date: September 2, 2010
    Inventors: Shingo Tabei, Chisato Hoshino