Abstract: A photosensitive resin composition of the invention contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a photopolymerization initiator comprising a compound represented by the formula (11), (C) a thermal radical generator, and (D) a solvent containing ?-butyrolactone: wherein in the formula (11), R11 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a group comprising a substituted or unsubstituted carbazolyl group; R12 is an alkyl group including 1 to 12 carbon atoms, a group comprising a cycloalkyl group including 4 to 10 carbon atoms, a group comprising a phenyl group, or a group comprising a tolyl group; R13 is a substituted or unsubstituted aromatic hydrocarbon group including 6 to 20 carbon atoms.

Abstract: The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Abstract: Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein R3 represents a hydrogen atom or a methyl group; and R4 represents a hydroxyalkyl group having 2 to 20 carbon atoms.

Abstract: There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

Abstract: Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein R3 represents a hydrogen atom or a methyl group; and R4 represents a hydroxyalkyl group having 2 to 20 carbon atoms.

Abstract: The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Abstract: There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

Abstract: The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

Abstract: The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.