Abstract: A projector includes a selection section configured to select an interface to which an image signal to be displayed by the projector out of the plurality of interfaces is input, a determination section configured to determine whether or not the interface selected is a compliant interface capable of establishing daisy chain connection, and a function control section configured to make the transition of the projector to a state of preventing a daisy chain function from being executed when the interface selected is not the compliant interface, and when the daisy chain function which can be executed in a state in which the projector is coupled to another projector with the daisy chain connection is set available.

Abstract: An optical deflector is configured such that a distance between a circumscribed circle of a rotary polyhedron centered on an axis of the rotary polyhedron and an inner peripheral surface of a peripheral wall of a cover member in a radial direction of the rotary polyhedron is largest at both of circumferential ends of an opening of the cover member.

Abstract: To suppress separation of air flows in air holes that are positioned in the outermost circumferential row in an air hole plate, but are far from a turn guide.

Abstract: The reduced iron manufacturing method of the present invention includes preparing an agglomerate by agglomerating a mixture containing an iron oxide-containing substance and a carbonaceous reducing agent, and preparing reduced iron by heating the agglomerate to reduce iron oxide in the agglomerate, characterized in that Expression (I) as follows is satisfied: Cfix×Xunder105/OFeO?51??(I) where OFeO is the mass percentage of oxygen contained in the iron oxide in the agglomerate, Cfix is the mass percentage of total fixed carbon contained in the agglomerate, and Xunder105 is the mass percentage of particles having a particle diameter of 105 ?m or less with respect to the total mass of particles configuring the carbonaceous reducing agent.

Abstract: An optical deflector is configured such that a distance between a circumscribed circle of a rotary polyhedron centered on an axis of the rotary polyhedron and an inner peripheral surface of a peripheral wall of a cover member in a radial direction of the rotary polyhedron is largest at both of circumferential ends of an opening of the cover member.

Abstract: A light deflecting device includes a rotary polyhedron and a cover that covers the rotary polyhedron. The cover includes an opening facing a peripheral surface of the rotary polyhedron. Light beam is irradiated to the peripheral surface of the rotary polyhedron through the opening of the cover, and the rotary polyhedron allows the light beam to be deflected and scanned with respect to an object to be irradiated while rotating about an axial center thereof. When an opening angle of the opening centered on the axial center of the rotary polyhedron is ? and n is set as a natural number, ? satisfies the following Equation (1) ?>((360°/the number of surfaces of the rotary polyhedron)×n)×0.83 . . . (1) and Equation (2) ?<((360°/the number of surfaces of the rotary polyhedron)×n)×1.17 . . . (2).

Abstract: A circuit connection device having one or a plurality of terminals, circuit board, tubular case body, terminal inserting portion and insulating first and second retainers. The terminal(s) are electrically connected to the circuit board. The case body accommodates the circuit board and has an opening at its one end. The terminal inserting portion has one or a plurality of penetration holes and closes the opening of the case body. The first and second retainers are accommodated in the case body. The terminal(s) are inserted into the penetration hole(s). The first retainer has terminal retaining portion retaining terminal(s). The second retainer has a positioning portion maintaining a position relationship with the circuit board, and is engaged with the first retainer. The first and second retainers are configured so that movement of the terminal(s) is restrained and the terminal(s) are connected to the circuit board.

Abstract: A circuit connection device for connecting circuit to an electronic device having one or a plurality of first terminals, circuit board, tubular case body, terminal inserting portion, terminal core and guide. The first terminal is electrically connected to circuit board. The case body accommodates circuit board and has an opening at its one end. The terminal inserting portion has a penetration hole and closes an opening of the case body. The terminal core is placed in case body. The guide is configured to guide the terminal core in an axis direction of the case body. The first terminal is inserted into the penetration hole of the terminal inserting portion. The terminal core has one or a plurality of second terminals electrically connected to the circuit board and insulating retainer retaining the second terminal. The retainer has a positioning portion that maintains a position relationship with circuit board.

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

Abstract: A process for manufacturing reduced iron agglomerates which comprises introducing starting agglomerates that comprise both an iron oxide-containing material and a carbonaceous reducing agent onto the hearth of a moving-bed heating furnace, and heating the agglomerates to reduce the iron oxide contained in the agglomerates, wherein the iron oxide-containing material contained in the starting agglomerates has a mean particle diameter of 4 to 23 ?m and contains at least 18% of particles having diameters of 10 ?m or less. By the use of such starting agglomerates, the process attains: an improvement in the yield of reduced iron agglomerates having large particle diameters; a reduction in the manufacturing time, said reduction leading to an enhancement in the productivity; and a remarkable reduction in the content of impurities such as sulfur in the reduced-iron agglomerates.

Abstract: A connector has a fixing hole in an intermediate portion of a terminal member, and has an engagement portion projecting downward in a thickness direction, at an end portion at a front end side of the fixing hole. Therefore, when the terminal member is attached to a housing, movement of the terminal member toward a rear end side can be restricted by fitting a projection portion of the housing into the fixing hole. Furthermore, since the engagement portion is provided to the terminal member, movement of the terminal member toward the rear end side can be restricted by engaging the engagement portion with a front end surface of a protrusion portion of the housing.

Abstract: The reduced iron manufacturing method of the present invention includes preparing an agglomerate by agglomerating a mixture containing an iron oxide-containing substance and a carbonaceous reducing agent, and preparing reduced iron by heating the agglomerate to reduce iron oxide in the agglomerate, characterized in that Expression (I) as follows is satisfied: Cfix×Xunder105/OFeO?51??(I) where OFeO is the mass percentage of oxygen contained in the iron oxide in the agglomerate, Cfix is the mass percentage of total fixed carbon contained in the agglomerate, and Xunder105 is the mass percentage of particles having a particle diameter of 105 ?m or less with respect to the total mass of particles configuring the carbonaceous reducing agent.

Abstract: Provided is a technique for increasing the yield of reduced iron, thereby improving productivity when manufacturing reduced iron by heating an agglomerate. This method for manufacturing reduced iron includes: a step in which a mixture is agglomerated, said mixture containing an iron oxide-containing substance, a carbonaceous reducing agent, and a melting point regulator; and a step in which reduced iron is manufactured by heating the obtained agglomerate, reducing and partially melting the iron oxide in the agglomerate, and aggregating the iron component. The particle size of the fine particulate iron generated in the step in which the reduced iron is manufactured is adjusted, and the fine particulate iron is blended into the mixture.

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

Abstract: Disclosed is an optical deflector including a polygonal mirror and a drive motor each mounted on a substrate, a cover member covering the polygonal mirror and the drive motor, and an electronic component. The cover member includes: a first cover portion defining a first space in which the polygonal mirror is installed, wherein the first cover portion is formed with a first opening opened in opposed relation to an outer peripheral surface of the polygonal mirror; and a second cover portion defining a second space which is communicated with the first space and in which the drive motor is installed, wherein the second cover portion is formed with a second opening opened in opposed relation to a motor body of the drive motor. When viewed in the first direction, the electronic component is disposed such that it falls within an open region of the second opening.

Abstract: A connector has a fixing hole in an intermediate portion of a terminal member, and has an engagement portion projecting downward in a thickness direction, at an end portion at a front end side of the fixing hole. Therefore, when the terminal member is attached to a housing, movement of the terminal member toward a rear end side can be restricted by fitting a projection portion of the housing into the fixing hole. Furthermore, since the engagement portion is provided to the terminal member, movement of the terminal member toward the rear end side can be restricted by engaging the engagement portion with a front end surface of a protrusion portion of the housing.

Abstract: Disclosed is an optical deflector including a polygonal mirror and a drive motor each mounted on a substrate, a cover member covering the polygonal mirror and the drive motor, and an electronic component. The cover member includes: a first cover portion defining a first space in which the polygonal mirror is installed, wherein the first cover portion is formed with a first opening opened in opposed relation to an outer peripheral surface of the polygonal mirror; and a second cover portion defining a second space which is communicated with the first space and in which the drive motor is installed, wherein the second cover portion is formed with a second opening opened in opposed relation to a motor body of the drive motor. When viewed in the first direction, the electronic component is disposed such that it falls within an open region of the second opening.

Abstract: An optical scanning device includes a light source, a deflector, and a plurality of scanning lenses. A scanning lens lying closest to the deflector has a positive refractive power and the incident surface of it allows the oblique angle ? of the light beam entering the incident surface to vary from a center to an end of the incident surface. The incident surface satisfies the following conditions, where ?? is the amount of change and d? is the rate of change in the oblique angle ? of the light beam in the main scanning direction, d2? is the rate of change in d?, and ?2? is the amount of change in ??: d2?<|0.036| when ?2? increases from the center to the end in the main scanning direction; and d2?<|0.061| when ?2? decreases from the center to the end in the main scanning direction.

Abstract: A method for producing granular metallic iron of the present invention includes: an agglomeration step of obtaining agglomerates through agglomeration of a mixture that contains an iron oxide-containing material and a carbonaceous reducing agent; and a granulation step of obtaining granular metallic iron by heating the agglomerates, reducing iron oxides in the agglomerates, aggregating generated metallic iron to be granular while separating the metallic iron from slag generated as a by-product, and thereafter cooling and solidifying the metallic iron, wherein agglomerates satisfying all the conditions given by formulas (1) to (3) below are used as the agglomerates: (1) [(total CaO amount+total SiO2 amount+total Al2O3 amount)/total Fe amount]?0.250; (2) (total CaO amount/total SiO2 amount)?0.9; (3) [total Al2O3 amount/(total CaO amount+total SiO2 amount+total Al2O3 amount)]×100?9.7.

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.