Abstract: The present invention provides a conjugated diene-based polymer composition excellent in rolling resistance, grip performance on a wet road surface, and abrasion resistance when formed into a tire. Also provided is a conjugated diene-based polymer composition containing: 10 to 90 parts by mass of a conjugated diene-based polymer (A) having a glass transition temperature of ?20° C. or more; and 10 to 90 parts by mass of a conjugated diene-based polymer (B) having a glass transition temperature of ?25° C. or less, wherein the conjugated diene-based polymer (A) has an absolute molecular weight, measured by viscosity detector-equipped GPC-light scattering measurement, of 40×104 or more and 5000×104 or less, and a branch number (Bn), measured by the viscosity detector-equipped GPC-light scattering measurement, of 8 or more.

Abstract: A liquid crystal emulsification method that can reduce formulation restriction and adjust the size of a dispersed phase with small variation in size of the dispersed phase, and a liquid crystal emulsion are provided. The liquid crystal emulsification method includes: adding a moisture content and/or an oil content at a predetermined ratio to a surfactant having an HLB falling within a predetermined range; and setting a temperature during formation of a dispersion or an emulsion to a predetermined temperature, to adjust a lamellar liquid crystal having a regular molecular arrangement in which the oil content and/or the moisture content are alternately arranged in a bilayer membrane formed from the surfactant.

Abstract: A liquid crystal emulsification method that can reduce formulation restriction and adjust the size of a dispersed phase with small variation in size of the dispersed phase, and a liquid crystal emulsion are provided. The liquid crystal emulsification method includes: adding a moisture content and/or an oil content at a predetermined ratio to a surfactant having an HLB falling within a predetermined range; and setting a temperature during formation of a dispersion or an emulsion to a predetermined temperature, to adjust a lamellar liquid crystal having a regular molecular arrangement in which the oil content and/or the moisture content are alternately arranged in a bilayer membrane formed from the surfactant.

Abstract: A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.

Abstract: A resin substrate includes a resin base material including a first main surface, electrode pads provided on the first main surface, circuit conductor patterns, a resist film, and a coverlay film. The resist film includes, on the outer circumference, a plurality of protruding portions each of which has a tapered shape with a vertex. A portion of the circuit conductor patterns are covered with the resist film, and the coverlay film covers a portion of the resist film including the protruding portions and exposed portions of the circuit conductor patterns. The protruding portions are located at positions sandwiching the exposed portions of the circuit conductor patterns.

Abstract: A resin substrate includes a resin base material including a first main surface, electrode pads provided on the first main surface, circuit conductor patterns, a resist film, and a coverlay film. The resist film includes, on the outer circumference, a plurality of protruding portions each of which has a tapered shape with a vertex. A portion of the circuit conductor patterns are covered with the resist film, and the coverlay film covers a portion of the resist film including the protruding portions and exposed portions of the circuit conductor patterns. The protruding portions are located at positions sandwiching the exposed portions of the circuit conductor patterns.

Abstract: A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.

Abstract: In a board joint structure, a first board (board) and a component (mounting board) are joined together by a conductive joint material and an insulating joint material. The first board includes a first insulating substrate including a first main surface, a first electrode pad provided on the first main surface, a spacer, and the like. At least a portion of the insulating joint material and the spacer are located between the first board and the component, and the first electrode pad is joined to a second electrode pad of the component with the conductive joint material. A region of the first main surface other than a region where the first electrode pad is provided is joined to the component with the insulating joint material.

Abstract: An interposer includes a stacked body including first and second mounting surfaces that face each other, a first electrode on the first mounting surface, and a second electrode on the second mounting surface. The stacked body includes flexible insulating layers stacked on each other, and a folded portion. The first and second electrodes are electrically connected to each other. The stacked body includes an upright portion between the first and second mounting surfaces and in which a stacking direction in which the insulating layers are stacked is parallel to the first and second mounting surfaces, and a bent portion bent in a plan view of the first and second mounting surfaces.

Abstract: An interposer includes a stacked body including first and second mounting surfaces that face each other, a first electrode on the first mounting surface, and a second electrode on the second mounting surface. The stacked body includes flexible insulating layers stacked on each other, and a folded portion. The first and second electrodes are electrically connected to each other. The stacked body includes an upright portion between the first and second mounting surfaces and in which a stacking direction in which the insulating layers are stacked is parallel to the first and second mounting surfaces, and a bent portion bent in a plan view of the first and second mounting surfaces.

Abstract: A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.

Abstract: A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.

Abstract: Organopolysiloxane emulsions having improved release properties when employed in die casting, contain an organopolysiloxane with long chain alkyl groups and/or aryl groups, and a partially hydrophobicized silica as an emulsifying agent.

Abstract: A hot-rolled steel sheet according to the present invention is a steel sheet containing a predetermined components, and satisfying O<S/Ca<0.8, N?14/48×Ti?“0” (zero) %. It is a high-strength hot-rolled steel sheet for a spiral pipe excellent in low-temperature toughness in which a pro-eutectoid ferrite fraction is 3% or more and 20% or less, and the other is a low-temperature transformation phase in a microstructure at a depth of a half thickness of a sheet thickness from a steel sheet surface, a number average crystal grain size of a whole of the microstructure is 2.5 ?m or less, an area average grain size is 9 ?m or less, a standard deviation of the area average grain size is 2.3 ?m or less, and a reflected X-ray intensity ratio {211}/{111} in a direction and in a {111} direction relative to a plane in parallel to the steel sheet surface at the depth of the half thickness of the sheet thickness from the steel sheet surface is 1.1 or more.

Abstract: Stable aqueous silicone emulsion compositions contain a silicone or silicone mixture having a viscosity of 1×103 to 5×104 mPas, water, and a polyoxyethylated castor oil or hydrogenated castor oil surfactant with a degree of oxyethylation of 150 to 300. The emulsions are stable even in the presence of significant amounts of monoalcohols, and are useful in hair cosmetic formulations.

Abstract: A ship design supporting system includes a storage section for storing general arrangement model data describing a general arrangement model which contains a hull structure model as a 3-dimensional model of a hull structure and an equipment apparatus model as a 3-dimensional model of equipment apparatus; and a model producing and changing section for changing the general arrangement model based on a final line plan data which shows a shape of a ship to be built. Because the general arrangement design and the ship shape design can be carried forward in parallel, a time from start of the design to completion can be reduced.

Abstract: A hot-rolled steel sheet according to the present invention is a steel sheet containing a predetermined components, and satisfying O<S/Ca<0.8, N?14/48×Ti?“0” (zero) %. It is a high-strength hot-rolled steel sheet for a spiral pipe excellent in low-temperature toughness in which a pro-eutectoid ferrite fraction is 3% or more and 20% or less, and the other is a low-temperature transformation phase in a microstructure at a depth of a half thickness of a sheet thickness from a steel sheet surface, a number average crystal grain size of a whole of the microstructure is 2.5 ?m or less, an area average grain size is 9 ?m or less, a standard deviation of the area average grain size is 2.3 ?m or less, and a reflected X-ray intensity ratio {211}/{111} in a {211} direction and in a {111} direction relative to a plane in parallel to the steel sheet surface at the depth of the half thickness of the sheet thickness from the steel sheet surface is 1.1 or more.

Abstract: A paint gun is washed by adjusting the spray pressure of washing solution, the pressure of atomizing air, and the pressure of the patterning air so that the washing solution sprayed from the paint nozzle is shaped so as to wash the front surface of the paint nozzle.

Abstract: Disclosed is a microelectromechanical (MEM) speaker device. In one embodiment, the MEM speaker device includes: (i) a base layer; (ii) a device controller; (iii) a coil layer connected to magnetic material; (iv) an oscillator connected to a spring and the magnetic material; (v) a spring between the oscillator and a support layer; (vi) a protective layer over the oscillator; and (vii) a support post connected to the oscillator, the base layer, the protective layer, and the coil layer. Embodiments of the invention can provide a MEM speaker device where control of the oscillator by electromagnetic force produces sound energy.

Abstract: A MEMS microphone is formed on a single substrate that also includes microelectronic circuitry. High-temperature tolerance metals are used to form contacts in a metallization step before performing deep reactive ion etching and back patterning steps to form a MEMS microphone. High-temperature tolerant metals such as titanium, tungsten, chromium, etc. can be used for the contacts. Another approach uses laser annealing in place of deep reactive ion etching so that high-temperature tolerant metals do not need to be used in earlier metallization steps. Different orderings for device, circuit, and metallization series of steps are presented.