Abstract: A switch station including an ATM switch; a memory storing control data for operations of the switch station; an intra-station device, accommodating a subscriber line, performing communication operation on subscriber ATM cell; a control processor generating control information in link access protocol (LAP) format; and an interface unit converting LAP control information into ATM cell to the intra-station device through the ATM switch, wherein the control information is communicated according to LAP, the intra-station device receives the control information and transmits a direct memory access request to obtain control data stored in the memory, the interface unit obtains and converts the data format of the control data into ATM cell to transmit to the intra-station device through the switch, and the intra-station device performs the communication operation on the subscriber ATM cell based on the control data received through the switch.

Abstract: The invention is intended to prevent, in a local clean system, attachment of particles to a wafer, which would occur when the wafer is taken out from a clean box. To achieve the object, an operating method of a local clean system including a processing apparatus, a load port annexed thereto and a clean box set to the load port, comprises the steps of, setting the clean box on the load port, opening a communication path between the load port and the processing apparatus, opening, after said communication path is opened fully, the clean box and bringing a cassette in which a wafer is accommodated inside the clean box into an interior of the load port, and taking the wafer out of the cassette and transferring the wafer into the interior of the processing apparatus.

Abstract: The quality and performance of the connectionless communications system are improved. When a BOM is received, the destination address DA of the L3-PDU stored in the payload of the BOM is retrieved, and the tag information is obtained from the DA (S11). The output message identifier MID is reserved (S12), and the tag information and output MID are assigned to the BOM (S13). Then, the tag information and output MID are written to the table. When a COM is received, the tag information and output MID are retrieved using the MID of the COM as a key, and the information is provided for the COM (S31 and S32). When an EOM is received, the tag information and output MID are retrieved using the MID of the EOM as a key, and the information is provided for the EOM (S41 and S42). Then, the output MID is released (S43).

Abstract: A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip hold on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably held a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

Abstract: The quality and performance of the connectionless communications system are improved. When a BOM is received, the destination address DA of the L3-PDU stored in the payload of the BOM is retrieved, and the tag information is obtained from the DA (S11). The output message identifier MID is reserved (S12), and the tag information and output MID are assigned to the BOM (S13). Then, the tag information and output MID are written to the table. When a COM is received, the tag information and output MID are retrieved using the MID of the COM as a key, and the information is provided for the COM (S31 and S32). When an EOM is received, the tag information and output MID are retrieved using the MID of the EOM as a key, and the information is provided for the EOM (S41 and S42). Then, the output MID is released (S43).

Abstract: Methods and apparatus for adjusting the position of a printing screen having a center of rotation mounted on a screen frame for use in screen printing processes are disclosed. The apparatus includes a screen frame with a printing screen mounted thereon, a screen frame holder, a plurality of first arcuate guides mounted on the screen frame defining an arc with a predetermined circumference defined by a predetermined radius, a plurality of guide rollers mounted on the screen frame holder and corresponding to the plurality of first arcuate guides whereby the plurality of guide rollers movably supports the plurality of first arcuate guides and an adjustment mechanism adapted to urge the screen frame around the center of rotation of the printing screen.

Abstract: A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably hold a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

Abstract: Methods and apparatus for adjusting the position of a printing screen having a center of rotation mounted on a screen frame for use in screen printing processes are disclosed. The apparatus includes a screen frame with a printing screen mounted thereon, a screen frame holder, a plurality of first arcuate guides mounted on the screen frame defining an arc with a predetermined circumference defined by a predetermined radius, a plurality of guide rollers mounted on the screen frame holder and corresponding to the plurality of first arcuate guides whereby the plurality of guide rollers movably supports the plurality of first arcuate guides and an adjustment mechanism adapted to urge the screen frame around the center of rotation of the printing screen.

Abstract: An apparatus establishes a common signal channel with a flexible channel capacity for effective utilization of the total traffic capacity between two exchanges or stations which are interconnected by the common signal channel. A traffic detecting unit in one of the exchanges detects a traffic volume in the common signal channel between the exchanges. Based on the detected traffic volume, a channel capacity change determining unit determines whether a channel capacity to which the common signal channel is set needs to be changed or not and determines a new channel capacity to be established for the common signal channel if the channel capacity needs to be changed. If the channel capacity to which the common signal channel is set needs to be changed, a channel capacity change executing unit executes a change in the channel capacity to which the common signal channel is set based on the established new channel capacity.

Abstract: An apparatus for selecting a route in a packet-switched network where a plurality of candidate routes are available between a sending node and a receiving node. Total capacity calculation unit disposed in the sending node calculates the total channel capacity of each candidate route by summing up channel capacities of the inter-node links between the sending node and the receiving node. First selection unit chooses the candidate route(s) that exhibit the largest value of the total channel capacity. Uniformity calculation unit is activated when the first selection unit selected a plurality of candidate routes. The uniformity calculation unit calculates uniformity of each candidate route by evaluating the channel capacities of the inter-node links. The second selection unit chooses one of the candidate routes based on the calculated uniformity. This route will be used in packet transmission from the sending node to the receiving node.

Abstract: A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably held a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

Abstract: A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding for adhesively mounting IC chips on a lead frame, wire-bonding for connecting bonding pads of the IC chips and the lead frame to each other through lead wires, and molding for forming a resin material into an outer package for covering each of the IC chips are successively executed on a through-line while transferring the lead frame by means of a conveyor.

Abstract: Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at

Abstract: An electronic component feed system capable of feeding an electronic component mounting apparatus with a variety of electronic components such as chips, lead-type electronic components and the like in various forms. A plurality of feeder modules corresponding to sorts of electronic components to be mounted on printed circuit boards are stored in a storage kit and transferred through the storage kit to an electronic component feed section of the mounting apparatus on which a printed circuit board is held. Then, the electronic components are mounted on the printed circuit board by means of a mounting head.

Abstract: An automatic electronic component mounting apparatus for automatically mounting electronic components on the printed circuit board includes an electronic component supply mechanism for supplying an electronic component to a predetermined position, at least one mounting head movable in a Y direction, a first controlling mechanism for moving the mounting head in the Y direction, a movable frame movable in an X direction, a second controlling mechanism for moving the movable frame in the X direction and controlling the position of the movable frame in the X direction, a support base supported to the movable frame, and a table carrying a printed circuit board and turnable in a .theta. direction. The table is rotatably supported on the support base so that when the X directional position of the movable frame is controlled by the second controlling mechanism, the X directional position of the table is also controlled. A third controlling mechanism is provided for controlling a .theta.

Abstract: A circuit element mounting system and method capable of utilizing data from a CAD device for mounting a circuit element on a printed circuit board to permit mounting in high density or concentration. The system and method include a mounting head for holding a circuit element thereon and mounting it on a printed circuit board. Also, the system and method include controlling moving of the mounting head to a predetermined position on the printed circuit board, depending upon circuit element mounting data input thereto, to thereby cause the mounting head to mount the circuit element on the printed circuit board in a correct manner.