Patents by Inventor Shinichi Edagawa

Shinichi Edagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Induction heating coil unit for manifold in hot runner mold
    Patent number: 6410895
    Abstract: In an induction heating coil unit for a manifold in a hot runner mold, it is possible to uniformly heat a material over the entire length of a runner. Also, a coil is easily attached to and detached from the manifold. The hot runner mold includes a fixed mold and a movable mold, and a space is provided along a side surface of the manifold on which clamping force applied by the fixed mold and the movable mold does not act. A coil is wound to the side surface along an axial line of a runner of the manifold within the space such that the manifold is induction-heated from the side surface.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: June 25, 2002
    Assignee: Ju-Oh Inc.
    Inventors: Itsuo Shibata, Shinichi Edagawa, Ryoichi Sekiguchi, Hitoshi Toki, Tamotsu Munakata
  • Induction heating coil unit for manifold in hot runner mold
    Publication number: 20010038006
    Abstract: The present invention provides an induction heating method for a manifold in a hot runner mold where it is possible to uniformly heat material over the entire length of a runner and in which a coil may be easily attached to and detached from the manifold.
    Type: Application
    Filed: June 25, 2001
    Publication date: November 8, 2001
    Inventors: Itsuo Shibata, Shinichi Edagawa, Ryoichi Sekiguchi, Hitoshi Toki, Tamotsu Munakata
  • Induction heating method for manifold in hot runner mold
    Patent number: 6310333
    Abstract: In an induction heating method for a manifold in a hot runner mold, it is possible to uniformly heat a material over the entire length of a runner. Also, a coil is easily attached to and detached from the manifold. The hot runner mold includes a fixed mold and a movable mold, and a space is provided along a side surface of the manifold on which clamping force applied by the fixed mold and the movable mold does not act. A coil is wound to the side surface along an axial line of a runner of the manifold within the space such that the manifold is induction-heated from the side surface.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: October 30, 2001
    Assignee: JU-OH Inc.
    Inventors: Itsuo Shibata, Shinichi Edagawa, Ryoichi Sekiguchi, Hitoshi Toki, Tamotsu Munakata
  • Induction heating method for manifold in hot runner mold and induction heating coil unit
    Publication number: 20010000402
    Abstract: The present invention provides an induction heating method for a manifold in a hot runner mold where it is possible to uniformly heat material over the entire length of a runner and in which a coil may be easily attached to and detached from the manifold.
    Type: Application
    Filed: December 5, 2000
    Publication date: April 26, 2001
    Applicant: JU - OH INC
    Inventors: Itsuo Shibata, Shinichi Edagawa, Ryoichi Sekiguchi, Hitoshi Toki, Tamotsu Munakata