Abstract: An electromagnetic wave visualization device includes an image acquisition unit that captures an image of a target device, a measurement unit that measures an electromagnetic wave intensity of the target device, a controller that sets a measurement range of the measurement unit and generates a composite image in which a measurement result of the measured electromagnetic wave intensity is superimposed on the captured image of the target device acquired by the image acquisition unit, and an output unit that outputs the composite image generated by the controller, in which the controller generates the composite image including the measurement range of the measurement unit and outputs the composite image to the output unit.

Abstract: A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.

Abstract: The present invention provides a novel acrylic acid crosslinked polymer and the use thereof. The present invention provides the acrylic acid crosslinked polymer in which the content of soluble components is 40 wt. % or higher. The present invention also provides a method for adjusting the viscosity of a fracturing fluid in a hydraulic fracturing method, the viscosity adjustment method including: A) a step of measuring the types and quantities of metal cations which are in water and which are the object of viscosity adjustment; B) a step of selecting the type and quantity of an acrylic acid crosslinked polymer on the basis of the types and quantities of metal cations and the pH so as to achieve a viscosity that is required for fracturing in a hydraulic fracturing method; and C) a step of adjusting the viscosity of the fracturing fluid using the acrylic acid crosslinked polymer of the selected type and quantity.

Abstract: A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.

Abstract: Provided is a method for producing a particulate water absorbing agent, the method including the steps of: a polymerization step of polymerizing an acrylic acid (salt)-based aqueous monomer solution so as to obtain a crosslinked hydrogel polymer; a drying step of drying the crosslinked hydrogel polymer so as to obtain a dried polymer; a classification step of classifying a polymer subjected to classification so as to obtain a water-absorbing resin powder having a specific particle size; and a surface-crosslinking step of surface-crosslinking the water-absorbing resin powder that is not surface crosslinked, wherein the classification step is carried out at least either or both of before and/or after the surface-crosslinking step but after said drying step, and wherein a hole shape of a classification sieve used in the classification step is an irregular polygonal or non-circular.

Abstract: A power semiconductor device includes a first power semiconductor element, a second power semiconductor element, a first conductor plate, a second conductor plate, a third conductor plate, and a fourth conductor plate. The power semiconductor device also includes a DC positive terminal, a DC negative terminal, an AC terminal, and a sealing member that integrally seals the first conductor plate, the second conductor plate, the third conductor plate, and the fourth conductor plate. Each of the DC positive terminal, the DC negative terminal, and the AC terminal has a cut section formed by cutting a tie bar that integrally couples the DC positive terminal, the DC negative terminal, and the AC terminal.

Abstract: It is possible to improve heat dissipation of a semiconductor circuit to be inserted into a case. A case into which a semiconductor circuit is inserted, the case including: a heat dissipating portion having, on an inner side, a contact surface coming in contact with the semiconductor circuit; a thin portion formed to surround the contact surface and formed to be thinner than the heat dissipating portion; and a recess formed between the thin portion and the heat dissipating portion and recessed with respect to the contact surface, in which an inner surface of the recess is arranged between the contact surface and an inner surface of the thin portion in a thickness direction of the case.

Abstract: A power semiconductor device includes a first power semiconductor element, a second power semiconductor element, a first conductor plate, a second conductor plate, a third conductor plate, and a fourth conductor plate. The power semiconductor device also includes a DC positive terminal, a DC negative terminal, an AC terminal, and a sealing member that integrally seals the first conductor plate, the second conductor plate, the third conductor plate, and the fourth conductor plate. Each of the DC positive terminal, the DC negative terminal, and the AC terminal has a cut section formed by cutting a tie bar that integrally couples the DC positive terminal, the DC negative terminal, and the AC terminal.

Abstract: A particulate water absorbent resin is obtained by polymerizing an unsaturated monomer so as to form a cross-linked polymer hydrogel and drying and pulverizing the cross-linked polymer hydrogel, and plural classification steps different from each other are carried out so as to remove fine powder. In this manner, the present invention provides the method for classification of particulate water absorbent resin which method allows particulate water absorbent resin having a desired particle diameter range to be efficiently obtained at low cost while securing the high productivity even in case where a larger production equipment is used.

Abstract: The present invention provides a novel acrylic acid crosslinked polymer and the use thereof. The present invention provides the acrylic acid crosslinked polymer in which the content of soluble components is 40 wt. % or higher. The present invention also provides a method for adjusting the viscosity of a fracturing fluid in a hydraulic fracturing method, the viscosity adjustment method including: A) a step of measuring the types and quantities of metal cations which are in water and which are the object of viscosity adjustment; B) a step of selecting the type and quantity of an acrylic acid crosslinked polymer on the basis of the types and quantities of metal cations and the pH so as to achieve a viscosity that is required for fracturing in a hydraulic fracturing method; and C) a step of adjusting the viscosity of the fracturing fluid using the acrylic acid crosslinked polymer of the selected type and quantity.

Abstract: An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case component. In the power semiconductor module according to the present invention, a frame case includes a front surface, a back surface, and a pair of side surfaces and formed with an opening part in at least one of the front surface and the back surface. A metal base is inserted into the opening part of the frame case. A frame case is provided with a joining part FW to which the peripheral part of the metal base and the peripheral part of the opening part of the frame case are joined. A first concaved part and a second concaved part are formed respectively in each of a pair of side surfaces of the frame case.

Abstract: A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.

Abstract: Size reduction of a power conversion device is intended. A power conversion device according to the present invention includes: a first power semiconductor module; a second semiconductor module; and a fixing member which fixes the first power semiconductor module, wherein the first power semiconductor module has a first power semiconductor device, a first case which houses the first power semiconductor device, and a first flange portion connected to the case, the second power semiconductor module has a second power semiconductor device, and a second case which houses the second power semiconductor device, the second case is connected to the first flange portion so as to provide a first flow path space for allowing a coolant to flow between the second case and the first case, and the first flange portion is fixed to the fixing member while supporting the first case and the second power semiconductor module.

Abstract: Provided is a method for producing a particulate water absorbing agent, the method including the steps of: a polymerization step of polymerizing an acrylic acid (salt)-based aqueous monomer solution so as to obtain a crosslinked hydrogel polymer; a drying step of drying the crosslinked hydrogel polymer so as to obtain a dried polymer; a classification step of classifying a polymer subjected to classification so as to obtain a water-absorbing resin powder having a specific particle size; and a surface-crosslinking step of surface-crosslinking the water-absorbing resin powder that is not surface crosslinked, wherein the classification step is carried out at least either or both of before and/or after the surface-crosslinking step but after said drying step, and wherein a hole shape of a classification sieve used in the classification step is an irregular polygonal or non-circular.

Abstract: The present invention provides a method for producing, by adding an additive and/or gas bubbles to a monomer with high efficiency, a polyacrylic acid (salt)-based water-absorbing resin having high physical properties while high productivity is maintained. The step of preparing an aqueous monomer solution includes the steps of: preparing an aqueous solution; and adding a water-insoluble additive and/or gas bubbles. A retention time from when the water-insoluble additive and/or the gas bubbles is/are added to when polymerization starts is 1 second to 60 seconds.

Abstract: To provide a method for producing a water-absorbing resin by which problems caused by addition of a particulate additive or water-absorbing resin fine powder can be prevented and a water-absorbing resin having high physical properties can be stably and efficiently obtained. A method for producing a polyacrylic acid (salt)-based water-absorbing resin, the method including: an aqueous monomer solution preparation step for preparing an aqueous solution containing a monomer having an acrylic acid (salt) as a main component; a polymerization step for polymerizing the monomer to obtain a hydrogel-forming crosslinked polymer; and a drying step for drying the hydrogel-forming crosslinked polymer to obtain a dry polymer, wherein the method further includes an adding step for adding a particulate additive to the aqueous monomer solution and/or the hydrogel-forming crosslinked polymer, and in the adding step, an oxygen concentration in an ambient atmosphere of the particulate additive is set to 5% by volume or less.

Abstract: A method for producing polyacrylic acid (salt)-based water-absorbing resin includes a step of polymerizing an acrylic acid (salt)-based aqueous monomer solution, the polymerization step involving use of a polymerization reaction apparatus including a polymerization reaction unit covered with a casing, the polymerization step involving a polymerization reaction under internal pressure of the polymerization reaction unit, the internal pressure being slightly reduced and having a pressure reduction level of more than 0 kPa and not more than 10 kPa relative to the ambient pressure at the periphery of the polymerization reaction unit.

Abstract: To suppress a temperature rise of a chip accompanying a production of large output by a power converter, and to reduce a size of the power converter. A power semiconductor device includes: a first power semiconductor element to configure an upper arm of an inverter circuit; a second power semiconductor element to configure a lower arm of the inverter circuit; a first lead frame to transmit power to the first power semiconductor element; a second lead frame to transmit power to the second power semiconductor element; a first gate lead frame to transmit a control signal to the first power semiconductor element; and a sealing member to seal the first power semiconductor element, the second power semiconductor element, the first lead frame, the second lead frame, and the first gate lead frame. In the power semiconductor device, a through-hole is formed in the sealing member, and a part of the first gate lead frame and a part of the second lead frame are exposed to an inner peripheral surface of the through-hole.

Abstract: To provide a method for producing a water-absorbing resin by which problems caused by addition of a particulate additive or water-absorbing resin fine powder can be prevented and a water-absorbing resin having high physical properties can be stably and efficiently obtained. A method for producing a polyacrylic acid (salt)-based water-absorbing resin, the method including: an aqueous monomer solution preparation step for preparing an aqueous solution containing a monomer having an acrylic acid (salt) as a main component; a polymerization step for polymerizing the monomer to obtain a hydrogel-forming crosslinked polymer; and a drying step for drying the hydrogel-forming crosslinked polymer to obtain a dry polymer, wherein the method further includes an adding step for adding a particulate additive to the aqueous monomer solution and/or the hydrogel-forming crosslinked polymer, and in the adding step, an oxygen concentration in an ambient atmosphere of the particulate additive is set to 5% by volume or less.

Abstract: An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case component. In the power semiconductor module according to the present invention, a frame case includes a front surface, a back surface, and a pair of side surfaces and formed with an opening part in at least one of the front surface and the back surface. A metal base is inserted into the opening part of the frame case. A frame case is provided with a joining part FW to which the peripheral part of the metal base and the peripheral part of the opening part of the frame case are joined. A first concaved part and a second concaved part are formed respectively in each of a pair of side surfaces of the frame case.