Patents by Inventor Shinichi Hasegawa

Shinichi Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6352019
    Abstract: A diaphragm actuator having a diaphragm therein which is installed inside a cup so as to form a pressure chamber and a pressure is supplied to the pressure chamber so as to actuate the diaphragm and a rod connected to the diaphragm. The rod is supported by a bearing disposed inside the cup so that the diaphragm actuator is excellent in thermal insulation against the surrounding atmospheric temperature, thus preventing the diaphragm from being thermally deteriorated. To achieve this end, the bearing is extended to an inner peripheral surface of the cup until it touches the inner peripheral surface, and a contact surface of the bearing with the rod is formed in an arc-shaped section having the least inner diameter at its axial center.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: March 5, 2002
    Assignee: NOK Corporation
    Inventors: Shinichi Hasegawa, Syoji Mizumachi
  • Patent number: 6307485
    Abstract: A map display unit is provided with a set uni that sets a rule for extracting map information from a storage device. The set unit sets a first rule for most preferentially extracting map information on the largest scale and a second rule for most preferentially extracting map information on a specified scale. For this reason, if the first rule is set, a map on the largest scale having detailed information can be displayed, even if a map were switched. Therefore, the accuracy of route guidance can be enhanced by displaying a map suitable when passing through complicated geographical features or city. On the other hand, if the second rule is set, an arbitrary scale can be specified. For example, if a map on the smallest scale is specified, it can overlook a wide range of area and therefore the entire planed route can easily be grasped.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: October 23, 2001
    Assignee: Jatco Corporation
    Inventor: Shinichi Hasegawa
  • Patent number: 6199012
    Abstract: A group of maps corresponding to the present position detected by a position detection unit is retrieved from a storage unit. Also, a map on the same scale as a map being displayed is extracted from the retrieved group of maps. If there is an overlapped portion between the extracted map and the map being displayed, they are displayed with the overlapped portion held. With this, both the map being displayed and the extracted map can be displayed as if they were continuous to each other, and the present-position mark can be displayed without being jumped considerably.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: March 6, 2001
    Assignee: Jatco Corporation
    Inventor: Shinichi Hasegawa
  • Patent number: 6087597
    Abstract: An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, the first pad facing the second pad; a rigid spherical core interposed between the first and second pads; and solder connecting the first and second pads. The first substrate has a through-hole which is provided through the first substrate at a position of the first pad, at least a part of the solder is positioned in the through-hole and at least a part of the spherical core is received in the through-hole. The through-hole has an inner wall which is continuously tapered from the first surface of the first substrate to the second surface of the first substrate.
    Type: Grant
    Filed: July 24, 1995
    Date of Patent: July 11, 2000
    Assignee: NEC Corporation
    Inventors: Yuzo Shimada, Yoshimasa Tanaka, Shinichi Hasegawa, Takayuki Suyama
  • Patent number: 5976910
    Abstract: An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.
    Type: Grant
    Filed: June 2, 1998
    Date of Patent: November 2, 1999
    Assignee: NEC Corporation
    Inventors: Koetsu Tamura, Shinichi Hasegawa
  • Patent number: 5923535
    Abstract: An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: July 13, 1999
    Assignee: NEC Corporation
    Inventors: Yuzo Shimada, Takayuki Suyama, Shinichi Hasegawa
  • Patent number: 5906429
    Abstract: An optical illumination device reflects and condenses light from a mercury-arc lamp by a light reflecting and condensing member and then reflects and deflects the light, thereafter the reflected and deflected light is transferred to a relay-lens system through a collimator lens or input lens, band-pass filter and fly-eye lens. Gas from which impurities are removed by a filter is flown around optical elements to separate the optical elements from air containing material causing clouding of the optical elements to thereby restrain clouding of the optical elements. On the other hand, or in addition, the reflectance of the light reflecting and condensing member and/or miller for the light of the absorption band of sulfur dioxide is made small to prevent the optical elements from clouding.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: May 25, 1999
    Assignee: Nikon Corporation
    Inventors: Takashi Mori, Jin Yamada, Jun Nagatsuka, Shinichi Hasegawa, Shigeru Hagiwara
  • Patent number: 5896276
    Abstract: An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.
    Type: Grant
    Filed: August 30, 1995
    Date of Patent: April 20, 1999
    Assignee: NEC Corporation
    Inventors: Koetsu Tamura, Shinichi Hasegawa
  • Patent number: 5731630
    Abstract: A tape carrier for increasing the number of terminals between the tape carrier and a substrate includes a film, a lead, a terminal and a connection. The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions. The lead is provided on the first surface of the film and extends above the opening of the film. The lead is coupled to the device at the opening of the film when the device is received by the first surface of the film. The terminal is provided on the second surface in the first region of the film. The connection connects the lead to the terminal. The lead and the device are connected together by thermocompression bonding with a thermode inserted into the opening of the film.
    Type: Grant
    Filed: March 14, 1995
    Date of Patent: March 24, 1998
    Assignee: NEC Corporation
    Inventors: Takayuki Suyama, Shinichi Hasegawa
  • Patent number: 5699610
    Abstract: In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: December 23, 1997
    Assignee: NEC Corporation
    Inventors: Yuzo Shimada, Takayuki Suyama, Yoshimasa Tanaka, Shinichi Hasegawa
  • Patent number: 5502608
    Abstract: In a tape cassette having a case with a mouth for receiving a magnetic head drum of a recording/reproducing apparatus and containing a recording tape wound on rotatable reels and including a tape run extending across the mouth; a front lid is pivotally supported on side walls of the case so as to be movable between a closed position covering a front opening of the mouth and opened position to uncover the tape run, and upper lid is pivotally joined at its front edge to the upper edge portion of the front lid so as to be movable between a closed position to covering a top opening of the mouth and opened position to uncover the top opening, and a slide shutter is supported on the case for sliding between a closed position covering a bottom opening of the mouth and opened position to uncover such bottom opening. The mouth across which a run of the recording tape extends can be closely covered by the front lid, the upper lid and the slide shutter when the tape cassette is not in use.
    Type: Grant
    Filed: September 28, 1994
    Date of Patent: March 26, 1996
    Assignee: Sony Corporation
    Inventors: Yoichirou Senshu, Shuichi Ota, Hiroshi Fujii, Akihiro Uetake, Takashi Sawada, Shinichi Hasegawa, Kazuyoshi Suzuki, Tetsuro Morii
  • Patent number: 5453892
    Abstract: In a digital magnetic recording and/or reproducing apparatus, a magnetic head comprises a plurality of head chips mounted closely together in parallel with each other on a rotary drum member which is rotatably supported by dynamic pressure bearing in which a sleeve and a shaft inserted therein are relatively rotatably supported by fluid under pressure therebetween.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: September 26, 1995
    Assignee: Sony Corporation
    Inventors: Shinichi Hasegawa, Yoichirou Senshu, Kenichi Fukahori, Akihiro Uetake
  • Patent number: 5438468
    Abstract: An rotary drum head for recording and/or reproducing a signal on slanted tracks formed on a magnetic tape. A chassis is provided with a rotary head drum unit having a lower stationary drum mounted on the chassis in an inclined position. A rotary drum is rotatably and coaxially mounted above the lower stationary drum. A transducer is mounted on a periphery of the rotary drum. A motor rotates the rotary drum. An upper stationary drum is coaxially mounted above the rotary drum wherein an upper portion of the upper stationary drum at the farther side from the chassis is cut so that total height of the rotary head drum unit is reduced.
    Type: Grant
    Filed: April 12, 1994
    Date of Patent: August 1, 1995
    Assignee: Sony Corporation
    Inventors: Shinichi Hasegawa, Akihiro Uetake
  • Patent number: 5426849
    Abstract: A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: June 27, 1995
    Assignee: NEC Corporation
    Inventors: Kohji Kimbara, Shinichi Hasegawa, Hisashi Ishida
  • Patent number: 5424889
    Abstract: A rotary magnetic head drum arrangement comprises a lower fixed drum with an upper rotatable drum mounted thereon. A head base member is mounted in a base portion of the upper rotatable drum such that a flexible head mounting portion of the head base member is positioned across a fulcrum. A pairing adjustment screw is provided at a predetermined adjustment point for exerting pressure on the head mounting portion at a point thereon remote from the fulcrum for changing a position of a magnetic head secured on the head mounting portion. A distance between the fulcrum and the adjustment point is made to be longer than a distance between the fulcrum and the head on the head mounting portion.
    Type: Grant
    Filed: June 20, 1994
    Date of Patent: June 13, 1995
    Assignee: Sony Corporation
    Inventor: Shinichi Hasegawa
  • Patent number: 5414632
    Abstract: In system and method for predicting an occurrence of failure in a machine tool, at least one monitor data (for example, position deviation variable of a tool with respect to a target position of the tool as a result of rotation of a servomotor) which is changed according to an operating situation in a series of working processes in the machine tool is detected, a prediction level of failure against the monitor data is set, the prediction level being set according to the operating situation, a comparison period of time is set according to the series of the working processes, the monitor data detected is compared with the prediction level set during a predetermined one of the series of working processes of the machine tool set as the comparison period of time, a failure prediction signal is output when the value of the monitor data exceeds the prediction level, and the prediction of the occurrence of failure is informed through a CRT on the basis of the received failure prediction signal.
    Type: Grant
    Filed: March 5, 1992
    Date of Patent: May 9, 1995
    Assignee: Jatco Corporation
    Inventors: Yasumasa Mochizuki, Tomoaki Yoshino, Shinichi Hasegawa, Masakazu Sano
  • Patent number: 5392180
    Abstract: A magnetic head drum of a helical-scan type for a data record/read apparatus comprises upper and lower stationary drums securely mounted on a stationary spindle, a rotary drum rotatably supported on the spindle, and a motor for rotating the rotary drum around the spindle. The motor comprises a rotor secured to the rotary drum, a stator secured to the upper drum, and a back yoke supported on the rotor. The upper drum is accomodated within the rotary drum in radially remote relationship thereto. The stator is electrically connected to a flexible circuit board by a connecting arrangement mounted on the upper drum.
    Type: Grant
    Filed: May 15, 1992
    Date of Patent: February 21, 1995
    Assignee: Sony Corporation
    Inventor: Shinichi Hasegawa
  • Patent number: 5390870
    Abstract: A recording medium cassette being easily miniaturized if necessary, and a recording and/or reproducing apparatus, such as a VTR, adapted to use the same recording medium cassette. The recording medium cassette includes a printed wiring board having a plurality of information indicating contacts and which is fixed to the bottom wall of a case of the recording medium cassette so that the information indicating contacts are accessible from outside through slots formed in the bottom wall. The recording and/or reproducing apparatus is provided with a plurality of information detecting contacts respectively corresponding to the information indicating contacts of the recording medium cassette. The information detecting contacts may respectively contact the information indicating contacts upon insertion of the recording medium cassette into the recording and/or reproducing apparatus so as to enable information to be transferred therebetween.
    Type: Grant
    Filed: May 27, 1993
    Date of Patent: February 21, 1995
    Assignee: Sony Corporation
    Inventors: Takashi Sawada, Yoichirou Senshu, Akihiro Uetake, Chiaki Sugai, Shuichi Ota, Hiroshi Fujii, Shinichi Hasegawa, Kazuyoshi Suzuki, Tetsuro Morii
  • Patent number: 5322237
    Abstract: A tape cassette comprises a case body having a mouth formed in the front portion thereof, a front lid pivotally supported thereon so as to cover the open front side of the case body, and a back lid pivotally joined to the front lid so as to cover a space extending behind the substantially lower half of an exposed portion of a magnetic tape in the mouth. The front lid includes a front wall covering the front opening of the mouth, side walls extending backward from the opposite side edges of the front wall, an upper wall covering the upper opening of the mouth, and a back wall extending downward from the upper wall. The side wall is provided with two guide grooves with two round projections projecting from the inner surface of the side wall being respectively received therein. Each of the two guide grooves has the shape of an arc of a circle having its center at the center of an imaginary circle at one end of the other guide groove.
    Type: Grant
    Filed: August 17, 1992
    Date of Patent: June 21, 1994
    Assignee: Sony Corporation
    Inventors: Shuichi Ota, Yoichirou Senshu, Akihiro Uetake, Shinichi Hasegawa, Takashi Sawada, Chiaki Sugai
  • Patent number: RE35950
    Abstract: A recording medium cassette being easily miniaturized if necessary, and a recording and/or reproducing apparatus, such as a VTR, adapted to use the same recording medium cassette. The recording medium cassette includes a printed wiring board having a plurality of information indicating contacts and which is fixed to the bottom wall of a case of the recording medium cassette so that the information indicating contacts are accessible from outside through slots formed in the bottom wall. The recording and/or reproducing apparatus is provided with a plurality of information detecting contacts respectively corresponding to the information indicating contacts of the recording medium cassette. The information detecting contacts may respectively contact the information indicating contacts upon insertion of the recording medium cassette into the recording and/or reproducing apparatus so as to enable information to be transferred therebetween.
    Type: Grant
    Filed: March 18, 1996
    Date of Patent: November 10, 1998
    Assignee: Sony Corporation
    Inventors: Takashi Sawada, Yoichirou Senshu, Akihiro Uetake, Chiaki Sugai, Shuichi Ota, Hiroshi Fujii, Shinichi Hasegawa, Kazuyoshi Suzuki, Tetsuro Morii