Abstract: An IC socket that is capable of obtaining stable, reliable electrical connections between an IC package and a socket housing, even in the case that the IC package is placed at a position shifted from a predetermined position on the socket housing then pressed, during connection of the IC package, without grinding down the peripheral wall of a mounting surface, onto which the IC package is mounted. Metal plates, for guiding the IC package, are provided on at least a portion of the peripheral wall that surrounds the mounting surface of the socket housing. The metal plates are of a shape such that they are coplanar with or protrude upward from an upper surface of the peripheral wall, and such that they are coplanar with or protrude inward from an inner surface of the peripheral wall.

Abstract: An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.

Abstract: An ultrasonic probe has a probe proper, a connector and a cable for electrically connecting between the probe proper and the connector. The probe proper includes a transducer that converts between ultrasonic wave and electricity, and a phase change member having a property to cause a phase change of from solid to liquid at a particular temperature reached in an operation time period of the transducer and a phase change of from liquid to solid at lower than the particular temperature.

Abstract: An ultrasonic probe includes a plurality of transducers arranged in XY directions, a plurality of backing members stacked along the X or Y direction, in back of the transducers, and a plurality of heat conductive sheets sandwiched between the plurality of backing members and higher in heat conductivity than the backing members.

Abstract: An IC socket includes an insulative housing having an IC package receiving recess, in which an IC package is received. Contacts are disposed within cavities, which are provided in the IC package receiving recess in a matrix arrangement. Each contact includes a base which is installed into a cavity, an upwardly extending contact arm, which is offset above a cavity and a downwardly extending terminal portion, for electrically connecting with a circuit board. The insulative housing includes first partition walls which are provided between rows of cavities adjacent to each other in the first direction and second partition walls which are provided between rows of cavities adjacent to each other in a second direction perpendicular to the first direction, the first partition walls having greater heights than those of the second partition walls.

Abstract: Deformation of a socket housing during connection of an IC package is prevented, and reliable electrical connections are secured in an IC socket assembly. The IC socket assembly is constituted by a plurality of electrical contacts; an insulative socket housing for holding the electrical contacts arranged in a matrix; a reinforcing plate having an opening at its center, through which the electrical contacts are exposed, for supporting the lower portion of the socket housing; a cover member, which is rotatably supported by the reinforcing plate, for cooperating with the reinforcing plate to sandwich and hold the IC package therebetween and to press the IC package against the electrical contacts; and reinforcing beams, which are supported by the reinforcing plate and provided across opposing edges of the opening, for supporting the socket housing.

Abstract: The dimension of the main field as a unit region for exposure is set to an integral submultiple of the arrangement pitch of the LSI to be exposed, by the control computer 62, and the exposure data stored in the form associated with electron beams from a data generation circuit 64 is limited to one-chip data alone in units of a stripe. This data is repeatedly read out to write the stripe. Further, a storage circuit 66 is provided to store the exposure data by means of a double buffer memory unit for each electron beam. While LSI is written according to one of the buffers, the next exposure stripe data is prepared on the other buffer, thereby bringing about a substantial reduction in the required speed of the exposure data generation circuit.

Abstract: An ultrasonic probe comprises a transducer part, a heat-receiving part, a refrigeration unit and a cable unit. The cable unit includes a signal line, a refrigerant supply tube, a refrigerant ejection tube and a heat insulator. The heat-receiving part absorbs heat generated from the transducer part. The refrigerant supply tube supplies a refrigerant from the refrigeration unit to the heat-receiving part. The refrigerant ejection tube sends the refrigerant for ejecting heat of the heat-receiving part to the refrigeration unit. The heat insulator is arranged around the refrigerant supply tube. A set of the refrigerant supply tube, the refrigerant ejection tube and the heat insulator is arranged at a center of the cable unit substantially while the signal line is arranged around at least one of the refrigerant supply tube, the refrigerant ejection tube and the heat insulator.

Abstract: A power saving method and device capable of dynamically select an appropriate power saving mode according to operation states of a computer system. When a power saving system task 15 detects that an execution queue 132 does not contain any executable user task and the computer system has entered an idle state, a power saving transition check module 154 checks if an event queue 131 contains a timer-expiration-waiting event. Depending upon whether or not the timer-expiration-waiting event is present, the computer system moves from a normal operation mode to a first or a second power saving operation mode, each power saving operation mode having its own power saving effect. A power saving mode release module 231 of an interrupt handler 23 returns the system from the first or second power saving operation mode to the normal operation mode in response to an occurrence of an interrupt. For example, in the first power saving operation mode, the CPU operation clock is stopped.

Abstract: A land grid array socket comprises an insulative housing having a plurality of contacts. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts. A lever is pivotally mounted on a second end of the insulative housing. The lever has a locking portion for locking the cover member in the closed position. A metallic reinforcing plate is positioned on a bottom surface of the housing. The metallic reinforcing plate extends between the first end and the second end of the insulative housing.

Abstract: An integrated circuit socket comprises an insulative housing having an integrated circuit package receiving recess provided with a plurality of contact receiving openings arranged in a matrix. Contacts are arranged in the contact receiving openings. Each of the contacts has a base fixed to the contact receiving opening and a contact arm that extends away from the base. The contact arm has a contact portion with a contact point at an uppermost end. The contact portion overlaps with the contact arm of an adjacent one of the contacts. First partition walls separate the contact receiving openings in a direction substantially perpendicular to a direction in which the contact arms extend. The uppermost ends are arranged below tops of the first partition walls.

Abstract: A multi-electron beam exposure method and apparatus, wherein electron beams are applied to a sample surface mounted on a traveling sample stage to perform repeated exposure of chip patterns. An exposure region of the sample surface is partitioned into multiple stripe regions having a width in an x-axis direction, and each of the multiple stripe regions is further partitioned into multiple main fields having a width in a y-axis direction. At least one of the widths of the main fields in the x- and y-axis directions is set to a value, and exposure pattern data for one chip based on the partitioned main fields is stored as a unit. The stored exposure pattern data is readout a number of times corresponding to the number of chips repeatedly, and each electron beam provides repeated exposure of same regions of the chips.

Abstract: The electrical connector of the present invention has an insulative housing having a first face across from a first electrical circuit and a second face across from a second electrical circuit. A plurality of contacts are mounted in the insulative housing, each of which contacts a contact point of the first electrical circuit at the first face, and contacts a contact point of the second electrical circuit at the second face, thereby interconnecting the first and second circuits. Each of the contacts has one portion of the contact supported by the insulative housing so as to be capable of pivoting in response to the displacement of the first contact portion and the second contact portion.

Abstract: A land grid array socket contact has a resilient contact that extends parallel to a base plate and is attached to at least one side walls of the base plate by a curved section angled approximately 180 degrees from the at least one side wall. The resilient contact has a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board. In another embodiment, the land grid array socket contact has a resilient contact extending from an upper end of a base plate. The resilient contact has an elongated slit substantially in a center of the resilient contact with respect to a direction of width and a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board.

Abstract: A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.

Abstract: A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.

Abstract: An IC socket that is capable of obtaining stable, reliable electrical connections between an IC package and a socket housing, even in the case that the IC package is placed at a position shifted from a predetermined position on the socket housing then pressed, during connection of the IC package, without grinding down the peripheral wall of a mounting surface, onto which the IC package is mounted. Metal plates, for guiding the IC package, are provided on at least a portion of the peripheral wall that surrounds the mounting surface of the socket housing. The metal plates are of a shape such that they are coplanar with or protrude upward from an upper surface of the peripheral wall, and such that they are coplanar with or protrude inward from an inner surface of the peripheral wall.

Abstract: An electrical connector has an insulative housing with an engagement portion provided with contacts. A shield member is mounted to an exterior of the insulative housing and is connected to a circuit board. Guide posts protrude from a surface of the insulative housing for facilitating engagement of the electrical connector with a mating connector. The guide posts have tips positioned further from the insulative housing than the engagement portion. Conductive members are arranged on the tips of the guide posts. The conductive members facilitate electrostatic discharge with the mating connector and have retention legs connected to the circuit board independently from the shield member.

Abstract: A card connector comprises a contact housing, a frame attached thereto configured to guide a card during insertion and removal, a pivoting arm pivotally disposed on the housing to eject the card, and an ejection mechanism disposed on the side of the frame configured to pivot the pivoting arm. The ejection mechanism comprises a first bar which has a button on one end and an engaging arm on the other end, a second bar which has a first engaging part on one end that selectively engages the engaging arm when the card is to be ejected and a second engaging part on the other end that engages with the pivoting arm, a cover supporting the first bar and second bar and allowing the bars to move in the forward-rearward direction, and forcing means that force the first bar rearward. The first bar and second bar are aligned with one another along a side wall of the frame. A locking projection on the frame engages the engaging arm preventing rearward retraction of the first bar.

Abstract: An electrical connector has an insulative housing with a mounting surface that is inclined at a predetermined angle with respect to a plane perpendicular to an engagement direction with another connector. A plurality of contacts is arranged in the insulative housing. Each contact has a tine that extends parallel to the engagement direction for insertion into through-holes of a circuit board. An aligning member is attached to the insulative housing. The aligning member has a plurality of apertures for receiving and aligning the tines and standoffs that reduce bending stress applied to the tines. The standoffs abut the circuit board so that the aligning member inclines at an angle less than the predetermined angle when the insulative housing is mounted on the circuit board to reduce bending stress applied to the tines.