Abstract: A semiconductor device includes first and second processor cores configured to perform a lock step operation and including first and second scan chains. The semiconductor device further includes a scan test control unit that controls a scan test of the first and second processor cores using the first and second scan chains, and a start-up control unit that outputs a reset signal for bringing the first and second processor cores into a reset state. The start-up control unit outputs an initialization scan request before the start of a lock step operation, and the scan test control unit performs an initialization scan test operation on the first and second processor cores by using an initialization pattern.

Abstract: In a hybrid inflator, a housing houses a gas generator to generate a combustion gas in a housing recessed portion on a bottom portion side. A lid body provided at an outflow port of the housing and a lid body provided at a sealed portion side of a pressurized gas in a bottle in a gas discharge port portion separate the sealed portion of the pressurized gas in the bottle from outside. When the hybrid inflator is activated, the two lid bodies are broken by generation of the combustion gas from the gas generator, and whereby the pressurized gas is discharged from a discharge port of the gas discharge port portion. The gas generator is detachably assembled to the housing with respect to the housing recessed portion of the housing.

Abstract: The present invention is to enable a user to input authentication information without burden, such that the user only has to memorize part of the authentication information even when inputting lengthy authentication information in order to ensure high-level security. When an operation of inputting and arranging authentication information in an information arrangement region is performed in a state where an arrangement status of a specified portion in the information arrangement region is set in advance as partial-authentication reference information in a reference authentication information memory, a CPU detects an arrangement status of the specified portion from an overall arrangement status in the information arrangement region, and performs, as partial authentication, processing of matching the detected arrangement status of the specified portion and the arrangement status of the specified portion set as the partial-authentication reference information.

Abstract: An inflator includes in a combustion chamber a first gas generating charge and a second gas generating charge to be ignited and burned to generate an inflation gas. The second gas generating charge is slower in speed of combustion than the first gas generating charge. The inflator further includes a partition wall that segregates the first and second gas generating charges. The partition wall is located away from an ignition area of an ignition device that ignites the first gas generating charge, with the first gas generating charge located between itself and the ignition area. The partition wall is burnable to destruction by the fire generated by combustion of the first gas generating charge so as to permit propagation of the fire to the second gas generating charge by its generally entire area.

Abstract: An inflator includes in a combustion chamber a first gas generating charge and a second gas generating charge to be ignited and burned to generate an inflation gas. The second gas generating charge is slower in speed of combustion than the first gas generating charge. The inflator further includes a partition wall that segregates the first and second gas generating charges. The partition wall is located away from an ignition area of an ignition device that ignites the first gas generating charge, with the first gas generating charge located between itself and the ignition area. The partition wall is burnable to destruction by the fire generated by combustion of the first gas generating charge so as to permit propagation of the fire to the second gas generating charge by its generally entire area.

Abstract: A gas generator (1A) comprising: an ignition chamber (13) in which an igniter (12) and an enhancer agent (14) stored therein; a first combustion chamber (23) and a second combustion chamber (33) in which gas generating agent (24, 34) stored therein respectively; a first transfer path (15) communicating the ignition chamber (13) with the first combustion chamber (23); and a second transfer path (16) communicating the ignition chamber (13) with the second combustion chamber (33). The first transfer path (15) and second transfer path (16) are disposed to be displaced in parallel such that a center line (15a) of the first transfer path (15) and a center line (16a) of the second transfer path (16) do not overlap on the same straight line. Because of such a configuration, in a gas generator having two or more gas output portions driven by one igniter, it becomes possible that an effect of combustion of a gas generating agent in each combustion chamber is substantially or completely independent.

Abstract: A gas generator (1A) comprising: an ignition chamber (13) in which an igniter (12) and an enhancer agent (14) stored therein; a first combustion chamber (23) and a second combustion chamber (33) in which gas generating agent (24, 34) stored therein respectively; a first transfer path (15) communicating the ignition chamber (13) with the first combustion chamber (23); and a second transfer path (16) communicating the ignition chamber (13) with the second combustion chamber (33). The first transfer path (15) and second transfer path (16) are disposed to be displaced in parallel such that a center line (15a) of the first transfer path (15) and a center line (16a) of the second transfer path (16) do not overlap on the same straight line. Because of such a configuration, in a gas generator having two or more gas output portions driven by one igniter, it becomes possible that an effect of combustion of a gas generating agent in each combustion chamber is substantially or completely independent.

Abstract: A gas generator including an approximately cylindrical housing including an ignition chamber, first and second combustion chambers, and first and second discharge paths. The ignition chamber, disposed in a base portion of the housing, includes an igniter and an enhancer agent. The first and second combustion chambers, disposed respectively in first and second cylindrical portions of the housing, each contains gas generating agent. The first and second discharge paths are disposed respectively on front end sides of the first and second cylindrical portions of the housing and enable gases generated in the first and second combustion chambers to be discharged from the housing therethrough. The inner diameters of the first and second combustion chambers are regulated to differ from each other. Thereby, outputs in respective gas output portions can be made to differ, while size increase and slower start-up of gas output in each gas output portion are prevented.

Abstract: The present invention relates to an adhesive film capable of preventing damage to a non-metal-film-formed surface when forming a metal film on a semiconductor wafer and further capable of reducing contamination on the wafer surface. The adhesive film comprises a base film laminated with at least one film layer having a gas transmission rate of not more than 5.0 cc/m2·day·atm with an adhesive layer formed on one surface thereof. By protecting the non-metal-film-formed surface, a washing step using a solvent can be omitted and contamination on the non-metal-film-formed surface can also be reduced, thus resulting in enhancement of productivity and workability.

Abstract: The present invention relates to a surface protecting adhesive film for a semiconductor wafer in which an adhesive layer having a storage elastic modulus from 1×105 Pa to 1×107 Pa at 150° C. and a thickness of from 3 ?m to 100 ?m is formed on both a surface and back surface of a base film having a melting point of at least 200° C. and a thickness of 10 ?m to 200 ?m. According to the present invention, in a step of grinding the back side of a semiconductor wafer and removing a damaged layer generated on the back side, the semiconductor wafer can be prevented from being broken and being contaminated and the like even if a semiconductor wafer is thinned as low as 100 ?m.

Abstract: A surface protecting adhesive film for a semiconductor wafer in which an adhesive layer is formed on one surface of a base film, wherein the adhesive layer comprises 100 weight parts of a polymer (A) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from ?50° C. to 5° C. at which tan ? of a dynamic viscoelasticity is maximized, from 10 weight parts to 100 weight parts of a polymer (B) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from more than 5° C. to 50° C. at which tan ? of a dynamic viscoelasticity is maximized, and from 0.

Abstract: The present invention is to provide a surface protecting film for a semiconductor wafer which can prevent breakage of the semiconductor wafer even when the semiconductor wafer is thinned to not more than 200 ?m, and a method of protecting the semiconductor wafer using the protecting film. The present invention relates to a surface protecting adhesive film for a semiconductor wafer comprising a base film having an adhesive layer formed on one surface thereof, wherein the base film comprises a layer (A) having a storage elastic modulus of from 1×107 Pa to 1×109 Pa at a temperature range of from 20° C. to 180° C.

Abstract: A surface protecting adhesive film for a semiconductor wafer in which an adhesive layer is formed on one surface of a base film, wherein the adhesive layer comprises 100 weight parts of a polymer (A) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from ?50° C. to 5° C. at which tan ? of a dynamic viscoelasticity is maximized, from 10 weight parts to 100 weight parts of a polymer (B) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from more than 5° C. to 50° C. at which tan ? of a dynamic viscoelasticity is maximized, and from 0.

Abstract: The present invention relates to a surface protecting adhesive film for a semiconductor wafer in which an adhesive layer having a storage elastic modulus from 1×105 Pa to 1×107 Pa at 150° C, and a thickness of from 3 ?m to 100 ?m is formed on both a surface and back surface of a base film having a melting point of at least 200° C. and a thickness of 10 ?m to 200 ?m. According to the present invention, in a step of grinding the back side of a semiconductor wafer and removing a damaged layer generated on the back side, the semiconductor wafer can be prevented from being broken and being contaminated and the like even if a semiconductor wafer is thinned as low as 100 ?m.

Abstract: An object of the present invention is to provide a surface protecting adhesive film for a semiconductor wafer having excellent adhesive properties, breakage resistance and stain resistance. According to the invention, provided is a surface protecting adhesive film for a semiconductor wafer in which at least one layer of an intermediate layer and an adhesive layer are provided on one surface of a base film, a minimum value (G′ min) of storage elastic modulus of an adhesive layer (B) at from 50° C. to 100° C. is from 0.07 MPa to 5 MPa, storage elastic modulus of at least one layer (C) of the intermediate layer at 50° C. is from 0.001 MPa to less than 0.

Abstract: This invention relates to a screw stopper including an anti-freeze device used for water pipe valve and fitted to the lower end portion of an open/close movable valve of said water pipe valve comprises: a small perforation penetrated centrally on the lower portion of the said screw stopper; a water-through recess formed on a countersink portion of the said screw stopper; a small movable member including a small valve for opening and closing an aperture of the said small perforation, and said small movable member partially defining an water-through passage; a pair of springs for holding said small movable member, at least of which is made of shape-memory alloy; an outer cylinder for holding said pair of springs screwed and fitted to the said screw stopper; and a packing for sealing up water by a valve seat.

Abstract: Described is a belt buckle to which may be attached a tool in the form of a flat plate. The buckle body is formed by a fitting case and a base plate mounted to the rear surface of the fitting case. A leaf spring is mounted in the buckle body for pressingly holding the tool in the housed state. The plate spring has a pair of short strips for acting on the central part of the tool and a long strip for acting on the inner end of the tool. The upper and lower sides of the foremost portions of the fitting case are bent back to provide an engaging portion for preventing inadvertent withdrawal of the tool from the buckle body. When withdrawing the tool housed in the buckle body, it is only necessary to apply finger pressure on the end of the tool exposed through the central end notch of the fitting case.

Abstract: A belt buckle to which a plate-like tool can be attached. The belt buckle is constructed of a base plate and a fitting case covering the front side of the base plate so that a fitting space for fitting the tool therein is formed inbetween. In the fitting space, on the other hand, there is mounted a locking plate for holding the tool under its fitted condition. This locking plate is constructed of a retaining portion, which is made engageable with the engagement opening of the tool, and a pressure portion for pushing the back of the tool under its engaging condition to the front. When the tool is to be taken out of the fitting space, a finger is inserted through the aperture of the fitting case thereby to inwardly push the retaining portion of the locking plate so that the tool is extracted under the condition in which the retaining portion is disengaged to the back from the engagement opening of the tool.