Patents by Inventor Shinichi Hayasaka

Shinichi Hayasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050271238
    Abstract: A speaker device is coaxial type two-way speaker, and includes speaker units for low-frequency band reproduction and for high-frequency band reproduction respectively. The speaker unit for low-frequency band reproduction includes a vibration system such as a resin frame and a magnetic circuit system such as a yoke. The resin frame has a mounting portion onto which the magnetic circuit system is mounted, and an annular projecting portion supporting a bottom surface of the yoke is formed on the upper surface of the mounting portion. Since the bottom surface of the yoke is supported only by the projecting portion, not by the entire bottom surface of the resin frame, even when flatness of the bottom surface of the resin frame is insufficient or different, the yoke can be horizontally mounted.
    Type: Application
    Filed: March 22, 2005
    Publication date: December 8, 2005
    Inventors: Hiroyuki Kobayashi, Kenichi Kasahara, Shinichi Hayasaka, Toshihiro Hikichi
  • Publication number: 20050271236
    Abstract: A speaker device includes speaker units for high-frequency band reproduction and for low-frequency band reproduction and a supporting member. fixed to an opening of a center pole of the speaker unit for low-frequency band reproduction, serves as a lower frame of the speaker unit for low-frequency band reproduction, and has a frame portion onto which an upper end surface and engaging claws are formed. The speaker unit for high-frequency band reproduction has a frame portion, a magnetic circuit system, an upper frame, a diaphragm having an edge portion and a cover. On the upper frame, an engaging recess portion is formed, and at the outer peripheral edge portion of the diaphragm, a recess portion corresponding to the engaging recess portion is formed. The upper frame is fixed onto the upper surface of the magnetic circuit system, and the diaphragm is fixed onto the upper frame, respectively.
    Type: Application
    Filed: March 23, 2005
    Publication date: December 8, 2005
    Inventors: Hiroyuki Kobayashi, Kenichi Kasahara, Shinichi Hayasaka, Toshihiro Hikichi
  • Publication number: 20050253298
    Abstract: A method for manufacturing an electroacoustic transducer diaphragm of a multilayered structure which includes a first diaphragm layer made from a synthetic resin material and molded into a predetermined shape through injection molding, and a second diaphragm layer laminated in close contact with the first diaphragm layer and made from a material differing from that of the first diaphragm layer, the method includes inserting the second diaphragm layer into a mold for injection molding, the second diaphragm layer being made of not-yet-molded woven fabric or woven fabric molded previously into a predetermined shape of a diaphragm, and injecting the synthetic resin material which is to be molded into the first diaphragm layer into the mold for injection molding, thereby forming the first diaphragm layer integrally with the second diaphragm layer.
    Type: Application
    Filed: May 12, 2005
    Publication date: November 17, 2005
    Inventors: Koji Takayama, Masatoshi Sato, Shinichi Hayasaka, Hiroyuki Kobayashi
  • Publication number: 20050253299
    Abstract: A method for manufacturing an electroacoustic transducer diaphragm of a multilayered structure which includes a first diaphragm layer made from a synthetic resin material and molded into a predetermined shape through injection molding, and a second diaphragm layer laminated in close contact with the first diaphragm layer and made from a material differing from that of the first diaphragm layer, the method includes inserting the second diaphragm layer into a mold for injection molding, and forming the first diaphragm layer integrally with the second diaphragm layer by injection foam-molding within the injection mold.
    Type: Application
    Filed: May 13, 2005
    Publication date: November 17, 2005
    Inventors: Koji Takayama, Masatoshi Sato, Shinichi Hayasaka, Hiroyuki Kobayashi
  • Publication number: 20050248058
    Abstract: A method for manufacturing a diaphragm for use in an electroacoustic transducer in a multi-layer structure which includes a first diaphragm layer of synthetic resin molded in a predetermined shape by injection molding and a second diaphragm layer layered in intimate contact on the first diaphragm layer and made of substance different from the first diaphragm layer, includes executing successively a pre-molding step and an injection-molding step, thereby providing the multi-layer structure. The pre-molding step includes attaching a non-molded sheet-like material which is a raw material of the second diaphragm layer to a mating surface of one of the die part of an injection molding die, and closing thereafter the injection molding die to give the sheet-like material a predetermined diaphragm shape. The injection molding step includes injecting synthetic resin material constituting the first diaphragm layer into the injection molding die thus closed thereby to form the first diaphragm layer.
    Type: Application
    Filed: April 26, 2005
    Publication date: November 10, 2005
    Inventors: Koji Takayama, Masatoshi Sato, Shinichi Hayasaka, Hiroyuki Kobayashi
  • Publication number: 20050207608
    Abstract: A speaker gasket formed in a required shape out of elastic materials such as rubber has a plurality of bolt-through holes formed at regular intervals. The speaker gasket is formed with varying thicknesses, for example, in a such manner that the central portion in the width direction is formed with thickness greater or smaller than that of the portions on either side of the central portion; a plurality of recesses are formed; or the surfaces of the speaker gasket has a sawtooth waveform in the width direction.
    Type: Application
    Filed: March 17, 2005
    Publication date: September 22, 2005
    Inventors: Hiroyuki Kobayashi, Kenichi Kasahara, Shinichi Hayasaka, Toshihiro Hikichi