Patents by Inventor Shinichi Hidesaka
Shinichi Hidesaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9740105Abstract: A resist pattern formation method including formation of a resist film, exposure, development, and subsequent rinsing using a resist composition containing a high-molecular compound having a constituent unit represented by the formula (a0-1), a constituent unit containing an acid decomposable group whose polarity increases by the action of an acid, and a constituent unit containing a group represented by the formula (a2-r-1). R represents a hydrogen atom, an alkyl group, or a halogenated alkyl group; Ra01 represents a lactone-containing polycyclic group, an —SO2-containing polycyclic group, or a cyano group-containing polycyclic group; Ra?21 represents a hydrogen atom, an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, a hydroxyl group, —COOR?, —OC(?O)R?, a hydroxyalkyl group, or a cyano group; R? represents a hydrogen atom or an alkyl group; and n? represents an integer of from 0 to 2.Type: GrantFiled: September 20, 2013Date of Patent: August 22, 2017Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Yoichi Hori, Shinichi Hidesaka, Takeaki Shiroki
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Publication number: 20140093827Abstract: A resist pattern formation method including formation of a resist film, exposure, development, and subsequent rinsing using a resist composition containing a high-molecular compound having a constituent unit represented by the formula (a0-1), a constituent unit containing an acid decomposable group whose polarity increases by the action of an acid, and a constituent unit containing a group represented by the formula (a2-r-1). R represents a hydrogen atom, an alkyl group, or a halogenated alkyl group; Ra01 represents a lactone-containing polycyclic group, an —SO2-containing polycyclic group, or a cyano group-containing polycyclic group; Ra?21 represents a hydrogen atom, an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, a hydroxyl group, —COOR?, —OC(?O)R?, a hydroxyalkyl group, or a cyano group; R? represents a hydrogen atom or an alkyl group; and n? represents an integer of from 0 to 2.Type: ApplicationFiled: September 20, 2013Publication date: April 3, 2014Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Yoichi Hori, Shinichi Hidesaka, Takeaki Shiroki
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Patent number: 8367297Abstract: A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) containing a compound having a cation moiety represented by general formula (I) (in the formula, R5 represents a hydrogen atom or an organic group of 1 to 30 carbon atoms which may have a substituent; and Q5 represents a single bond or a divalent linking group).Type: GrantFiled: December 9, 2009Date of Patent: February 5, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akiya Kawaue, Yoshiyuki Utsumi, Shinichi Hidesaka, Natsuko Maruyama
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Patent number: 7927780Abstract: A compound represented by formula (I); and a compound represented by formula (b1-1): wherein X represents —O—, —S—, —O—R3— or —S—R4—, wherein each of R3 and R4 independently represents an alkylene group of 1 to 5 carbon atoms; R2 represents an alkyl group of 1 to 6 carbon atoms, an alkoxy group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, a halogen atom, a hydroxyalkyl group of 1 to 6 carbon atoms, a hydroxyl group or a cyano group; a represents an integer of 0 to 2; Q1 represents an alkylene group of 1 to 12 carbon atoms or a single bond; Y1 represents an alkylene group of 1 to 4 carbon atoms or a fluorinated alkylene group; M+ represents an alkali metal ion; and A+ represents an organic cation.Type: GrantFiled: September 10, 2008Date of Patent: April 19, 2011Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akiya Kawaue, Takeshi Iwai, Hideo Hada, Shinichi Hidesaka, Tsuyoshi Kurosawa, Natsuko Maruyama, Kensuke Matsuzawa, Takehiro Seshimo, Hiroaki Shimizu, Tsuyoshi Nakamura
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Patent number: 7858286Abstract: A positive resist composition and method for forming a resist pattern are provided which enable a resist pattern with excellent shape to be obtained.Type: GrantFiled: April 7, 2006Date of Patent: December 28, 2010Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Yohei Kinoshita, Makiko Irie, Waki Ohkubo, Yusuke Nakagawa, Shinichi Hidesaka
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Patent number: 7781144Abstract: The present invention is a positive resist composition and a resist pattern forming method including a resin component (A) which has a polymer compound (A1) having a structural units (a1) including an acetal type acid dissociable, dissolution inhibiting group, a structural unit (a2) derived from an acrylate ester having a lactone-containing polycyclic group, and a structural unit (a3) derived from an acrylate ester having a polar group-containing aliphatic hydrocarbon group, and an acid generator component (B) having an onium salt-based acid generator (B1) having a cation portion represented by a general formula (b-1) shown below [wherein, R11 represents an alkyl group, an alkoxy group, a halogen atom or a hydroxyl group; R12 to R13 each represents, independently, an aryl group or the alkyl group that may have substituent group; n? represents either 0 or an integer from 1 to 3].Type: GrantFiled: April 18, 2006Date of Patent: August 24, 2010Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Yohei Kinoshita, Waki Ohkubo, Yusuke Nakagawa, Shinichi Hidesaka, Makiko Irie
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Publication number: 20100196820Abstract: A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) containing a compound having a cation moiety represented by general formula (I) (in the formula, R5 represents a hydrogen atom or an organic group of 1 to 30 carbon atoms which may have a substituent; and Q5 represents a single bond or a divalent linking group).Type: ApplicationFiled: December 9, 2009Publication date: August 5, 2010Inventors: Akiya Kawaue, Yoshiyuki Utsumi, Shinichi Hidesaka, Natsuko Maruyama
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Patent number: 7582406Abstract: A resist composition is obtained by dissolving a resin component (A) that exhibits changed alkali solubility under the action of acid, an oxime sulfonate-based acid generator (B), an amine compound (D) containing at least one alkyl group of 5 to 12 carbon atoms, and an organic acid (E), in an organic solvent (C) containing methyl n-amyl ketone, wherein the component (E) is a dibasic acid.Type: GrantFiled: August 19, 2005Date of Patent: September 1, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Yusuke Nakagawa, Shinichi Hidesaka, Kazuhiko Nakayama
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Publication number: 20090098483Abstract: A positive resist composition and method for forming a resist pattern are provided which enable a resist pattern with excellent shape to be obtained.Type: ApplicationFiled: April 7, 2006Publication date: April 16, 2009Applicant: TOKYO OHA KOGYO CO., LTD.Inventors: Yohei Kinoshita, Makiko Irie, Waki Ohkubo, Yusuke Nakagawa, Shinichi Hidesaka
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Publication number: 20090068591Abstract: A compound represented by formula (I); and a compound represented by formula (b1-1): wherein X represents —O—, —S—, —O—R3— or —S—R4—, wherein each of R3 and R4 independently represents an alkylene group of 1 to 5 carbon atoms; R2 represents an alkyl group of 1 to 6 carbon atoms, an alkoxy group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, a halogen atom, a hydroxyalkyl group of 1 to 6 carbon atoms, a hydroxyl group or a cyano group; a represents an integer of 0 to 2; Q1 represents an alkylene group of 1 to 12 carbon atoms or a single bond; Y1 represents an alkylene group of 1 to 4 carbon atoms or a fluorinated alkylene group; M+ represents an alkali metal ion; and A+ represents an organic cation.Type: ApplicationFiled: September 10, 2008Publication date: March 12, 2009Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akiya Kawaue, Takeshi Iwai, Hideo Hada, Shinichi Hidesaka, Tsuyoshi Kurosawa, Natsuko Maruyama, Kensuke Matsuzawa, Takehiro Seshimo, Hiroaki Shimizu, Tsuyoshi Nakamura
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Publication number: 20090035698Abstract: The present invention is a positive resist composition and a resist pattern forming method including a resin component (A) which has a polymer compound (A1) having a structural units (a1) including an acetal type acid dissociable, dissolution inhibiting group, a structural unit (a2) derived from an acrylate ester having a lactone-containing polycyclic group, and a structural unit (a3) derived from an acrylate ester having a polar group-containing aliphatic hydrocarbon group, and an acid generator component (B) having an onium salt-based acid generator (B1) having a cation portion represented by a general formula (b-1) shown below [wherein, R11 represents an alkyl group, an alkoxy group, a halogen atom or a hydroxyl group; R12 to R13 each represents, independently, an aryl group or the alkyl group that may have substituent group; n? represents either 0 or an integer from 1 to 3].Type: ApplicationFiled: April 18, 2006Publication date: February 5, 2009Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Yohei Kinoshita, Waki Ohkubo, Yusuke Nakagawa, Shinichi Hidesaka, Makiko Irie
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Publication number: 20090004598Abstract: A resist composition is obtained by dissolving a resin component (A) that exhibits changed alkali solubility under the action of acid, an oxime sulfonate-based acid generator (B), an amine compound (D) containing at least one alkyl group of 5 to 12 carbon atoms, and an organic acid (E), in an organic solvent (C) containing methyl n-amyl ketone, wherein the component (E) is a dibasic acid.Type: ApplicationFiled: August 19, 2005Publication date: January 1, 2009Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Yusuke Nakagawa, Shinichi Hidesaka, Kazuhiko Nakayama
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Patent number: 7329478Abstract: To provide a chemical amplification type positive photoresist composition, which has high sensitivity, high heat resistance and high resolution (high contrast) and is capable of suppressing an undulation phenomenon, and a method for formation of a resist pattern, a chemical amplification type positive photoresist composition comprising (A) an alkali soluble resin comprising a hydroxystyrene constituent unit (a1) and a styrene constituent unit (a2), (B) a crosslinking agent, (C) a photo acid generator, and an organic solvent is prepared and a resist pattern is formed by using the same.Type: GrantFiled: May 20, 2004Date of Patent: February 12, 2008Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Yusuke Nakagawa, Shinichi Hidesaka, Kenji Maruyama, Satoshi Shimatani, Masahiro Masujima, Kazuyuki Nitta
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Publication number: 20060003260Abstract: To provide a chemical amplification type positive photoresist composition, which has high sensitivity, high heat resistance and high resolution (high contrast) and is capable of suppressing an undulation phenomenon, and a method for formation of a resist pattern, a chemical amplification type positive photoresist composition comprising (A) an alkali soluble resin comprising a hydroxystyrene constituent unit (a1) and a styrene constituent unit (a2), (B) a crosslinking agent, (C) a photo acid generator, and an organic solvent is prepared and a resist pattern is formed by using the same.Type: ApplicationFiled: May 20, 2004Publication date: January 5, 2006Inventors: Yusuke Nakagawa, Shinichi Hidesaka, Kenji Maruyama, Satoshi Shimatani, Masahiro Masujima, Kazuyuki Nitta
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Patent number: 6551755Abstract: A positive photoresist composition includes (A) an alkali-soluble resin and (B) a photosensitive ingredient, in which the photosensitive ingredient (B) includes an ester of a compound represented by following Formula (I) with a 1,2-naphthoquinonediazidosulfonyl compound: This positive photoresist composition can form a resist pattern mixture including both a dense pattern and an isolation pattern with good shapes and can especially minimize the formation of a back taper shape of an isolation pattern induced by shift of the focus to the minus side.Type: GrantFiled: September 12, 2001Date of Patent: April 22, 2003Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Shinichi Hidesaka, Atsushi Sawano
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Publication number: 20020061458Abstract: A positive photoresist composition includes (A) an alkali-soluble resin and (B) a photosensitive ingredient, in which the photosensitive ingredient (B) includes an ester of a compound represented by following Formula (I) with a 1,2-naphthoquinonediazidosulfonyl compound: 1Type: ApplicationFiled: September 12, 2001Publication date: May 23, 2002Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Shinichi Hidesaka, Atsushi Sawano
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Patent number: 6312863Abstract: A positive photoresist composition includes (A) an alkali-soluble resin, and (B) a photosensitizer including an ester of a 1,2-naphthoquinonediazidesulfonyl compound with a compound of the following formula (I). This positive photoresist composition has satisfactory sensitivity, definition, and depth of focus properties, can form both dense patterns and isolation patterns with good shapes in the formation of mixed resist patterns, and can minimize inverted taper shape formation of isolation resist patterns induced by shifts of focal depth to the minus side.Type: GrantFiled: July 18, 2000Date of Patent: November 6, 2001Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Shinichi Hidesaka, Atsushi Sawano, Kousuke Doi, Hidekatsu Kohara, Toshimasa Nakayama
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Patent number: 5702862Abstract: A positive photoresist coating solution comprising (a) an alkali-soluble resin, (b) a quinone diazide group-containing compound, and (c) an organic solvent in an amount sufficient for dissolving said (a) and (b) components, wherein said organic solvent contains (i) propylene glycol monopropyl ether and (ii) 2-heptanone. The solution of the present invention exhibits excellent coating ability, sensitivity, thermostability, focal depth range, shape-profiling ability, and the like.Type: GrantFiled: January 31, 1997Date of Patent: December 30, 1997Assignee: Tokyo Ohka Kogyo Co., LTD.Inventors: Hayato Ohno, Taku Nakao, Hisanobu Harada, Shinichi Hidesaka, Hidekatsu Kohara, Toshimasa Nakayama