Abstract: An acceleration adjustment apparatus may include a load calculation unit that calculates a peak value of a load that is estimated to act on a robot, based on a motion equation regarding a motion of the robot and a value of an acceleration of a joint of the robot in motion. The acceleration adjustment apparatus may further include an acceleration adjustment unit that executes at least one of a first adjustment in which, when the peak value of the load calculated by the load calculation unit is greater than a target value of the load acting on the robot when the robot is moving, the acceleration is adjusted to decrease, and a second adjustment in which, when the peak value of the load calculated by the load calculation unit is less than the target value, the acceleration is adjusted to increase.

Abstract: A magnetic sensor capable of preventing degradation of magnetic measurement accuracy is obtained. The magnetic sensor includes a first sensor portion, a second sensor portion, and a connection portion. The first sensor portion extends in a first direction. The second sensor portion is disposed at an interval from the first sensor portion in a second direction orthogonal to the first direction. The first sensor portion includes a first end and a second end that are ends in the first direction. The second sensor portion includes a third end and a fourth end that are ends in the first direction. The connection portion connects the second end and the third end. The first sensor portion, the second sensor portion, and the connection portion are constituted of a multilayer body of a magnetic sensor element and a magnet. The magnet applies a bias magnetic field to the magnetic sensor element.

Abstract: A cultivation support system for supporting cultivation of a plant includes a growth information acquisition unit configured to acquire information on the growing condition of the plant, a growing condition evaluation unit configured to evaluate the growing condition of the plant on a scale of levels, a work content determination unit configured to determine optimum cultivation work for the growing condition of the plant, a work instruction information creation unit configured to create work instruction information indicating work to be performed by a person engaged in the cultivation of the plant, based on the cultivation work determined by the work content determination unit, and an output unit configured to output the work instruction information created by the work instruction information creation unit.

Abstract: Connection with a wiring structure can be reliably achieved, whereby a semiconductor sensor device and a semiconductor sensor device manufacturing method with increased reliability are provided. A semiconductor sensor device in which a multiple of signal lines and a sensor detection portion are disposed includes a conductive film, disposed on a substrate, that configures the signal lines and whose upper face is exposed by an aperture portion of a width smaller than a width of the signal lines, a conductive member formed on the conductive film and electrically connected to the conductive film via the aperture portion, and a wiring structure, formed on an upper face of the conductive member, of an air bridge structure that connects the signal lines or the signal lines and the sensor detection portion, wherein an upper surface of the conductive member is in contact with the wiring structure, and a side face is exposed.

Abstract: A cultivation and management device for fruit vegetable plants and fruit trees includes environment state information on an environment state of a fruit vegetable plant or a fruit tree to be cultivated, planned cultivation evaluation index information on a preplanned cultivation evaluation index of the fruit vegetable plant or the fruit tree, a calculation unit configured to determine and output a work including a shape change work for the fruit vegetable plant or the fruit tree with respect to inputs of the environment state information and the planned cultivation evaluation index information with a learning model, and an output unit configured to output the work including the shape change work for the fruit vegetable plant or the fruit tree.

Abstract: A robot control device includes: a first acquisition unit to acquire path information relating to a path of a robot and speed information relating to a speed the robot moves on the path; a second acquisition unit to acquire specification information relating to a specification of the robot; a determination unit to determine a segment where an action time of the robot is shortened even when a waypoint is added on the path; a correction unit to correct the path of the robot so as to make inertia of the robot smaller in a segment where an action time of the robot is shortened; a computation unit to compute a load acting on a joint of the robot; and an adjustment unit to adjust a control amount for controlling an acceleration of the robot joint such that the load computed by the computation unit satisfies a target load.

Abstract: A gripping posture evaluation apparatus includes a gripping posture deriver that derives a gripping posture in which a robot hand (H) in a robot (RB) grips a workpiece, a load index calculator that calculates a load index value indicating a load to the robot (RB) gripping and transporting the workpiece with the hand (H) in the gripping posture derived by the gripping posture deriver, and a gripping posture evaluator that evaluates the gripping posture by determining whether the gripping posture is appropriate based on the load index value calculated by the load index calculator. In response to the gripping posture evaluator determining that the gripping posture is inappropriate, derivation of a new gripping posture by the gripping posture deriver, calculation of a load index value by the load index calculator, and evaluation by the gripping posture evaluator are repeated.

Abstract: A parameter identification apparatus is disclosed. A trajectory generator generates a trajectory of movement of a robot satisfying an identification condition for the parameter to identify a parameter in a robot model. A data obtainer obtains data representing torque generated in the robot moving in accordance with the trajectory generated by the trajectory generator. An identifier identifies the parameter in the robot model based on the trajectory generated by the trajectory generator and based on the data obtained by the data obtainer.

Abstract: An acceleration adjustment apparatus may include a load calculation unit that calculates a peak value of a load that is estimated to act on a robot, based on a motion equation regarding a motion of the robot and a value of an acceleration of a joint of the robot in motion. The acceleration adjustment apparatus may further include an acceleration adjustment unit that executes at least one of a first adjustment in which, when the peak value of the load calculated by the load calculation unit is greater than a target value of the load acting on the robot when the robot is moving, the acceleration is adjusted to decrease, and a second adjustment in which, when the peak value of the load calculated by the load calculation unit is less than the target value, the acceleration is adjusted to increase.

Abstract: In order to achieve at least one of size reduction and high accuracy by maintaining the reliability of the thermal detection sensor in the thermal detection sensor in the flow state of the fluid to be detected, based on a heat transfer amount from the heating resistor element to the fluid to be detected by heat exchange between the fluid to be detected and the heating resistor element via the flattened film, the thermal type detection sensor for detecting a flow state of the fluid to be detected, and wherein a sidewall covering a sidewall of the heating resistor element and blocking physical contact between the heating resistor element and the flattened film is provided between the heating resistor element and the flattened film, and the sidewall suppresses fluctuation in electric resistance of the heating resistor element due to silicidation of the heating resistor element.

Abstract: An infrared sensor includes a supporting body having supporting body metal wiring that allows infrared rays to pass through. The supporting body is provided so as to cover one portion of an infrared detecting portion in a different plane spatially separated from that of the infrared detecting portion. The supporting body metal wiring disposed in an interior of the supporting body is such that one portion of a cobalt iron film is oxidized by a plasma discharge being carried out in an oxygen atmosphere. According to this kind of structure, infrared rays pass through the supporting body, and are absorbed by the infrared detecting portion, because of which there is no need to provide an infrared absorption layer in an upper layer of the supporting body.

Abstract: Connection with a wiring structure can be reliably achieved, whereby a semiconductor sensor device and a semiconductor sensor device manufacturing method with increased reliability are provided. A semiconductor sensor device in which a multiple of signal lines and a sensor detection portion are disposed includes a conductive film, disposed on a substrate, that configures the signal lines and whose upper face is exposed by an aperture portion of a width smaller than a width of the signal lines, a conductive member formed on the conductive film and electrically connected to the conductive film via the aperture portion, and a wiring structure, formed on an upper face of the conductive member, of an air bridge structure that connects the signal lines or the signal lines and the sensor detection portion, wherein an upper surface of the conductive member is in contact with the wiring structure, and a side face is exposed.

Abstract: In order to achieve at least one of size reduction and high accuracy by maintaining the reliability of the thermal detection sensor in the thermal detection sensor in the flow state of the fluid to be detected, based on a heat transfer amount from the heating resistor element to the fluid to be detected by heat exchange between the fluid to be detected and the heating resistor element via the flattened film, the thermal type detection sensor for detecting a flow state of the fluid to be detected, and wherein a sidewall covering a sidewall of the heating resistor element and blocking physical contact between the heating resistor element and the flattened film is provided between the heating resistor element and the flattened film, and the sidewall suppresses fluctuation in electric resistance of the heating resistor element due to silicidation of the heating resistor element.

Abstract: An infrared sensor includes a supporting body having supporting body metal wiring that allows infrared rays to pass through. The supporting body is provided so as to cover one portion of an infrared detecting portion in a different plane spatially separated from that of the infrared detecting portion. The supporting body metal wiring disposed in an interior of the supporting body is such that one portion of a cobalt iron film is oxidized by a plasma discharge being carried out in an oxygen atmosphere. According to this kind of structure, infrared rays pass through the supporting body, and are absorbed by the infrared detecting portion, because of which there is no need to provide an infrared absorption layer in an upper layer of the supporting body.

Abstract: A pad electrode such that a conductive film is used as the pad electrode in a semiconductor device has an object of preventing Al corrosion and improving Au bonding wire durability. A semiconductor device according to the invention includes a conductive film of Al or having Al as a main component on which a signal processing circuit and a pad electrode portion are formed, a metal film formed on the conductive film, and a protective film formed on the metal film, wherein a metal film region in which atoms derived from the metal film are implanted is formed on a surface of the conductive film exposed by an opening formed in one portion of the protective film and the metal film, and adopted as the pad electrode.

Abstract: A sensor device module comprises: a substrate having a sensor element covered with a protective film, an integrated circuit formed on the substrate, and a bonding pad part formed on the substrate; wherein the integrated circuit and the sensor element are connected at a contact part, and the sensor element and the contact part have a metal thin film layer which consists of first metal layers and second metal layers, an insulating film which is formed on the metal thin film layer and made from the same material as the protective film, and an exfoliation sacrifice layer which is formed on the insulating film and in contact with the protective film, further wherein an upper most film or a lower most film of the exfoliation sacrifice layer is made from the same material as an upper most film of the metal thin film layer.

Abstract: A sensor device module comprises: a substrate having a sensor element covered with a protective film, an integrated circuit formed on the substrate, and a bonding pad part formed on the substrate; wherein the integrated circuit and the sensor element are connected at a contact part, and the sensor element and the contact part have a metal thin film layer which consists of first metal layers and second metal layers, an insulating film which is formed on the metal thin film layer and made from the same material as the protective film, and an exfoliation sacrifice layer which is formed on the insulating film and in contact with the protective film, further wherein an upper most film or a lower most film of the exfoliation sacrifice layer is made from the same material as an upper most film of the metal thin film layer.

Abstract: A CPU unit of a PLC executes a motion control and a sequence control. The CPU unit stores a CAM table and a control program for performing the motion control using the CAM table. When a microprocessor receives a command for altering one of a plurality of phases and/or a displacement associated with the phase, the microprocessor alters the phase and/or the displacement in the CAM table to a value that is on the basis of the command. When the microprocessor performs the alteration, the microprocessor executes a control program using a post-alteration CAM table, and outputs the execution results to an apparatus to be controlled.

Abstract: A CPU unit of a PLC executes a motion control and a sequence control. The CPU unit stores a CAM table and a control program for performing the motion control using the CAM table. When a microprocessor receives a command for altering one of a plurality of phases and/or a displacement associated with the phase, the microprocessor alters the phase and/or the displacement in the CAM table to a value that is on the basis of the command. When the microprocessor performs the alteration, the microprocessor executes a control program using a post-alteration CAM table, and outputs the execution results to an apparatus to be controlled.

Abstract: A switching power supply includes a first auxiliary power supply for causing a first auxiliary winding of a transformer to induce voltage by ON/OFF control of a switching element connected to a primary winding of the transformer. The voltage induced by the first auxiliary winding charges a capacitor in the first auxiliary power supply. The switching power supply also includes a control circuit for starting and stopping the ON/OFF control of the switching element by comparing a voltage of the capacitor with a first threshold value, an activation circuit for charging the capacitor with voltage from the power supply input to the switching power supply, and a determination unit for determining a lifespan of the switching power supply based on the voltage of the capacitor after the voltage of the capacitor becomes greater than or equal to the first threshold value.