Abstract: Product recipes in which a treatment procedure and treatment conditions of heat treatment of product wafers are specified are created timely. Dummy recipes in which a treatment procedure and treatment conditions of heat treatment of dummy wafers are specified are also created. Each of the product recipes and a corresponding one of the dummy recipes are stored in association with each other. Dummy treatment of a dummy wafer starts when a controller receives an advance notice signal indicating that product wafers will arrive at a heat treatment apparatus. The dummy wafers are stored in a dummy carrier permanently installed on a load port exclusive to the dummy carrier. The dummy treatment is performed in accordance with a dummy recipe associated with a product recipe corresponding to the product wafers scheduled to arrive at the heat treatment apparatus.

Abstract: A panel mounting portion of a grommet includes an annular shaped base portion, a seal portion formed on the base portion, and a groove portion formed between the base portion and the seal portion. The seal portion includes a support portion extending forward from the base portion in a mounting direction to the panel, an extension portion extending outward from the support portion in a radial direction, a lip portion formed on the extension portion such that the lip portion protrudes forward in the mounting direction, and a thin portion formed at a middle portion of the support portion in the mounting direction. The panel mounting portion is pressed against the panel, so that the support portion is elastically deformed at the thin portion. And, the lip portion is in close contact with the panel in a state of protruding forward in the mounting direction.

Abstract: A speaker device in an embodiment includes a panel and an actuator. The actuator is provided on the panel. The actuator includes a diaphragm, a piezoelectric element, and a vibration transmission portion. The piezoelectric element is provided on at least one of principal surfaces of the diaphragm. The vibration transmission portion is provided on the diaphragm and abuts the panel without making contact with the piezoelectric element.

Abstract: A semiconductor wafer transport mode of a heat treatment apparatus is switchable between two modes of a “high throughput mode” and a “low oxygen concentration mode” as appropriate. In the “low oxygen concentration mode”, a first cooling chamber is used only as a path for transferring the semiconductor wafer, and a second cooling chamber is used only as a dedicated cooling unit for cooling the semiconductor wafer subjected to flash heating. On the other hand, in the “high throughput mode”, both of the first cooling chamber and the second cooling chamber are used as paths for transferring the semiconductor wafer, and as the cooling units, too.

Abstract: A model that closely resembles human excessive myopia can be prepared by mounting a minus lens (2) and a protector (4) to a juvenile mouse, the minus lens having an angle and a width adjustable in response to growth of the mouse. Further, this model analysis shows that myopia induction causes endoplasmic reticulum stress in a sclera and the endoplasmic reticulum stress induces myopia. Furthermore, it is revealed that an endoplasmic reticulum stress suppressant, particularly, phenylbutyrate and tauroursodeoxycholic acid act as a myopia prevention/suppression agent.

Abstract: Product recipes in which a treatment procedure and treatment conditions of heat treatment of product wafers are specified are created timely. Dummy recipes in which a treatment procedure and treatment conditions of heat treatment of dummy wafers are specified are also created. Each of the product recipes and a corresponding one of the dummy recipes are stored in association with each other. Dummy treatment of a dummy wafer starts when a controller receives an advance notice signal indicating that product wafers will arrive at a heat treatment apparatus. The dummy wafers are stored in a dummy carrier permanently installed on a load port exclusive to the dummy carrier. The dummy treatment is performed in accordance with a dummy recipe associated with a product recipe corresponding to the product wafers scheduled to arrive at the heat treatment apparatus.

Abstract: A product recipe specifying a treatment procedure and treatment conditions of heat treatment for product wafers is prepared at appropriate timing. A dummy recipe specifying a treatment procedure and treatment conditions of heat treatment for dummy wafers is also prepared. A product recipe and its corresponding dummy recipe are associated and stored. Prior to starting heat treatment for product wafers, a recipe for the heat treatment is selected. At this time, a dummy recipe is not displayed, and selection of a dummy recipe is prohibited. Consequently, erroneous setting of a dummy recipe for product wafers can be prevented, and erroneous treatment of performing heat treatment with details of dummy treatment for product wafers can be prevented.

Abstract: Heat treatment is performed on a dummy wafer with halogen lamps or the like to perform dummy treatment of adjusting the temperature of in-chamber structures including a susceptor and the like. A dummy recipe for the dummy treatment is prepared in advance, and a maximum value and a minimum value each being a threshold for the number of times of dummy treatment are set. After the dummy treatment is started, the number of times of dummy treatment is counted. Comparison determination between the number of times of dummy treatment at the time point when carriers storing semiconductor wafers each to be a product are transported in to a heat treatment apparatus and the set maximum value and minimum value is performed. In this manner, the timing of the end of the dummy treatment and the start of the treatment of product wafers is adjusted.

Abstract: A grommet includes a panel mounting portion to be mounted on a panel having an attachment hole, and an inner member to be assembled to the panel mounting portion and fitted into the attachment hole to lock an edge portion of the attachment hole. The panel mounting portion includes a base portion formed in an annular shape, a seal portion formed on the base portion, and a groove portion formed between the base portion and the seal portion, the groove portion being continuous in a peripheral direction. The inner member includes a restriction piece, which abuts against the edge portion of the attachment hole when the inner member is obliquely fitted into the attachment hole of the panel.

Abstract: A grommet which is configured to cover a periphery of a wire harness includes a panel mounting portion which is configured to be mounted to a panel. The panel mounting portion includes a base portion which is formed in an annular shape, a seal portion which is formed on the base portion and is configured to be in close contact with a surface of the panel, and a groove portion which is formed between the base portion and the seal portion along a peripheral direction of the panel mounting portion. A plurality of reinforcing ribs are configured to connect the base portion and the seal portion and are arranged in the peripheral direction in the groove portion, and the reinforcing ribs are inclined with respect to a mounting direction of the panel mounting portion to the panel.

Abstract: A panel mounting portion of a grommet includes an annular shaped base portion, a seal portion formed on the base portion, and a groove portion formed between the base portion and the seal portion. The seal portion includes a support portion extending forward from the base portion in a mounting direction to the panel, an extension portion extending outward from the support portion in a radial direction, a lip portion formed on the extension portion such that the lip portion protrudes forward in the mounting direction, and a thin portion formed at a middle portion of the support portion in the mounting direction. The panel mounting portion is pressed against the panel, so that the support portion is elastically deformed at the thin portion. And, the lip portion is in close contact with the panel in a state of protruding forward in the mounting direction.

Abstract: A grommet which can maintain water tightness in response to inclination is provided. In an attachment section of the grommet, a substantially right-angled first bending portion is formed between a first flange portion and a tubular portion. Thus, when the attachment section is inclined with respect to a panel member, the first bending portion changes in angle, thereby absorbing the inclination, and thereby maintaining the contact between the annular lip portion and a planar portion. As a result, water tightness can be maintained in response to the inclination.

Abstract: A grommet which can prevent unintended deformation of an annular lip portion is provided. The annular lip portion is configured to be compressed in a compression direction corresponding to a direction perpendicular to a plane of a panel member. Thus, even if the annular lip portion is formed with a large length to ensure a pushing force against a planar portion, a tip edge of the annular lip portion is unlikely to be located in the vicinity of a first flange portion. Therefore, the annular lip portion is avoided from contacting the other members, preventing unintended deformation of the annular lip portion.

Abstract: A grommet which allows an annular lip portion to be pushed hardly against a panel member is provided. When the annular lip portion abuts on a planar portion on a radially inner side than an outer peripheral edge of a flange portion, a protruding portion of the annular lip portion is sandwiched between the planar portion and the flange portion. An inner member of a grommet is made of a material having a higher degree of hardness than the material of a body of the grommet, thereby allowing the annular lip portion to be pushed hardly against the panel member.

Abstract: A fluid controller is provided having a flow path through which a fluid can flow, a closed space separated from the flow path by an isolation member, and a leak port capable of communicating the closed space with an external part. An anomaly detection device for detecting an anomalty has a pressure sensor detachably fixed to the leak port, a pressure sensor for detecting the pressure in the closed space, a processing module for executing a predetermined information processing, and an detachable mechanism for blocking the leak port from the external part in the state of being fixed. The processing module determines an anomaly of the fluid controller by comparing a detection value detected by the pressure sensor to a predetermined threshold, and transmits a discrimination result of the anomaly of the fluid controller to a server.

Abstract: A wafer cleaner and a method therefor that efficiently cleans a wafer with a little amount of a cleaning liquid and efficiently performs a heating wet cleaning processing. The present invention includes a stage where a wafer is placed, a rotary driving unit that rotates the stage in a circumferential direction, a liquid discharge nozzle disposed facing the wafer placed on the stage and supplies a cleaning liquid on the wafer placed on the stage, and a control unit that causes the liquid discharge nozzle to supply a space between the wafer placed on the stage and the liquid discharge nozzle with a predetermined amount of the cleaning liquid to fill the space. The present invention also includes a lamp disposed on a position facing the wafer placed on the stage to heat at least an interface portion of the wafer and a cleaning liquid.

Abstract: A semiconductor wafer is preheated by halogen lamps; thereafter, the semiconductor wafer is heated by irradiation with flash of light from flash lamps. A radiation thermometer measures the temperature of the back surface of the semiconductor wafer at predetermined sampling intervals and acquires a plurality of temperature measurement values. Of the plurality of temperature measurement values, a temperature integrated value is calculated by integrating a set number of the temperature measurement values acquired from the start point of integration after a start time of irradiation of the flash light. When the calculated temperature integrated value falls out of the range between the upper limit value and the lower limit value, the semiconductor wafer is determined to be broken at the time of flash light irradiation.

Abstract: A semiconductor device includes an input/output circuit to which a signal is input or from which a signal is output; a first terminal connected to a power line of the input/output circuit; a second terminal connected to the power line; a resistance element connected between the second terminal and the power line; and a first capacitance element connected between the second terminal and a ground terminal. The semiconductor device can suppress a resonance phenomena and Volt age variation caused by impedance of the power line.

Abstract: A grommet which can maintain water tightness in response to inclination is provided. In an attachment section of the grommet, a substantially right-angled first bending portion is formed between a first flange portion and a tubular portion. Thus, when the attachment section is inclined with respect to a panel member, the first bending portion changes in angle, thereby absorbing the inclination, and thereby maintaining the contact between the annular lip portion and a planar portion. As a result, water tightness can be maintained in response to the inclination.

Abstract: A grommet which allows an annular lip portion to be pushed hardly against a panel member is provided. When the annular lip portion abuts on a planar portion on a radially inner side than an outer peripheral edge of a flange portion, a protruding portion of the annular lip portion is sandwiched between the planar portion and the flange portion. An inner member of a grommet is made of a material having a higher degree of hardness than the material of a body of the grommet, thereby allowing the annular lip portion to be pushed hardly against the panel member.