Abstract: The present invention is directed to a method for manufacturing a semiconductor device by forming an ultraviolet radiation absorbing film of a silicon-rich film above a semiconductor substrate, measuring an extinction coefficient of the ultraviolet radiation absorbing film of a silicon-rich film for ultraviolet radiation, and etching the ultraviolet radiation absorbing film of a silicon-rich film under an etching condition using an oxygen gas flow rate corresponding to the extinction coefficient.

Abstract: The present invention is directed to a method for manufacturing a semiconductor device by forming an ultraviolet radiation absorbing film of a silicon-rich film above a semiconductor substrate, measuring an extinction coefficient of the ultraviolet radiation absorbing film of a silicon-rich film for ultraviolet radiation, and etching the ultraviolet radiation absorbing film of a silicon-rich film under an etching condition using an oxygen gas flow rate corresponding to the extinction coefficient.

Abstract: A rear frame structure for a vehicle is disclosed, wherein an impact load can be satisfactorily absorbed in the case of a collision with a rear surface of the vehicle. The rear frame structure includes a pipe-shaped impact-absorbing member located between left and right rear frames. The impact-absorbing member has a center pipe that has a V shape in plan view, formed so as to protrude backward. The impact-absorbing member has left- and right-side pipes extending from the center pipe linearly upwardly to left and right end pipes. The impact load applied to the center pipe causes the left- and right-side pipes to undergo compressive deformation in their axial longitudinal directions as well as bending deformation towards the front of the vehicle body, whereby the impact load is absorbed.

Abstract: A rear frame structure for a vehicle is disclosed, wherein an impact load can be satisfactorily absorbed in the case of a collision with a rear surface of the vehicle. The rear frame structure includes a pipe-shaped impact-absorbing member located between left and right rear frames. The impact-absorbing member has a center pipe that has a V shape in plan view, formed so as to protrude backward. The impact-absorbing member has left- and right-side pipes extending from the center pipe linearly upwardly to left and right end pipes. The impact load applied to the center pipe causes the left- and right-side pipes to undergo compressive deformation in their axial longitudinal directions as well as bending deformation towards the front of the vehicle body, whereby the impact load is absorbed.