Abstract: A cleaning method of cleaning a solution treatment apparatus for applying a coating solution onto a substrate, the solution treatment apparatus including a holder holding and rotating the substrate; a coating solution supplier; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction. The cleaning method includes introducing the cleaning solution to the storage chamber via the introduction hole, discharging the cleaning solution from the discharge port and making the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning away the coating solution adhering to the peripheral edge side upper surface. The discharging in the cleaning discharges the cleaning solution from discharge ports of the inner cup outward in the radial direction and obliquely upward.

Abstract: The present invention relates to an electronic component formed of an electrically conductive plate and including a plurality of leads 1, 2 each having an island 10 for mounting of a semiconductor chip 3 or having a connecting portion 20 for connection with a wire 4. According to an electronic component X offered by the present invention, at least a set of mutually adjacent leads 1, 2 have their respective mutually facing side surfaces 10a, 20a made non-parallel to each other. Preferably, at least one side surface 20a (10a) of the leads 1, 2 is at least partially curved, folded and/or slanted.