Abstract: An adhesive composition contains a polyurethane-polyolefin complex composed of a polyurethane having a first functional group and a polyolefin having a second functional group that reacts with the first functional group. The polyurethane and the polyolefin is bound by a reaction between the first functional group and the second functional group.

Abstract: An adhesive composition contains a polyurethane-polyolefin complex composed of a polyurethane having a first functional group and a polyolefin having a second functional group that reacts with the first functional group. The polyurethane and the polyolefin is bound by a reaction between the first functional group and the second functional group.

Abstract: A copper alloy for an electronic device comprises 2.0 wt% -8 wt% of Ni, 0.1 wt% -0.8 wt% of P, 0.06 wt% -1 wt% of Si and the rest being Cu and unavoidable impurities.The rest may include 0.03 wt% -2.0 wt% of Zn. The copper allow has an oxygen content of 20 ppm or less.

Abstract: Plated copper alloy material with an undercoat plating and an overcoat plating on the copper alloy, wherein the undercoat plating consists essentially of 0.03% to 5% by weight of zinc (Zn) and the remainder of copper (Cu) in the substantial part thereof, the total quantity of Zn and Cu being 98% or above and the total quantity of other elements being 2% or below.

Abstract: A high strength Cu-Ni-Sn alloy, comprising 3-25% Ni, 3-9% Sn, 0.05-1.5% Mn, balance Cu, is heated to a temperature of 800.degree. C. or above in a single-phase region. This heat treatment is followed by quenching and subsequent heating at a temperature range of 600.degree.-770.degree. C. in a two-phase region, followed by quenching and a finishing process with a ratio of 0-60%. Thereafter, the processed alloy is subjected to a final heat-treatment at a temperature of 350.degree.-500.degree. C.

Abstract: A copper alloy for an electronic device comprises 1.0 wt %-4.0 wt % of Ni, more than 0.2 wt % and less than 0.8 wt % of P, 0.5 wt %-6.0 wt % of Zn and the rest being copper and unavoidable impurities. The rest may include 0.05 wt %-1.0 wt % of Mg.A wire of the above-mentioned copper alloy is prepared by heating the copper alloy having the composition described above at temperature of 750.degree. C.-950.degree. C. for more than one minute before the final rolling operation, and then, heating the material at a temperature of 350.degree. C.-500.degree. C., or slowly cooling it at a rate of 4.degree. C./min. or less, or cooling it at a rate of 1.degree. C./min. or more until temperature reaches 500.degree. C. and keeping its temperature for at least one hour in a temperature range of 500.degree. C.-350.degree. C.