Patents by Inventor Shinichi KAZAMA

Shinichi KAZAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for semiconductor encapsulation and semiconductor device
    Patent number: 10696840
    Abstract: A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic % or more of an SP3 structure and 55 atomic % or less of an SP2 structure.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: June 30, 2020
    Assignee: KYOCERA CORPORATION
    Inventors: Ken Uchida, Shinichi Kazama, Yoshitake Terashi
  • RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
    Publication number: 20170267859
    Abstract: A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic % or more of an SP3 structure and 55 atomic % or less of an SP2 structure.
    Type: Application
    Filed: November 5, 2015
    Publication date: September 21, 2017
    Applicant: KYOCERA Corporation
    Inventors: Ken UCHIDA, Shinichi KAZAMA, Yoshitake TERASHI