Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately laminated therein, and two end surfaces opposing each other in a length direction, and two side surfaces opposing each other in a width direction, and two external electrodes respectively on the two end surfaces of the multilayer body. At least one of two opposed main surfaces of the multilayer ceramic capacitor includes raised portions provided respectively on one side and another side with a middle portion of the main surface interposed therebetween. The raised portions are each raised to become thicker in the lamination direction from the middle portion toward an outer periphery of the main surface.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and layered internal electrodes, first and second main surfaces, first and second side surfaces, first and second end surfaces, and an external electrode connected to the internal electrodes and provided on each of the first and second end surfaces. A region where the internal electrodes are superimposed is defined as an effective region, regions respectively located on sides of the first and second end surfaces relative to the effective region are defined as first and second regions, and a bent portion where the dielectric layers and the internal electrodes are bent is located in the first region. In the bent portion, all vertices in the stacking direction are located within a range that extends by about 25 ?m to about 35 ?m in a length direction from the effective region of the multilayer body.

Abstract: An end surface outer layer Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in a dielectric ceramic layer in an end surface outer layer portion, is higher than a central portion Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in the dielectric ceramic layer in a central portion in a width direction, a length direction, and a layering direction in an effective portion, and a peak intensity of Ni found by TEM-EDX is in a portion of the dielectric ceramic layers in the end surface outer layer portion.

Abstract: In a multilayer ceramic capacitor, when a ratio of an ICP peak intensity of Mn to an ICP peak intensity of Ti is an Mn/Ti peak intensity ratio, a value of the Mn/Ti peak intensity ratio in a dielectric ceramic layer in at least one of a main surface outer layer portion, a side surface outer layer portion, and an end surface outer layer portion is in a range of two times to fifteen times a value of the Mn/Ti peak intensity ratio in a dielectric ceramic layer in a central portion of an effective portion in a width direction, a length direction, and a stacking direction.

Abstract: An Mn/Ti peak intensity ratio in a dielectric ceramic layer in an end surface outer layer portion is within two times to fifteen times of the Mn/Ti peak intensity ratio in a central portion, a rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the end surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio in the central portion, an Si/Ti peak intensity ratio in the dielectric ceramic layer in a side surface outer layer portion is within two times to five times the Si/Ti peak intensity ratio in the central portion, and the rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the side surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio.

Abstract: A multilayer ceramic capacitor includes end-surface external electrodes and side-surface external electrodes. The end-surface external electrodes are respectively provided at end surfaces of a multilayer body and are respectively connected to end-surface connecting internal electrodes. The side-surface external electrodes are respectively provided at the side surfaces of the multilayer body and respectively connected to side-surface connecting internal electrodes. The end-surface connecting internal electrodes each include end surface opposing portion opposing the side-surface connecting internal electrode 15B adjacent in a lamination direction, and an end surface lead-out portion extending from the end surface opposing portion to one of the end-surface external electrodes.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately laminated therein, and two end surfaces opposing each other in a length direction, and two side surfaces opposing each other in a width direction, and two external electrodes respectively on the two end surfaces of the multilayer body. At least one of two opposed main surfaces of the multilayer ceramic capacitor includes raised portions provided respectively on one side and another side with a middle portion of the main surface interposed therebetween. The raised portions are each raised to become thicker in the lamination direction from the middle portion toward an outer periphery of the main surface.

Abstract: An end surface outer layer Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in a dielectric ceramic layer in an end surface outer layer portion, is higher than a central portion Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in the dielectric ceramic layer in a central portion in a width direction, a length direction, and a layering direction in an effective portion, and a peak intensity of Ni found by TEM-EDX is in a portion of the dielectric ceramic layers in the end surface outer layer portion.

Abstract: An Mn/Ti peak intensity ratio in a dielectric ceramic layer in an end surface outer layer portion is within two times to fifteen times of the Mn/Ti peak intensity ratio in a central portion, a rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the end surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio in the central portion, an Si/Ti peak intensity ratio in the dielectric ceramic layer in a side surface outer layer portion is within two times to five times the Si/Ti peak intensity ratio in the central portion, and the rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the side surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio.

Abstract: In a multilayer ceramic capacitor, when a ratio of an ICP peak intensity of Mn to an ICP peak intensity of Ti is an Mn/Ti peak intensity ratio, a value of the Mn/Ti peak intensity ratio in a dielectric ceramic layer in at least one of a main surface outer layer portion, a side surface outer layer portion, and an end surface outer layer portion is in a range of two times to fifteen times a value of the Mn/Ti peak intensity ratio in a dielectric ceramic layer in a central portion of an effective portion in a width direction, a length direction, and a stacking direction.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and layered internal electrodes, first and second main surfaces, first and second side surfaces, first and second end surfaces, and an external electrode connected to the internal electrodes and provided on each of the first and second end surfaces. A region where the internal electrodes are superimposed is defined as an effective region, regions respectively located on sides of the first and second end surfaces relative to the effective region are defined as first and second regions, and a bent portion where the dielectric layers and the internal electrodes are bent is located in the first region. In the bent portion, all vertices in the stacking direction are located within a range that extends by about 25 ?m to about 35 ?m in a length direction from the effective region of the multilayer body.

Abstract: A printing plate which can form a graphic pattern having excellent linearity of a side edge along the printing direction and a good planarization property in the case of forming a graphic pattern in which a width direction dimension, a dimension in a direction orthogonal to the printing direction, is small; a printing device including the printing plate; and a method for manufacturing a laminated ceramic electronic component.

Abstract: A printing plate which can form a graphic pattern having excellent linearity of a side edge along the printing direction and a good planarization property in the case of forming a graphic pattern in which a width direction dimension, a dimension in a direction orthogonal to the printing direction, is small; a printing device including the printing plate; and a method for manufacturing a laminated ceramic electronic component.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.