Patents by Inventor Shinichi Kondo

Shinichi Kondo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220181073
    Abstract: In a multilayer coil component, a coil is configured by electrically connecting coil conductors respectively provided in magnetic body layers constituting an element body and metal magnetic particles have a normal particle having an ellipsoidal shape and flat particles having an ellipsoidal shape flatter in a thickness direction than the normal particle. A plurality of the normal particles and at least one of the flat particles disposed such that a surface (reference surface) including a major axis direction orthogonal to the thickness direction and a minor axis direction is along the forming surface of the coil conductor in the magnetic body layer are arranged in the lamination direction of the magnetic body layers between the coil conductors.
    Type: Application
    Filed: November 10, 2021
    Publication date: June 9, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Kazuhiro EBINA, Kouichi KAKUDA, Kunihiko KAWASAKI, Shinichi KONDO, Yuya ISHIMA, Masaki TAKAHASHI, Takahiro SATO, Keito YASUDA, Shingo HATTORI
  • Publication number: 20220168294
    Abstract: Aspects of the present invention relate to a method of treating an epileptic encephalopathy in a mammal in need thereof, comprising administering a composition comprising an effective amount of (4-benzyl-4-hydroxypiperidin-1-yl) (2,4?-bipyridin-3-yl)methanone or a pharmaceutically acceptable salt thereof to the mammal.
    Type: Application
    Filed: February 16, 2022
    Publication date: June 2, 2022
    Inventors: Toshiya Nishi, Shinichi KONDO
  • Patent number: 11302466
    Abstract: A multilayer coil electronic component having improved inductance L, Q, and strength, and which has an element in which a coil conductor and a magnetic element body are stacked. The magnetic element body includes soft magnetic metal particles and a resin. The resin fills a space between the soft magnetic metal particles. Each of soft magnetic metal particles has a soft magnetic metal particle core and an oxide film covering the soft magnetic metal particle core. A layer of the oxide film contacting the soft magnetic metal particle core is made of an oxide including Si.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 12, 2022
    Assignee: TDK CORPORATION
    Inventors: Takashi Suzuki, Hidekazu Sato, Yusuke Nagai, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi, Takashi Endo
  • Publication number: 20220108836
    Abstract: In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 7, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Takashi SUZUKI, Kazuhiro EBINA, Kunihiko KAWASAKI, Shinichi KONDO, Keito YASUDA, Ryuichi WADA, Makoto MORITA, Takashi KUDO, Kyohei TONOYAMA
  • Publication number: 20220108835
    Abstract: A multilayer coil component includes: an element body containing a plurality of metal magnetic particles; a coil disposed in the element body; and an external electrode disposed on a surface of the element body and electrically connected to the coil. At least a part of a void part between the metal magnetic particles in the element body is filled with a first resin, the external electrode has a resin electrode containing a second resin and a conductor powder dispersed in the second resin, and the second resin connected from the resin electrode extends into the element body.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 7, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Takashi SUZUKI, Kazuhiro EBINA, Kunihiko KAWASAKI, Shinichi KONDO, Yuya ISHIMA, Shinichi SATO, Seiichi NAKAGAWA, Keito YASUDA, Ryuichi WADA
  • Publication number: 20220102039
    Abstract: A multilayer coil component includes an element body containing a plurality of metal magnetic particles and a resin existing between the plurality of metal magnetic particles and a coil configured to include a plurality of electrically interconnected coil conductors. At least one of the plurality of coil conductors has a spiral shape and has conductor portions adjacent to each other when viewed from a direction along a coil axis of the coil. The plurality of metal magnetic particles contained in the element body include a plurality of metal magnetic particles having a particle diameter of ? or more and ½ or less of a distance between the conductor portions adjacent to each other in the coil conductor. The metal magnetic particles having the particle diameter are arranged along a facing direction of the conductor portions between the conductor portions adjacent to each other in the coil conductor.
    Type: Application
    Filed: September 27, 2021
    Publication date: March 31, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Takashi SUZUKI, Kazuhiro EBINA, Kouichi KAKUDA, Kunihiko KAWASAKI, Shinichi KONDO, Shinichi SATO, Seiichi NAKAGAWA, Mitsuharu KOIKE, Kazuhiro MIURA
  • Publication number: 20220102038
    Abstract: A multilayer coil component includes an element body containing a plurality of metal magnetic particles and a resin existing between the plurality of metal magnetic particles and a coil disposed in the element body and configured to include a plurality of electrically interconnected coil conductors. At least one of the plurality of coil conductors has a spiral shape and has conductor portions adjacent to each other when viewed from a direction along a coil axis of the coil. The conductor portion includes a straight conductor portion extending in a straight line and a connecting conductor portion connecting the straight conductor portion and constituting a corner portion of the coil conductor. The metal magnetic particles between the connecting conductor portions adjacent to each other are lower in density than the metal magnetic particles between the straight conductor portions adjacent to each other.
    Type: Application
    Filed: September 27, 2021
    Publication date: March 31, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Takashi SUZUKI, Kazuhiro EBINA, Kouichi KAKUDA, Kunihiko KAWASAKI, Shinichi KONDO, Shinichi SATO, Seiichi NAKAGAWA, Mitsuharu KOIKE, Kazuhiro MIURA
  • Patent number: 11285139
    Abstract: Aspects of the present invention relate to a method of treating an epileptic encephalopathy in a mammal in need thereof, comprising administering a composition comprising an effective amount of (4-benzyl-4-hydroxypiperidin-1-yl) (2,4?-bipyridin-3-yl)methanone or a pharmaceutically acceptable salt thereof to the mammal.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 29, 2022
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Toshiya Nishi, Shinichi Kondo
  • Publication number: 20220013278
    Abstract: A multilayer coil component includes an element body, first and second coils, and a pair of external electrodes. The element body includes a plurality of insulator layers laminated in a first direction. The element body has a pair of end surfaces opposing each other in a second direction orthogonal to the first direction. The first coil and the second coil are disposed in the element body and respectively have coil shafts along the second direction. The pair of external electrodes are disposed on the pair of end surfaces and electrically connected to both ends of the first coil and the second coil. The first coil includes a first conductor layer, a second conductor layer, and a first through hole conductor. The coil shaft of the first coil is disposed inside the second coil.
    Type: Application
    Filed: July 6, 2021
    Publication date: January 13, 2022
    Applicant: TDK CORPORATION
    Inventors: Yuya OSHIMA, Junichi OTSUKA, Shinichi KONDO, Yohei TADAKI, Kazuo IWAI, Masayuki SUZUKI, Emiri MATSUHASHI, Takuya NIIBORI
  • Patent number: 11211188
    Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: December 28, 2021
    Assignee: TDK CORPORATION
    Inventors: Yusuke Nagai, Takashi Suzuki, Hidekazu Sato, Takashi Endo, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi
  • Patent number: 11189413
    Abstract: First internal conductors are separated from each other in a first direction. Each of the first internal conductors includes a coil portion and a pad portion having a width larger than a width of the coil portion. The pad portions adjacent to each other in the first direction are connected to each other via a through-hole conductor and overlap each other when viewed from the first direction. When viewed from the first direction, each of the coil portions includes a first portion not overlapping the pad portion adjacent in the first direction and a second portion overlapping a part of the pad portion adjacent in the first direction. A second internal conductor is disposed on the same layer as the second portion and is positioned to overlap a portion of the pad portion adjacent in the first direction not overlapping the second portion when viewed from the first direction.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: November 30, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Shinichi Kondo, Junichi Otsuka, Yohei Tadaki, Kazuo Iwai, Masayuki Suzuki, Shigeshi Osawa, Kazuhiro Ebina, Makoto Yoshino, Mamoru Kawauchi
  • Patent number: 11168022
    Abstract: A glass ceramics sintered body includes a glass phase and a ceramics phase dispersed in the glass phase. The ceramics phase includes alumina grains and zirconia grains. The glass phase includes an MO—Al2O3—SiO2—B2O3 based glass, where M is an alkaline earth metal. An area ratio of the alumina grains is 13 to 30%, and an area ratio of the zirconia grains is 0.05 to 6%, on a cross section of the sintered body.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 9, 2021
    Assignee: TDK CORPORATION
    Inventors: Shusaku Umemoto, Takashi Suzuki, Hidekazu Sato, Masaki Takahashi, Shinichi Kondo
  • Patent number: 11139112
    Abstract: An electronic component includes an element provided with a first recess, and a mounting conductor including a first conductor portion disposed in the first recess. The first conductor portion has a first face opposed to a bottom face of the first recess, a second face opposed to the first face, and a third face connecting the first face and the second face. The third face has a region overlapping with the second face as viewed from an opposing direction of the bottom face of the first recess and the first face.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: October 5, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Ishima, Yasushi Matsuyama, Yuto Shiga, Shunji Aoki, Shinichi Kondo
  • Patent number: 11127529
    Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: September 21, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Makoto Yoshino, Yoji Tozawa, Junichi Otsuka, Kazuo Iwai, Yohei Tadaki, Shinichi Kondo, Kazuhiro Ebina, Mamoru Kawauchi
  • Patent number: 10998129
    Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: May 4, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Ishima, Shinichi Kondo, Shunji Aoki, Yasushi Matsuyama, Yusuke Onezawa, Hajime Azuma
  • Publication number: 20210074474
    Abstract: A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 11, 2021
    Applicant: TDK CORPORATION
    Inventors: Yuya ISHIMA, Shinichi KONDO, Kosuke ITO, Shingo HATTORI
  • Publication number: 20210065975
    Abstract: A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Applicant: TDK CORPORATION
    Inventors: Yuya ISHIMA, Shinichi KONDO, Kosuke ITO, Shingo HATTORI, Takashi SUZUKI, Hidenobu UMEDA
  • Publication number: 20210012947
    Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 14, 2021
    Applicant: TDK CORPORATION
    Inventors: Yuya ISHIMA, Shinichi KONDO, Kosuke ITO, Shingo HATTORI, Kazuya TOBITA, Noriaki HAMACHI, Atsushi MORIYA
  • Patent number: 10886063
    Abstract: An electronic-component manufacturing method is for simultaneously manufacturing a plurality of electronic components each including an element body and a conductor. The electronic-component manufacturing method includes the steps of forming laminates to be the plurality of electronic components on a plurality of regions set apart from each other on a surface of a first substrate, releasing the laminates from the plurality of regions, and performing heat treatment to the laminates. The forming the laminates includes a first step of forming element-body patterns on the plurality of regions and a second step of forming conductor patterns on the plurality of regions. The element-body patterns contain a constituent material of the element bodies and are patterned for the plurality of regions. The conductor patterns contain a constituent material of the conductors and are patterned for the plurality of regions.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: January 5, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Ishima, Shunji Aoki, Shinichi Kondo, Yasushi Matsuyama, Hajime Azuma, Yusuke Onezawa
  • Patent number: 10848119
    Abstract: An element body includes a first function portion including a first material, a second function portion including a second material different from the first material, and an intermediate portion placed between the first function portion and the second function portion. The intermediate portion includes a first component included in the first material, and a second component included in the second material. A side surface of the element body includes surfaces of the first function portion, the second function portion, and the intermediate portion. Each of terminal electrodes includes electrode portion formed on the side surface across the surfaces of the first function portion, the second function portion, and the intermediate portion. An insulating layer is formed on the side surface in such a manner as to be in contact with at least a region exposed from the electrode portions between the electrode portions in the surface of the intermediate portion.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: November 24, 2020
    Assignee: TDK CORPORATION
    Inventors: Akihiko Oide, Yoji Tozawa, Seiichi Nakagawa, Shinichi Kondo, Takashi Endo, Makoto Yoshino, Noriaki Hamachi