Patents by Inventor Shinichi KOORIYAMA

Shinichi KOORIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board and electronic device
    Patent number: 10037928
    Abstract: A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.
    Type: Grant
    Filed: January 23, 2016
    Date of Patent: July 31, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Narutoshi Ogawa, Kensou Ochiai, Noritaka Niino, Shinichi Kooriyama, Masashi Konagai
  • Circuit board having a heat dissipating sheet with varying metal grain size
    Patent number: 10014237
    Abstract: A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: July 3, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Shinichi Kooriyama, Narutoshi Ogawa, Masashi Konagai, Kensou Ochiai, Noritaka Niino
  • CIRCUIT BOARD AND ELECTRONIC DEVICE
    Publication number: 20180005914
    Abstract: A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.
    Type: Application
    Filed: January 23, 2016
    Publication date: January 4, 2018
    Applicant: KYOCERA Corporation
    Inventors: Narutoshi OGAWA, Kensou OCHIAI, Noritaka NIINO, Shinichi KOORIYAMA, Masashi KONAGAI
  • CIRCUIT BOARD AND ELECTRONIC DEVICE
    Publication number: 20170352607
    Abstract: A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.
    Type: Application
    Filed: December 14, 2015
    Publication date: December 7, 2017
    Applicant: Kyocera Corporation
    Inventors: Shinichi KOORIYAMA, Narutoshi OGAWA, Masashi KONAGAI, Kensou OCHIAI, Noritaka NIINO