Abstract: A heat treatment apparatus for a cylinder block, performs heat treatment by feeding gas. The heat treatment apparatus comprises a first feed part configured to feed the gas toward bores of the cylinder block, from a first side or a second side of the bores in an axis direction of the bores.

Abstract: A heat treatment apparatus for a cylinder block, performs heat treatment by feeding gas. The heat treatment apparatus comprises a first feed part configured to feed the gas toward bores of the cylinder block, from a first side or a second side of the bores in an axis direction of the bores.

Abstract: An agitation device, a melting apparatus, and a melting method for improving melting efficiency of molten metal without contaminating the same. The agitation device is provided with a traveling magnetic field generating unit which is disposed outside a charging tank for storing molten metal and generates, inside the charging tank, a magnetic field that travels downward along the rear sidewall of the charging tank. A flow of the molten metal that rotates longitudinally about an axis approximately parallel to the surface of the molten metal is produced in the molten metal. By charging aluminum cutting chips into the molten metal in which the flow is produced, the aluminum cutting chips move with a downward flow of the molten metal, and are immersed in the molten metal. As a result, melting of the aluminum cutting chips can be accelerated.

Abstract: In a line conversion structure, a slot line includes a slot ground conductor connected to a ground layer with a through conductor that passes through the dielectric layer, a slot signal conductor, and a slot disposed between the slot ground conductor and the slot signal conductor. A signal conductor of a microstrip line is orthogonal to the slot ground conductor and the slot, with a gap between the signal conductor and the slot ground conductor, and an end of the signal conductor is connected to the slot signal conductor, and a length L of a portion of the slot ground conductor, the portion being parallel to the signal conductor with the gap, is less than or equal to 0.25 times a wavelength of a signal transmitted through the microstrip line.

Abstract: Provided are an agitation device, a melting apparatus, and a melting method which achieve good melting efficiency without contaminating molten metal. The agitation device is provided with a traveling magnetic field generating unit which is disposed outside a charging tank for storing molten metal and generates, inside the charging tank, a magnetic field that travels downward along the rear sidewall of the charging tank, whereby a flow of the molten metal that rotates longitudinally about an axis approximately parallel to the surface of the molten metal is produced in the molten metal. By charging aluminum cutting chips into the molten metal in which the flow is produced, the aluminum cutting chips move with the flow of the molten metal, get into the molten metal roughly in the position where a downward flow of the molten metal is produced, and are immersed in the molten metal, and thus the melting of the aluminum cutting chips is accelerated.

Abstract: A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the line conductor, a slot formed in the ground conductor layer so as to be substantially orthogonal to the one end of the line conductor and coupled to the line conductor, a shield conductor part disposed on a side of or in an inside of the dielectric layer so as to surround the one end of the line conductor and the slot, and a waveguide disposed at the lower side of the dielectric layer so that an opening is made opposite to the one end of the line conductor and the slot, and electrically connected to the shield conductor part.

Abstract: A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the line conductor, a slot formed in the ground conductor layer so as to be substantially orthogonal to the one end of the line conductor and coupled to the line conductor, a shield conductor part disposed on a side of or in an inside of the dielectric layer so as to surround the one end of the line conductor and the slot, and a waveguide disposed at the lower side of the dielectric layer so that an opening is made opposite to the one end of the line conductor and the slot, and electrically connected to the shield conductor part.

Abstract: A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the line conductor, a slot formed in the ground conductor layer so as to be substantially orthogonal to the one end of the line conductor and coupled to the line conductor, a shield conductor part disposed on a side of or in an inside of the dielectric layer so as to surround the one end of the line conductor and the slot, and a waveguide disposed at the lower side of the dielectric layer so that an opening is made opposite to the one end of the line conductor and the slot, and electrically connected to the shield conductor part.

Abstract: An object of the invention is to provide a high-frequency line-waveguide converter in which a distance between a grounding conductor and a radiating conductor and a thickness of a dielectric layer of a high-frequency line can be freely set. A high-frequency line-waveguide converter for converting a high-frequency line to a waveguide comprises a high-frequency line including a first dielectric layer; a line conductor; and a grounding conductor; an opening portion of the grounding conductor; a second dielectric layer; a radiating conductor; a connecting conductor; a shielding conductor portion; and a waveguide.

Abstract: A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.

Abstract: A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the line conductor, a slot formed in the ground conductor layer so as to be substantially orthogonal to the one end of the line conductor and coupled to the line conductor, a shield conductor part disposed on a side of or in an inside of the dielectric layer so as to surround the one end of the line conductor and the slot, and a waveguide disposed at the lower side of the dielectric layer so that an opening is made opposite to the one end of the line conductor and the slot, and electrically connected to the shield conductor part.

Abstract: A wiring board module has two wiring boards placed on an external circuit board. In each wiring board, a terminal end of a laminated waveguide tube is exposed at a lateral side of a dielectric substrate, thus forming an exposed face, and the dielectric substrate is provided at the bottom thereof in the vicinity of the exposed face with connection pads to be used for mounting the wiring board on the surface of the external circuit board. The exposed faces of the laminated waveguide tubes of the two wiring boards are contacted with each other, and the connection pads at the bottoms of the wiring boards are connected and fixed to connection pads disposed on the surface of the external circuit board.

Abstract: An object of the invention is to provide a high-frequency line-waveguide converter in which a distance between a grounding conductor and a radiating conductor and a thickness of a dielectric layer of a high-frequency line can be freely set. A high-frequency line-waveguide converter for converting a high-frequency line to a waveguide comprises a high-frequency line including a first dielectric layer; a line conductor; and a grounding conductor; an opening portion of the grounding conductor; a second dielectric layer; a radiating conductor; a connecting conductor; a shielding conductor portion; and a waveguide.

Abstract: A high frequency package is arranged such that it comprises a dielectric substrate provided with an input terminal and an output terminal, a high frequency element mounted on the surface of the dielectric substrate, and a high frequency line formed on the dielectric substrate for connecting the high frequency element with the input terminal and with the output terminal, wherein a transmission characteristic from the input terminal to the output terminal has the property of cyclically varying in relation to frequency. The length of the high frequency line is regulated such that the frequency of signals transmitted along the high frequency line is located at a part of the cyclic variation curve of the transmission characteristic where transmittance is large. By arranging the structure in such a manner, loss of high frequency signals having frequencies of 10 GHz or more can be reduced.

Abstract: A high frequency wiring board having a high frequency transmission line having a signal conductor line formed on the surface of a dielectric board and a grounding layer formed inside or on the reverse surface of the dielectric board parallel to the signal conductor line, and a connecting terminal portion provided at a terminal end of the high frequency transmission line and including connecting grounding conductors formed with spacing on both sides of the signal conductor line and through conductors for connecting the connecting grounding and the grounding layer. The distance between the through conductors and an end side surface of the dielectric board is not more than 0.3 times the signal wavelength, in the dielectric board, of a high frequency signal.

Abstract: A high-frequency module comprising a high-frequency device-mounting package and an external circuit board, wherein said high-frequency device-mounting package includes a dielectric substrate having a first grounding layer contained therein, said dielectric substrate mounting a high-frequency device on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines connected to said high-frequency device, and having, formed on the other surface thereof, second high-frequency signal transmission lines coupled to said first high-frequency signal transmission lines; said external circuit board is constituted by a dielectric board having third high-frequency signal transmission lines and a second grounding layer, said third high-frequency signal transmission lines being formed on one surface of said dielectric board, and said second grounding layer being formed on the other surface of said dielectric board or inside thereof; and said high-frequency device-mounting pack

Abstract: A wiring board module has two wiring boards placed on an external circuit board. In each wiring board, a terminal end of a laminated waveguide tube is exposed at a lateral side of a dielectric substrate, thus forming an exposed face, and the dielectric substrate is provided at the bottom thereof in the vicinity of the exposed face with connection pads to be used for mounting the wiring board on the surface of the external circuit board. The exposed faces of the laminated waveguide tubes of the two wiring boards are contacted with each other, and the connection pads at the bottoms of the wiring boards are connected and fixed to connection pads disposed on the surface of the external circuit board.

Abstract: In a wiring substrate, a high-frequency component is carried on a dielectric board having a transmission line formed on its surface, a reverse surface of the dielectric board is formed with an opening in a predetermined cross-sectional shape, and a high-frequency connecting pad is formed around the opening. In the wiring board, a dielectric board penetrates a waveguide structure and has its inner wall coated with a conductor, and a high-frequency connecting pad is formed on a surface of the dielectric board. The wiring substrate is placed on the wiring board, and the respective high-frequency connecting pads are electrically connected to each other, to fabricate a module. Even when a low-cost material having a large dielectric loss tangent is used for the wiring board, a high-frequency signal can be prevented from being attenuated.

Abstract: A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to the external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

Abstract: A high frequency package is arranged such that it comprises a dielectric substrate provided with an input terminal and an output terminal, a high frequency element mounted on the surface of the dielectric substrate, and a high frequency line formed on the dielectric substrate for connecting the high frequency element with the input terminal and with the output terminal, wherein a transmission characteristic from the input terminal to the output terminal has the property of cyclically varying in relation to frequency. The length of the high frequency line is regulated such that the frequency of signals transmitted along the high frequency line is located at a part of the cyclic variation curve of the transmission characteristic where transmittance is large. By arranging the structure in such a manner, loss of high frequency signals having frequencies of 10 GHz or more can be reduced.