Abstract: An indoor unit included in an air conditioner that includes an outdoor unit includes a power receiving circuit (PR2), a low-frequency transmission and reception circuit as a first reception circuit, a high-frequency transmission and reception circuit as a transmission and reception circuit, and an inner-controller. The low-frequency transmission and reception circuit receives a current signal transmitted from an outdoor unit by using a current loop formed by a power line included in power supply wiring. For a first communication state in which physical connection between with the outdoor unit is recognized and a second communication state in which communication for operation of the air conditioner is performed between with the outdoor unit, the inner-controller selects use of the low-frequency transmission and reception circuit and the high-frequency transmission and reception circuit in the first communication state and the second communication state.

Abstract: A semiconductor device capable of preventing deterioration of a transistor caused by a flow of an overcurrent is provided. According to an embodiment, a semiconductor chip includes a first transistor provided between a high-potential side voltage terminal to which a constant voltage generated by reducing a power-supply voltage is supplied and an output terminal, a second transistor provided between a low-potential side voltage terminal to which a ground voltage is supplied and the output terminal, a control circuit controlling turning-on/off of the first and second transistors, a boosting circuit boosting the power-supply voltage by using a voltage of the output terminal to generate an output voltage, and an overvoltage detection circuit detecting an overvoltage of a power-supply line that couples the high-potential side voltage terminal and the first transistor to each other. The control circuit performs control to turn off the second transistor, when the overvoltage has been detected.

Abstract: A failure factor identification supporting apparatus includes a failure time point information obtaining unit (21) that obtains information regarding a failure occurrence time point at which a failure occurs in a field device (V1) located in a field; an event information obtaining unit (22) that obtains event information regarding, among one or more events that occur in the field, an event that occurs within a certain time range prior to the failure occurrence time point, and an event occurrence time point at which the event occurs; and a failure factor candidate output unit (23) that outputs the event information, obtained by the event information obtaining unit (22), as a failure factor candidate.

Abstract: A semiconductor device capable of preventing deterioration of a transistor caused by a flow of an overcurrent is provided. According to an embodiment, a semiconductor chip includes a first transistor provided between a high-potential side voltage terminal to which a constant voltage generated by reducing a power-supply voltage is supplied and an output terminal, a second transistor provided between a low-potential side voltage terminal to which a ground voltage is supplied and the output terminal, a control circuit controlling turning-on/off of the first and second transistors, a boosting circuit boosting the power-supply voltage by using a voltage of the output terminal to generate an output voltage, and an overvoltage detection circuit detecting an overvoltage of a power-supply line that couples the high-potential side voltage terminal and the first transistor to each other. The control circuit performs control to turn off the second transistor, when the overvoltage has been detected.

Abstract: An electric rotating machine includes a rotor, a stator, and a thermistor. The thermistor has a temperature measuring element portion that is fitted in a minute gap defined by connecting portions of segment conductors at a stator coil end. The stator coil end is formed by arranging a plurality of the segment conductors in slots of a stator core to thereby form connecting portions of the segment conductors at the end portion of the stator core. The thermistor is separated from the connecting portions of the segment conductors only by dead air that defines the minute gap.

Abstract: A failure factor identification supporting apparatus includes a failure time point information obtaining unit (21) that obtains information regarding a failure occurrence time point at which a failure occurs in a field device (V1) located in a field; an event information obtaining unit (22) that obtains event information regarding, among one or more events that occur in the field, an event that occurs within a certain time range prior to the failure occurrence time point, and an event occurrence time point at which the event occurs; and a failure factor candidate output unit (23) that outputs the event information, obtained by the event information obtaining unit (22), as a failure factor candidate.

Abstract: Provided is an electric rotating machine that is improved in the temperature detection accuracy of a thermistor and in ability to follow up a sudden change in the temperature of a stator winding. An electric rotating machine 100 includes a rotor 50 mounted on a rotating shaft rotatably supported and a stator 30 disposed around the outer circumference of the rotor via a minute clearance between the rotor and the stator. The stator 30 includes a stator core 32 having a plurality of slots formed in a circumferential direction, a stator winding 34 which connects a plurality of segment conductors inserted into the slots of the stator core, and a thermistor 38 which measures the temperature of the stator winding. The stator winding 34 has slot portions 21 received in the slots and connecting portions 23 each of which connects the end portions of the slot portions.

Abstract: A press die and a processing method of the press die surface, and a manufacturing method of a vehicle body of an automobile, are capable of maintaining a high non-defective product rate of works after press processing, even in a case in which foreign matter such as iron filings and the like have adhered to a die surface. A press die for sheet metal forming has a multitude of concave portions on a die surface, and has a roughness (Ry) of a die surface on which the multitude of concave portions has been formed of 30 to 38 ?m.

Abstract: In one embodiment, a semiconductor device includes a lead frame including a chip mounting portion and a lead portion separated from the chip mounting portion and having the same thickness as the chip mounting portion, a level of an upper face of the chip mounting portion being same as a level of an upper face of the lead portion. The device further includes a semiconductor chip mounted on the upper face of the chip mounting portion and electrically connected to the lead portion. The device further includes a molding resin which collectively seals up the lead frame and the semiconductor chip. The device further includes a metal film covering parts of rear faces of the chip mounting portion and the lead portion.

Abstract: An imaging apparatus selects either an FCP system, an RT system or a WT system, acquires latest battery capacity information and storage capacity information of an AV hard disk device (AVHDD) using either the FCP system, RT system or WT system, and informs a user about conditions of a battery and a storage capacity of the AVHDD. By providing such an imaging apparatus, the user can recognize the conditions of the battery and the storage capacity of the AVHDD.

Abstract: A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves.

Abstract: A piezoelectric resonator includes a pair of driving electrodes and a pair of lead electrodes that are formed facing each other on the frontside and backside of a piezoelectric plate that operates in a thickness-shear vibration mode. The front and back driving electrodes are formed such that they each have one or more pairs of parallel sides and have the same shape, and their centers face each other. The parallel sides of one of the front and back driving electrodes are formed parallel with either the X-axis or the Z?-axis of the piezoelectric plate, but the parallel sides of the other driving electrodes are formed without being parallel with the X-axis and Z?-axis thereof.

Abstract: A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves.

Abstract: A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves.

Abstract: A piezoelectric resonator includes a pair of driving electrodes and a pair of lead electrodes that are formed facing each other on the frontside and backside of a piezoelectric plate that operates in a thickness-shear vibration mode. The front and back driving electrodes are formed such that they each have one or more pairs of parallel sides and have the same shape, and their centers face each other. The parallel sides of one of the front and back driving electrodes are formed parallel with either the X-axis or the Z?-axis of the piezoelectric plate, but the parallel sides of the other driving electrodes are formed without being parallel with the X-axis and Z?-axis thereof.

Abstract: A press die and a processing method of the press die surface, and a manufacturing method of a vehicle body of an automobile, are capable of maintaining a high non-defective product rate of works after press processing, even in a case in which foreign matter such as iron filings and the like have adhered to a die surface. A press die for sheet metal forming has a multitude of concave portions on a die surface, and has a roughness (Ry) of a die surface on which the multitude of concave portions has been formed of 30 to 38 ?m.

Abstract: The present invention provides an imaging apparatus in which an acquiring system supported by an AV hard disk device (AVHDD) as an external storing device is detected, either an FCP system, an RT system or a WT system is selected, latest battery capacity information and storage capacity information of the AVHDD is acquired by using either the FCP system, RT system or WT system and conditions of a battery and a storage capacity of the AVHDD are informed to the user. By providing such an imaging apparatus, the user can recognize the conditions of the battery and the storage capacity of the AVHDD, thereby preventing recording of a photo-taken image from suddenly becoming impossible.

Abstract: A data output apparatus (a) sets an output terminal to a first state where a data format of the output terminal is locked to a data format indicated by a first command and where the output terminal cannot output video data whose data format is different from the data format indicated by the first command, if the first command is received from a first control device, and (b) sets the output terminal to a second state where the data format of the output terminal is not locked to the data format indicated by the first command and where the output terminal can output video data whose data format is different from the data format indicated by the first command, if the second command is received from a second control device while the data format of the output terminal is locked to the data format indicated by the first command.

Abstract: A data output apparatus receives a first command from a first device, and receives a second command from a second device. The apparatus (a) sets an output terminal to a locked state where a data format thereof is locked to a data format indicated by the first command and where the terminal cannot output video data whose data format is different, if the first command is received while the terminal is being set to an unlocked state, (b) determines whether a data format indicated by the second command is the same as the data format of the terminal, if the second command is received while the terminal is being set to the locked state, and (c) transmits a response for informing the second device that the second command is accepted, if the data format indicated by the second command is the same as the data format of the terminal.

Abstract: A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves.