Abstract: In bonding machines such as a wire bonding machine, a lock which makes the changing of bonding data impossible is placed on specific data setting mode items, which are stored in a memory, via a data setting mode locking circuit. The changing of data in such locked data setting modes is made possible only if a password inputted is the same as a previously set-in password.

Abstract: In inspecting a bend of a wire which is bonded to, for example, a semiconductor device, a straight scale line with scale markings of constant intervals and a bonded-point line, both lines crossing each other at right angles, are shown on a monitor. An image of a wire that has a bend is monitored by a camera and displayed on a monitor. By overlapping the image of the bend of the wire on the scale line and then reading a scale marking which is closest to the bend of the wire, it is possible to ascertain the amount of the bend of the wire.

Abstract: In a bonding method used in manufacturing semiconductor devices, after a bonding wire is connected to a first bonding point, a capillary is moved straight up and then moved away from a second bonding point, thus making a first reverse action. From there, the capillary is again raised and a second reverse action is performed so that the capillary is moved again in the direction opposite to the second bonding point. The capillary is further raised with feeding out the wire for the length which is enough to make a wire loop, and then the capillary is moved down to the second bonding point where the bonding is performed.

Abstract: A wire bonding method in which a bonding tool is lowered fast toward a bonding surface and the lowering speed of the bonding tool is then reduced at a speed-change point near the bonding surface, wherein a bonding level at which the bonding tool contacts with the bonding surface is detected and stored in a memory, and the following speed-change points of the lowering motion of the bonding tool are automatically determined in accordance with the previously detected bonding level.

Abstract: A wire bonding method for connecting a first bonding point and a second bonding point via a wire including the steps of first connecting the wire to the first bonding point, raising a capillary slightly and moving it slightly away from the second bonding point, raising the capillary further by an amount sufficient for forming the wire loop with the wire being played out, moving the capillary over the second bonding point along a circular track which has a radius sufficient for forming the wire loop, and connecting the wire to the second bonding point.