Patents by Inventor Shinichi Kuroki

Shinichi Kuroki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912922
    Abstract: A showcase includes a refrigerant circuit and a refrigerant enclosed in the refrigerant circuit. The refrigerant circuit includes a compressor (121), a radiator (122), an expansion valve (123), and an evaporator (124). The refrigerant is a low-GWP refrigerant.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 27, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Shinichi Fujinaka, Masaru Tanaka, Shun Ohkubo, Mitsushi Itano, Yuuki Yotsumoto, Akihito Mizuno, Tomoyuki Gotou, Yasufu Yamada, Hitomi Kuroki, Tatsumi Tsuchiya, Kenji Gobou, Daisuke Karube, Tatsuya Takakuwa
  • Patent number: 11692378
    Abstract: Provided is a vehicular door outer handle device including a handle body having a housing recess, a handle cover covering the handle body from the outside, a base member fixed to a vehicle door, and a support arm connected to one end in a longitudinal direction of the handle body and rotatably supported by the base member via a support shaft. A slit through which a harness connected to an electronic component housed in the housing recess is inserted is formed in the one end of the handle body and in the support arm. Although there is provided the slit that facilitates assembly work of the harness, reduction in strength is prevented while avoiding an increase in the number of parts. A handle cover 14 is integrally provided with a first reinforcing portion 55 that is fitted into a slit 51 so as to contact, or to approach and face, both side surfaces of the slit 51.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: July 4, 2023
    Assignee: KABUSHIKI KAISHA HONDA LOCK
    Inventors: Masatoshi Yoshida, Kyohei Yanagita, Shinichi Kuroki
  • Publication number: 20210285265
    Abstract: Provided is a vehicular door outer handle device including a handle body having a housing recess, a handle cover covering the handle body from the outside, a base member fixed to a vehicle door, and a support arm connected to one end in a longitudinal direction of the handle body and rotatably supported by the base member via a support shaft. A slit through which a harness connected to an electronic component housed in the housing recess is inserted is formed in the one end of the handle body and in the support arm. Although there is provided the slit that facilitates assembly work of the harness, reduction in strength is prevented while avoiding an increase in the number of parts. A handle cover 14 is integrally provided with a first reinforcing portion 55 that is fitted into a slit 51 so as to contact, or to approach and face, both side surfaces of the slit 51.
    Type: Application
    Filed: July 3, 2019
    Publication date: September 16, 2021
    Inventors: Masatoshi YOSHIDA, Kyohei YANAGITA, Shinichi KUROKI
  • Patent number: 5741597
    Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond--is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: April 21, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadahiko Sakai, Shinichi Kuroki
  • Patent number: 5447267
    Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond, is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: September 5, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadahiko Sakai, Shinichi Kuroki