Patents by Inventor Shinichi Masui

Shinichi Masui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130042949
    Abstract: A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 21, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Seigi Aoyama, Hiromitsu Kuroda, Toru Sumi, Keisuke Fujito, Ryohei Okada, Shinichi Masui
  • Patent number: 8143517
    Abstract: An extra-fine copper alloy twisted wire including a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires including 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further including a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire includes a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: March 27, 2012
    Assignee: Hitachi Cable, Ltd.
    Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa
  • Publication number: 20090223713
    Abstract: An extra-fine copper alloy twisted wire comprising a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires comprising 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further comprising a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire comprises a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.
    Type: Application
    Filed: April 8, 2009
    Publication date: September 10, 2009
    Applicant: Hitachi Cable, Ltd.
    Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa
  • Patent number: 7544886
    Abstract: An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1??h1/?h0)×100%] where ?h1 is a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and ?h0 is a tensile strength of the wire measured before the heat treatment.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: June 9, 2009
    Assignee: Hitachi Cable, Ltd.
    Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa
  • Publication number: 20070187134
    Abstract: An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1??h1/?h0)×100%] where ?h1 is a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and ?h0 is a tensile strength of the wire measured before the heat treatment.
    Type: Application
    Filed: December 19, 2006
    Publication date: August 16, 2007
    Applicant: HITACHI CABLE, LTD.
    Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa