Abstract: There is provided a solid-state imaging device including: a first semiconductor layer including a photoelectric converter and an electric charge accumulation section for each pixel, the electric charge accumulation section in which a signal electric charge generated in the photoelectric converter is accumulated; a pixel separation section that is provided in the first semiconductor layer, and partitions a plurality of the pixels from each other; a second semiconductor layer that is provided with a pixel transistor and is stacked on the first semiconductor layer, the pixel transistor that reads the signal electric charge of the electric charge accumulation section; and a first shared coupling section that is provided between the second semiconductor layer and the first semiconductor layer, and is provided to straddle the pixel separation section and is electrically coupled to a plurality of the electric charge accumulation sections.

Abstract: The present invention relates to a method of automatically determining a measurement recipe for a feature, such as a dimension of a pattern formed on a workpiece, such as a wafer, a mask, a panel, or a substrate. This method includes: determining a type of a CAD pattern (101) and a measurement recipe based on a relative position of a measurement point (111) and the CAD pattern (101) on a coordinate system defined in design data, and an area of the CAD pattern (101); aligning a real pattern (121) on an image corresponding to the CAD pattern (101) with the CAD pattern (101); and measuring a feature of the real pattern (121) according to the determined measurement recipe.

Abstract: A method which can generate a clear image of a specimen by correcting an image drift is disclosed. The image generation method includes: scanning a specimen with an electron beam to generate images; calculating amounts of image drift within specific regions of the respective images; calculating continuous amounts of image drift by interpolation from the amounts of image drift; determining an amount of image drift at each pixel of the images from the continuous amounts of image drift; correcting the images by correcting a brightness of each pixel based on the amount of image drift at each pixel; and generating a synthetic image from the corrected images.

Abstract: A method which can generate a clear image of a specimen by correcting an image drift is disclosed. The image generation method includes: scanning a specimen with an electron beam to generate images; calculating amounts of image drift within specific regions of the respective images; calculating continuous amounts of image drift by interpolation from the amounts of image drift; determining an amount of image drift at each pixel of the images from the continuous amounts of image drift; correcting the images by correcting a brightness of each pixel based on the amount of image drift at each pixel; and generating a synthetic image from the corrected images.

Abstract: First imposition data are referred to in order to judge whether or not side stitching is included in a first processing sequence. If it is determined that side stitching is included in the first processing sequence, a job including a printing process and a sheet folding process is defined with respect to each signature to be side-stitched. Print data corresponding to a second sheet are generated with respect to each job.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing edges of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing edges of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A pattern inspection apparatus is used for inspecting a pattern, such as semiconductor integrated circuit (LSI), liquid crystal panel, and a photomask by using an image of the pattern to-be-inspected and design data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device for generating a reference pattern represented by one or more lines from design data, an image generation device for generating the image of the pattern to-be-inspected, a detecting device for detecting an edge of the image of the pattern to-be-inspected, and an inspection device for inspecting the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected.

Abstract: A pattern inspection apparatus is used for inspecting a pattern, such as semiconductor integrated circuit (LSI), liquid crystal panel, and a photomask by using an image of the pattern to-be-inspected and design data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device for generating a reference pattern represented by one or more lines from design data, an image generation device for generating the image of the pattern to-be-inspected, a detecting device for detecting an edge of the image of the pattern to-be-inspected, and an inspection device for inspecting the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A method of disposing of combustible materials. The method includes the steps of: providing a heating space; providing a first source to generate heat to a first predetermined level at a first location in the heating space sufficient to reconstitute the combustible materials to a molten slag at the first location and so that heat generated by the first source elevates the temperature at a second location within the heating space to a second predetermined heat level that is below the predetermined heat level and high enough to cause combustion of the combustible materials; directing combustible materials to the second location at which the combustible materials are combusted to produce ash; and causing the ash to be directed to the first location to be reconstituted as molten slag.

Abstract: A method of disposing of combustible materials. The method includes the steps of: providing a heating space; providing a first source to generate heat to a first predetermined level at a first location in the heating space sufficient to reconstitute the combustible materials to a molten slag at the first location and so that heat generated by the first source elevates the temperature at a second location within the heating space to a second predetermined heat level that is below the predetermined heat level and high enough to cause combustion of the combustible materials; directing combustible materials to the second location at which the combustible materials are combusted to produce ash; and causing the ash to be directed to the first location to be reconstituted as molten slag.

Abstract: A method of disposing of combustible materials. The method includes the steps of: providing a heating space; providing a first source to generate heat to a first predetermined level at a first location in the heating space sufficient to reconstitute the combustible materials to a molten slag at the first location and so that heat generated by the first source elevates the temperature at a second location within the heating space to a second predetermined heat level that is below the predetermined heat level and high enough to cause combustion of the combustible materials; directing combustible materials to the second location at which the combustible materials are combusted to produce ash; and causing the ash to be directed to the first location to be reconstituted as molten slag.