Abstract: A printed wiring board with an increased strength of solder is provided by preventing solder bridge formation and increasing the amount of solder adherent thereto. A land (1) serving as a soldering foundation is formed in a star-shape, to minimize the proximal peripheral length (L2) between adjacent lands spaced distance (L1) apart, thus reducing the possibility of solder bridge formation. Since the star-shaped land (1) has a greater area than a rhombic land of identical size, the amount of solder adherent thereto is greater than that of the rhombic land, thus enabling to increase the strength of solder.

Abstract: A sheet metal component (8) for pattern conduction comprises a lead portion (8a) that is connected to an end portion of a first portion (8c1) of a ceiling portion (8c) by a coupling portion (8d) forming a first bend (R1); and a portion to be soldered (8b) that is bent inwardly from an end portion (8c2E, 8c3E) of a longitudinally protruding second portion (8c2, 8c3) of the ceiling portion (8c), which is connected to the first portion (8c1), so as to form a second bend (R2).