Patents by Inventor Shinichi Oe
Shinichi Oe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8553738Abstract: In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount.Type: GrantFiled: December 28, 2007Date of Patent: October 8, 2013Assignee: Mitsubishi Electric CorporationInventors: Shinichi Oe, Motoaki Tamaya, Akira Nakamura, Keiichi Fukuda
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Patent number: 8419493Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.Type: GrantFiled: April 6, 2012Date of Patent: April 16, 2013Assignee: Mitsubishi Electric CorporationInventors: Shinichi Oe, Kazutaka Ikeda, Akira Nakamura, Motoaki Tamaya
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Patent number: 8314378Abstract: A light source manufacturing apparatus, which manufactures a light source device by adhering a laser device and a wavelength converting device that converts the laser light emitted by the laser device to laser light of a different wavelength, includes a first stage that holds the wavelength converting device, a second stage that holds the laser device, a power meter that measures the amount of laser light emitted by the wavelength converting device, a light receiving device that detects the drive waveform of the laser light, and a controlling unit that changes relative positions of the first stage and the second stage in such a manner that the amount of laser light measured by the power meter is a predetermined value or greater and the drive waveform detected by the light receiving device falls within a reference range.Type: GrantFiled: May 19, 2010Date of Patent: November 20, 2012Assignee: Mitsubishi Electric CorporationInventors: Shinichi Oe, Kazutaka Ikeda, Akira Nakamura, Takayuki Yanagisawa
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Patent number: 8292686Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.Type: GrantFiled: August 6, 2010Date of Patent: October 23, 2012Assignee: Mitsubishi Electric CorporationInventors: Shinichi Oe, Kazutaka Ikeda, Akira Nakamura, Motoaki Tamaya
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Publication number: 20120263200Abstract: A laser module includes: a heat sink that releases heat from a member in contact with the heat sink; a sub-mount substrate that is disposed on the heat sink and made of an insulating material; a feeding layer that is disposed on the sub-mount substrate; and a laser diode array that has plural light-emitting portions disposed on the feeding layer in a parallel arrangement. A linear expansion coefficient of the sub-mount substrate is made smaller than a linear expansion coefficient of the laser diode array, and the linear expansion coefficient of the sub-mount substrate in a state connected to the heat sink having a larger linear expansion coefficient than the laser diode array is set to fall within a predetermined range including the linear expansion coefficient of the laser diode array.Type: ApplicationFiled: December 16, 2010Publication date: October 18, 2012Applicant: Mitsubishi Electric CorporationInventors: Motoaki Tamaya, Chise Nanba, Takayuki Yanagisawa, Shinichi Oe, Shuhei Yamamoto, Akira Yokoyama
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Patent number: 8284806Abstract: Because a reflector that reflects a fundamental wave generated from a solid-state laser element and forms an optical resonator is disposed on an exit surface of a wavelength conversion element, the fundamental wave cannot be resonated and amplified in a stage before the wavelength conversion element is joined to the solid-state laser element. As a result, a problem is created in that the solid-state laser element emits low level light output, so that a relative position of the semiconductor laser and the solid-state laser element cannot properly be adjusted. In order to overcome the above problem, even in the stage before joining the wavelength conversion element to the solid-state laser element, the invention enables the semiconductor laser and the solid-state laser element to be joined by properly adjusting the relative position of the laser and the laser element.Type: GrantFiled: August 6, 2010Date of Patent: October 9, 2012Assignee: Mitsubishi Electric CorporationInventors: Kazutaka Ikeda, Shinichi Oe, Akira Nakamura, Motoaki Tamaya
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Publication number: 20120192403Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.Type: ApplicationFiled: April 6, 2012Publication date: August 2, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shinichi OE, Kazutaka Ikeda, Akira Nakamura, Motoaki Tamaya
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Patent number: 8233512Abstract: A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.Type: GrantFiled: December 21, 2007Date of Patent: July 31, 2012Assignee: Mitsubishi Electric CorporationInventors: Motoaki Tamaya, Keiichi Fukuda, Shinichi Oe, Chise Nanba, Akira Nakamura
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Publication number: 20110119899Abstract: A light source manufacturing apparatus, which manufactures a light source device by adhering a laser device and a wavelength converting device that converts the laser light emitted by the laser device to laser light of a different wavelength, includes a first stage that holds the wavelength converting device, a second stage that holds the laser device, a power meter that measures the amount of laser light emitted by the wavelength converting device, a light receiving device that detects the drive waveform of the laser light, and a controlling unit that changes relative positions of the first stage and the second stage in such a manner that the amount of laser light measured by the power meter is a predetermined value or greater and the drive waveform detected by the light receiving device falls within a reference range.Type: ApplicationFiled: May 19, 2010Publication date: May 26, 2011Applicant: Mitsubishi Electric CorporationInventors: Shinichi Oe, Kazutaka Ikeda, Akira Nakamura, Takayuki Yanagisawa
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Publication number: 20110122898Abstract: Because a reflector that reflects a fundamental wave generated from a solid-state laser element and forms an optical resonator is disposed on an exit surface of a wavelength conversion element, the fundamental wave cannot be resonated and amplified in a stage before the wavelength conversion element is joined to the solid-state laser element. As a result, a problem is created in that the solid-state laser element emits low level light output, so that a relative position of the semiconductor laser and the solid-state laser element cannot properly be adjusted. In order to overcome the above problem, even in the stage before joining the wavelength conversion element to the solid-state laser element, the invention enables the semiconductor laser and the solid-state laser element to be joined by properly adjusting the relative position of the laser and the laser element.Type: ApplicationFiled: August 6, 2010Publication date: May 26, 2011Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Kazutaka IKEDA, Shinichi OE, Akira NAKAMURA, Motoaki TAMAYA
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Publication number: 20110124259Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.Type: ApplicationFiled: August 6, 2010Publication date: May 26, 2011Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shinichi OE, Kazutaka IKEDA, Akira NAKAMURA, Motoaki TAMAYA
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Publication number: 20110007762Abstract: To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the comb-shaped submount is placed between the heat sink and the comb-shaped submount. With this configuration, a thermal stress acting between the comb-shaped submount and the device mounted thereon is relaxed, and as a result, long-term reliability of bonding parts between the comb-shaped submount and the device is enhanced.Type: ApplicationFiled: March 14, 2008Publication date: January 13, 2011Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Keiichi Fukuda, Motoaki Tamaya, Shinichi Oe, Tsuneo Hamaguchi, Akira Nakamura
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Publication number: 20100260218Abstract: In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount.Type: ApplicationFiled: December 28, 2007Publication date: October 14, 2010Applicant: Mitsubishi Electric CorporationInventors: Shinichi Oe, Motoaki Tamaya, Akira Nakamura, Keiichi Fukuda
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Publication number: 20100260226Abstract: A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.Type: ApplicationFiled: December 21, 2007Publication date: October 14, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Motoaki Tamaya, Keiichi Fukuda, Shinichi Oe, Chise Nanba, Akira Nakamura