Patents by Inventor Shinichi Ohshima

Shinichi Ohshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12136640
    Abstract: There is provided a solid-state imaging device including: a first semiconductor layer including a photoelectric converter and an electric charge accumulation section for each pixel, the electric charge accumulation section in which a signal electric charge generated in the photoelectric converter is accumulated; a pixel separation section that is provided in the first semiconductor layer, and partitions a plurality of the pixels from each other; a second semiconductor layer that is provided with a pixel transistor and is stacked on the first semiconductor layer, the pixel transistor that reads the signal electric charge of the electric charge accumulation section; and a first shared coupling section that is provided between the second semiconductor layer and the first semiconductor layer, and is provided to straddle the pixel separation section and is electrically coupled to a plurality of the electric charge accumulation sections.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: November 5, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Keiichi Nakazawa, Koichiro Zaitsu, Nobutoshi Fujii, Yohei Hiura, Shigetaka Mori, Shintaro Okamoto, Keiji Ohshima, Shuji Manda, Junpei Yamamoto, Yui Yuga, Shinichi Miyake, Tomoki Kambe, Ryo Ogata, Tatsuki Miyaji, Shinji Nakagawa, Hirofumi Yamashita, Yasushi Hamamoto, Naohiko Kimizuka
  • Publication number: 20240290813
    Abstract: An optical detection device including a through electrode is provided. The optical detection device includes a first semiconductor layer having a photoelectric conversion region, a first surface, and a second surface that is a light entrance surface, a second semiconductor layer with a third surface and a fourth surface, a second wiring layer overlapped with the third surface, a third wiring layer overlapped with the fourth surface, a first wiring layer with one surface overlapped with the first surface and another surface overlapped with one of the second wiring layer and the third wiring layer, a first conductor that has a first width, includes a first material, and penetrates the second semiconductor layer in a thickness direction, and a second conductor that has a second width smaller than the first width, includes a second material different from the first material, and penetrates the second semiconductor layer in the thickness direction.
    Type: Application
    Filed: June 16, 2022
    Publication date: August 29, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masaki HANEDA, Kengo KOTOO, Yoshiki SHIRASU, Kazuki SHIMOMURA, Nobutoshi FUJII, Takaaki HIRANO, Yosuke FUJII, Takashi OINOUE, Suguru SAITO, Toshiyuki ISHIMARU, Keiji OHSHIMA, Shinichi IMAI, Takuya KUROTORI, Tomohiro SUGIYAMA, Ikue MITSUHASHI, Kenichi TOKUOKA
  • Patent number: 12005965
    Abstract: The present disclosure provides a body structure for a vehicle capable of improving a vibration damping effect by a damping member while preventing an increase in an application amount of the damping member and a shape change of a component. Embodiments include a body structure for a vehicle in which a first bonded surface of a first body component and a second bonded surface of a second body component are bonded via a damping member, with which a portion between the first bonded surface and the second bonded surface is filled. The first bonded surface of the first body component has a vertical wall extending toward the second bonded surface or away from the second bonded surface. The portion between the first bonded surface and the second bonded surface is filled with the damping member such that the damping member contacts the vertical wall.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: June 11, 2024
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Yuji Miyoshi, Kohya Nakagawa, Tomoya Yoshida, Koki Kagimoto, Shinichi Ohshima
  • Publication number: 20230022738
    Abstract: The present disclosure provides a body structure for a vehicle capable of improving a vibration damping effect by a damping member while preventing an increase in an application amount of the damping member and a shape change of a component. Embodiments include a body structure for a vehicle in which a first bonded surface of a first body component and a second bonded surface of a second body component are bonded via a damping member, with which a portion between the first bonded surface and the second bonded surface is filled. The first bonded surface of the first body component has a vertical wall extending toward the second bonded surface or away from the second bonded surface. The portion between the first bonded surface and the second bonded surface is filled with the damping member such that the damping member contacts the vertical wall.
    Type: Application
    Filed: November 24, 2020
    Publication date: January 26, 2023
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Yuji MIYOSHI, Kohya NAKAGAWA, Tomoya YOSHIDA, Koki KAGIMOTO, Shinichi OHSHIMA
  • Patent number: 7347167
    Abstract: A method for controlling a cooling system for an internal combustion engine having first and second cooling fans is provided, comprising operating the first cooling fan at a first rotational frequency which is greater than a combustion frequency of the internal combustion engine and operating the second cooling fan at a second rotational frequency which is less than the combustive vibration frequency of the internal combustion engine. Since the rotational frequencies of the first and second cooling fans are different from the combustion frequency of the internal combustion engine, the resonance between the rotational vibration of the cooling fans and the combustive vibration of the internal combustion engine may be prevented. Also, since the rotational frequencies of the first and second cooling fans are different from each other so that the resonance between their rotational vibrations may be prevented.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: March 25, 2008
    Assignee: Mazda Motor Corporation
    Inventors: Kazuya Sugiyama, Eiji Kosaka, Shinichi Ohshima, Tatsunori Iwasaki
  • Publication number: 20060191500
    Abstract: A method for controlling a cooling system for an internal combustion engine having first and second cooling fans is provided, comprising operating the first cooling fan at a first rotational frequency which is greater than a combustion frequency of the internal combustion engine and operating the second cooling fan at a second rotational frequency which is less than the combustive vibration frequency of the internal combustion engine. Since the rotational frequencies of the first and second cooling fans are different from the combustion frequency of the internal combustion engine, the resonance between the rotational vibration of the cooling fans and the combustive vibration of the internal combustion engine may be prevented. Also, since the rotational frequencies of the first and second cooling fans are different from each other so that the resonance between their rotational vibrations may be prevented.
    Type: Application
    Filed: February 10, 2006
    Publication date: August 31, 2006
    Applicant: Mazda Motor Corporation
    Inventors: Kazuya Sugiyama, Eiji Kosaka, Shinichi Ohshima, Tatsunori Iwasaki