Abstract: An analog-to-digital converter includes: a first to an (m+1)-th capacitive element each of which has a first end connected to a first terminal of a comparison circuit and have a predetermined capacitance ratio; and selection circuits which are connected to second ends of the capacitive elements, respectively. Each of the capacitive elements includes: a first electrode disposed in a semiconductor substrate and electrically connected to the second end; a third electrode disposed above the semiconductor substrate to oppose the first electrode and electrically connected to the second end; a second electrode disposed between the first electrode and the third electrode, above the semiconductor substrate, and electrically connected to the first end; a first insulation film disposed between the first and second electrodes; and a second insulation film disposed between the third and second electrodes.

Abstract: An analog-to-digital converter includes: a first to an (m+1)-th capacitive element each of which has a first end connected to a first terminal of a comparison circuit and have a predetermined capacitance ratio; and selection circuits which are connected to second ends of the capacitive elements, respectively. Each of the capacitive elements includes: a first electrode disposed in a semiconductor substrate and electrically connected to the second end; a third electrode disposed above the semiconductor substrate to oppose the first electrode and electrically connected to the second end; a second electrode disposed between the first electrode and the third electrode, above the semiconductor substrate, and electrically connected to the first end; a first insulation film disposed between the first and second electrodes; and a second insulation film disposed between the third and second electrodes.

Abstract: The present solid-state imaging apparatus includes: a light receiving element with a photoelectric conversion function; a readout circuit that reads out pixel information from the light receiving element, and outputs an output voltage; a CDS circuit that is composed of three-stage common source circuits, and generates a pixel signal based on a difference between an output voltage output from the readout circuit at the time of reset and an output voltage output based on the readout of the pixel information, the three-stage common source circuits being connected in series to one another and provided with direct-current cut elements that are each disposed on a corresponding one of input paths of the three-stage common source circuits; and a bias voltage supply circuit that supplies a direct-current bias voltage to gates of transistors of the three-stage common source circuits.

Abstract: The present solid-state imaging apparatus includes: a light receiving element with a photoelectric conversion function; a readout circuit that reads out pixel information from the light receiving element, and outputs an output voltage; a CDS circuit that is composed of three-stage common source circuits, and generates a pixel signal based on a difference between an output voltage output from the readout circuit at the time of reset and an output voltage output based on the readout of the pixel information, the three-stage common source circuits being connected in series to one another and provided with direct-current cut elements that are each disposed on a corresponding one of input paths of the three-stage common source circuits; and a bias voltage supply circuit that supplies a direct-current bias voltage to gates of transistors of the three-stage common source circuits.