Patents by Inventor Shinichi Sueyoshi

Shinichi Sueyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anodic bonding method and method of producing acceleration sensor
    Patent number: 8785292
    Abstract: An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: July 22, 2014
    Assignee: Lapis Semiconductor Co., Ltd.
    Inventor: Shinichi Sueyoshi
  • ANODIC BONDING METHOD AND METHOD OF PRODUCING ACCELERATION SENSOR
    Publication number: 20090311818
    Abstract: An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
    Type: Application
    Filed: August 20, 2009
    Publication date: December 17, 2009
    Inventor: Shinichi SUEYOSHI
  • Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor
    Patent number: 7595545
    Abstract: An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: September 29, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Shinichi Sueyoshi
  • Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor
    Publication number: 20060228824
    Abstract: An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
    Type: Application
    Filed: March 15, 2006
    Publication date: October 12, 2006
    Inventor: Shinichi Sueyoshi