Patents by Inventor Shin-Ichi Tokumoto

Shin-Ichi Tokumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4113582
    Abstract: A high valency salt, such as TiCl.sub.4 is reduced to a lower valency salt, such as TiCl.sub.2 and/or TiCl.sub.3 within a fused salt electrolytic bath via electrolysis so that an improved electrodeposition of a desired metal or alloy, such as Ti, occurs, from such adjusted bath. The process generally comprises adding a higher valency salt of a desired metal or alloy to a fused salt electrolytic bath, reducing the higher valency salt on a cathode electrode to a lower valency salt, removing the so-produced lower valency salt from the electrode surface and maintaining a predetermined amount of the lower valency salt within the electrolytic bath. Electrodeposition of a desired metal or alloy may then take place from such electrolytic bath containing a so-adjusted amount of the lower valency salt.
    Type: Grant
    Filed: June 1, 1977
    Date of Patent: September 12, 1978
    Assignee: Sony Corporation
    Inventors: Shin-ichi Tokumoto, Eiji Tanaka, Tatsuo Kikuchi, Kenji Ogisu, Toshiro Tsumori
  • Patent number: 4113581
    Abstract: An electroposition process wherein solid metallic particles are produced in a fused salt electrolytic bath and dispersed therein to electrodeposit a metal or alloy thereof on a cathode so that the surface of the deposit is maintained smooth and flat. In order to produce particles of a desired metal or alloy, an auxiliary electrolytic means may be provided within an electrolytic cell so that such particles are generated in situ within the fused bath of such cell.
    Type: Grant
    Filed: May 31, 1977
    Date of Patent: September 12, 1978
    Assignee: Sony Corporation
    Inventors: Shin-Ichi Tokumoto, Eiji Tanaka, Tatsuo Kikuchi, Kenji Ogisu, Toshiro Tsumori
  • Patent number: 4082628
    Abstract: In the electrodeposition of titanium metal from an electrolyte containing one or more dissolved or fused titanium chlorides and other dissolved or fused chloride salts, such as, MgCl.sub.2,CaCl.sub.2,NaCl, and the like; the hardness of the electrodeposited titanium is adjusted by adding to the electrolyte one or more oxides, such as titanium oxide and oxides of alkaline and alkaline-earth metals, and/or one or more fluorides of alkaline and alkaline-earth metals.
    Type: Grant
    Filed: May 26, 1976
    Date of Patent: April 4, 1978
    Assignee: Sony Corporation
    Inventors: Shin-ichi Tokumoto, Eiji Tanaka, Tatsuo Kikuchi, Kenji Ogisu, Toshiro Tsumori
  • Patent number: 4049530
    Abstract: An electrolyzer is provided with a vessel containing an electrolyte and in which a lower temperature portion and a higher temperature portion are respectively defined, and with stirring devices or the like for forming circular flows of the electrolyte within the lower and higher temperature portions respectively and for circulating the electrolyte between the lower and higher temperature portions to permit the electrolysis to be carried out.
    Type: Grant
    Filed: September 26, 1975
    Date of Patent: September 20, 1977
    Assignee: Sony Corporation
    Inventors: Shin-Ichi Tokumoto, Eiji Tanaka, Kenji Ogisu, Masahisa Enomoto
  • Patent number: 4049507
    Abstract: An electrodeposition method of electrodepositing a material with a flat and smooth surface, in which an electrolytic condition such as a speed of movement of a cathode relative to an electrolyte, an electrolytic current density, a duty ratio of an interrupted electrolytic current or an interruption frequency of an electrolytic current is changed periodically from a normal value to another value and back again.
    Type: Grant
    Filed: September 15, 1975
    Date of Patent: September 20, 1977
    Assignee: Sony Corporation
    Inventors: Shin-Ichi Tokumoto, Eiji Tanaka, Kenji Ogisu, Tadao Fujita
  • Patent number: 4016052
    Abstract: In an electrodeposition process using a fused-salt electrolyte in which a desired metal or alloy deposited by electrolysis can be dissolved, and/or using a fused-salt electrolyte from which a highly viscous material is produced on the surface of an electrodeposited metal or alloy upon electrodeposition of the desired metal or alloy, solid particles are dispersed in the aforesaid electrolyte in order to obtain a flat surface of the desired electrodeposited metal or alloy, whereby continuous electrodeposition can be carried out.
    Type: Grant
    Filed: November 17, 1975
    Date of Patent: April 5, 1977
    Assignee: Sony Corporation
    Inventors: Shin-Ichi Tokumoto, Eiji Tanaka, Kenji Ogisu, Hiroji Kawai