Abstract: A medical apparatus for estimating a mental/neurological disease with high precision is provided. This medical apparatus includes a computational processing device, a recording device having an estimation program which causes the computational processing device to execute processing recorded therein, a calculation unit configured to calculate a score of a subject, a detection unit configured to detect a disease whose score exceeds a reference range, and an estimation unit configured to estimate a mental/neurological disease.

Abstract: In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

Abstract: In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

Abstract: In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

Abstract: In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

Abstract: Provided is a semiconductor module (A), including: a substrate (1) having an electronic component (2) mounted on an upper surface thereof; an encapsulation resin layer (3) having an insulating property, for encapsulating the upper surface; an exterior shielding member (4) having conductivity, for covering a side of the encapsulation resin layer (3) opposite to the substrate (1); and a connection portion (5), which is provided inside the encapsulation resin layer (3), for electrically connecting the exterior shielding member (4) and a ground terminal (13) provided to the substrate (1).

Abstract: A substrate member is a manufacturing component of a module including electronic components mounted on a substrate and sealed with resin. The substrate member has substantially a plate-like shape and is to be the substrate later. A manufacturing process of the modules includes a mounting step of mounting electronic components on a component side of the substrate member, and a sealing step of supplying resin to flow on the component side so that the mounted electronic components are sealed with the resin. The mounting step includes mounting a first electronic component having substantially a flat mounting surface in a first mounting region specified on the component side so that a gap is formed between the mounting surface and the component side. The component side is provided with a first groove for boosting the resin to fill up the gap in the sealing step. Thus, insufficient filling of the resin in the gap between the substrate member and the electronic component is suppressed.

Abstract: An optical pickup device has first and second light sources that emit first and second laser beams of different wavelengths, an object lens that concentrates the first and second laser beams on a data recording surface of an optical disk, an optical separator disposed between the first and second light sources and the object lens, and an optical monitor that detects a quantity of light of the second laser beam. The optical separator has a wavelength selecting film that, on one hand, reflects the first laser beam emitted from the first light source toward the object lens and, on the other hand, transmits the second laser beam emitted from the second light source to the object lens, and a reflector that reflects a part of the second laser beam emitted from the second light source toward the optical monitor.

Abstract: An optical pickup device has first and second light sources that emit first and second laser beams of different wavelengths, an object lens that concentrates the first and second laser beams on a data recording surface of an optical disk, an optical separator disposed between the first and second light sources and the object lens, and an optical monitor that detects a quantity of light of the second laser beam. The optical separator has a wavelength selecting film that, on one hand, reflects the first laser beam emitted from the first light source toward the object lens and, on the other hand, transmits the second laser beam emitted from the second light source to the object lens, and a reflector that reflects a part of the second laser beam emitted from the second light source toward the optical monitor.

Abstract: An optical pick-up device comprising: at least two light sources for emitting laser beams of different wavelengths; a beam splitter for reflecting or transmitting the light beams from the light sources; the beam splitter including a wavelength selecting film which reflects substantially all of the light beam from one of the light sources and transmits substantially all of the light beam from the other light source, a collimator lens for collimating the light beams reflected or transmitted by the beam splitter; a rising mirror for reflecting the light beams collimated at the collimator lens for rising; an objective lens for transmitting the laser beams reflected at the rising mirror, at least two reflecting mirrors for reflecting, in advance, the light beam unnecessary for rising before entering the beam splitter, when the light beam is reflected at the rising mirror after being emitted from each light source and passing through the beam splitter and the collimator lens; and a front monitor PD for receiving th

Abstract: An optical pickup device has first and second light sources that emit first and second laser beams of different wavelengths, an object lens that concentrates the first and second laser beams on a data recording surface of an optical disk, an optical separator disposed between the first and second light sources and the object lens, and an optical monitor that detects a quantity of light of the second laser beam. The optical separator has a wavelength selecting film that, on one hand, reflects the first laser beam emitted from the first light source toward the object lens and, on the other hand, transmits the second laser beam emitted from the second light source to the object lens, and a reflector that reflects a part of the second laser beam emitted from the second light source toward the optical monitor.