Abstract: A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder contains a noble metal powder such as an Ag powder and a base metal powder containing Cu and/or Ni, and the base metal powder has a specific surface area of less than 0.5 m2/g. The content of the base metal powder with respect to the total amount of the conductive powder is, in ratio by weight, 0.1 to 0.3 when the base metal powder contains Cu as its main constituent, 0.1 to 0.2 when the base metal powder contains Ni as its main constituent, and 0.1 to 0.25 when the base metal powder contains a mixed powder of Cu and Ni as its main constituent.

Abstract: A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder is a mixed powder of an atomized powder prepared by an atomization method and a wet reduced powder prepared by a wet reduction method and the conductive powder contains the atomized powder in the range of 5 to 40 wt %. The atomized powder is 5.2 to 9 ?m in average particle size and the content of a chlorine component mixed in the conductive powder is 42 ppm or less. The conductive paste is applied in the form of a line onto a glass substrate 1 and subjected to firing to form conductive films. This conductive paste can prevent glass substrates from undergoing color changes and prevent base layers for conductive films from having structural defects such as cracks.

Abstract: A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder is a mixed powder of an atomized powder prepared by an atomization method and a wet reduced powder prepared by a wet reduction method and the conductive powder contains the atomized powder in the range of 5 to 40 wt %. The atomized powder is 5.2 to 9 ?m in average particle size and the content of a chlorine component mixed in the conductive powder is 42 ppm or less. The conductive paste is applied in the form of a line onto a glass substrate 1 and subjected to firing to form conductive films. This conductive paste can prevent glass substrates from undergoing color changes and prevent base layers for conductive films from having structural defects such as cracks.

Abstract: A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder contains a noble metal powder such as an Ag powder and a base metal powder containing Cu and/or Ni, and the base metal powder has a specific surface area of less than 0.5 m2/g. The content of the base metal powder with respect to the total amount of the conductive powder is, in ratio by weight, 0.1 to 0.3 when the base metal powder contains Cu as its main constituent, 0.1 to 0.2 when the base metal powder contains Ni as its main constituent, and 0.1 to 0.25 when the base metal powder contains a mixed powder of Cu and Ni as its main constituent.