Abstract: This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G?bmin of the storage elastic modulus G?b in the range of 25° C. to less than 250° C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G?b250 at 250° C. of 0.005 MPa or above, and a temperature at which G?bmin is exhibited of 50-150° C. The adhesive surface layer C has a minimum value G?cmin of the storage elastic modulus G?c in the range of 25° C. to less than 250° C. of 0.03 MPa.

Abstract: This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G?bmin of the storage elastic modulus G?b in the range of 25° C. to less than 250° C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G?b250 at 250° C. of 0.005 MPa or above, and a temperature at which G?bmin is exhibited of 50-150° C. The adhesive surface layer C has a minimum value G?cmin of the storage elastic modulus G?c in the range of 25° C. to less than 250° C. of 0.03 MPa.

Abstract: An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4?|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|?2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction?2%, and (2) after heating at 200° C. for 10 minutes, 0.4?|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|?2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction?3%.

Abstract: An adhesive resin composition includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

Abstract: An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4?|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|?2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction?2%, and (2) after heating at 200° C. for 10 minutes, 0.4?|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|?2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction?3%.

Abstract: Provided is a method of peeling an electronic member from a laminate composed of the electronic member adhered to a supporting substrate via an adhesive film having a self-peeling adhesive layer in a defined location and having an exposed region A. The method includes the steps of: reducing adhesive strength between the supporting substrate and the self-peeling adhesive layer in the region A by applying energy on the region A; removing the supporting substrate from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate and the self-peeling adhesive layer; and peeling the electronic member from the laminate by removing the adhesive film from the electronic member.

Abstract: Disclosed are a biodegradable resin composition comprising a copolymer (A) with a weight average molecular weight of 1,000 to 30,000, which comprises a constituent unit (a-1) derived from a multivalent carboxylic acid except for an amino acid and a constituent unit (a-2) derived from a hydroxycarboxylic acid, and a biodegradable resin (B), which has excellent hydrolyzability and excellent transparency; and a biodegradable molded article composed of this biodegradable resin composition.

Abstract: An adhesive resin composition of the present invention includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

Abstract: The invention provides a piezoelectric polymer material including a helical chiral polymer having a weight average molecular weight of from 50,000 to 1,000,000 and having optical activity, the piezoelectric polymer material having a piezoelectric constant d14 at 25° C. of 10 pC/N or more, a degree of crystallinity obtained by X-ray diffraction of from 40% to 80%, and a haze of from 0.5 to 30.

Abstract: A polymerizable composition including a compound represented by following General Formula (1): (in Formula (1), M represents a metal atom; X1 and X2 each independently represents a sulfur atom or an oxygen atom; R1 represents a divalent organic group; m represents an integer of 0 or 1 or greater; p represents an integer of 1 to n; n represents a valence of a metal atom M; and Y's each independently represents an inorganic or organic residue, where when n?p is 2 or greater, Y's may be bonded to each other to form a ring containing a metal atom M), a thiol compound and an episulfide compound.

Abstract: Disclosed are a biodegradable resin composition comprising a copolymer (A) with a weight average molecular weight of 1,000 to 30,000, which comprises a constituent unit (a-1) derived from a multivalent carboxylic acid except for an amino acid and a constituent unit (a-2) derived from a hydroxycarboxylic acid, and a biodegradable resin (B), which has excellent hydrolyzability and excellent transparency; and a biodegradable molded article composed of this biodegradable resin composition.

Abstract: Polyester resins (C) of the invention have a practically sufficient high molecular weight and a high crystallinity and have an amide group in the molecular chain. Processes for producing the polyester resins are also disclosed. In detail, the polyester resins (C) have a practically sufficient high molecular weight and a high crystallinity and have a biodegradable amide group in the molecular chain. Processes for producing the polyester resins are also disclosed. The polyester resins (C) are obtained by reacting an aliphatic polyester resin (A) and a polyisocyanate compound (B) in the presence of an amidation catalyst and contain a specific structural unit.

Abstract: A polymerizable composition including a compound represented by following General Formula (1): (in Formula (1), M represents a metal atom; X1 and X2 each independently represents a sulfur atom or an oxygen atom; R1 represents a divalent organic group; m represents an integer of 0 or 1 or greater; p represents an integer of 1 to n; n represents a valence of a metal atom M; and Y's each independently represents an inorganic or organic residue, where when n?p is 2 or greater, Y's may be bonded to each other to form a ring containing a metal atom M), a thiol compound and an episulfide compound.

Abstract: The invention provides a polylactic acid-based resin having a high molecular weight, high heat resistance and an amide bond in its molecular chain, a production process and a use thereof. The polylactic acid-based resin comprises a constituting unit represented by the following formula (1) and which is obtained by allowing a polyisocyanate compound to react with a mixture comprising at least a poly (L-lactic acid) in which the percentage of the terminal functional group which is a carboxyl group exceeds 50% and a poly (D-lactic acid) in which the percentage of the terminal functional group which is a carboxyl group exceeds 50%. (in the formula (1), R is a polyisocyanate residue and represents an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a hydrocarbon group having an alicyclic structure and 3 to 20 carbon atoms or a hydrocarbon group having an aromatic ring and 6 to 20 carbon atoms.

Abstract: The invention provides a piezoelectric polymer material including a helical chiral polymer having a weight average molecular weight of from 50,000 to 1,000,000 and having optical activity, the piezoelectric polymer material having a piezoelectric constant d14 at 25° C. of 10 pC/N or more, a degree of crystallinity obtained by X-ray diffraction of from 40% to 80%, and a haze of from 0.5 to 30.

Abstract: Disclosed is a polymerizable composition containing a compound represented by the following general formula (1), wherein, in the formula, M represents P, P?O or P?S; X1 and X2 each independently represent a sulfur atom or an oxygen atom; R1 represents a divalent organic group; m represents 0 or an integer of not less than 1; n represents an integer of not less than 1 but not more than 3; p and q represent (1, 0) or (0, 1); and Y represents an inorganic or organic residue.

Abstract: Polyester resins (C) of the invention have a practically sufficient high molecular weight and a high crystallinity and have an amide group in the molecular chain. Processes for producing the polyester resins are also disclosed. In detail, the polyester resins (C) have a practically sufficient high molecular weight and a high crystallinity and have a biodegradable amide group in the molecular chain. Processes for producing the polyester resins are also disclosed. The polyester resins (C) are obtained by reacting an aliphatic polyester resin (A) and a polyisocyanate compound (B) in the presence of an amidation catalyst and contain a specific structural unit.

Abstract: A polymerizable composition including a compound represented by following General Formula (1): (in Formula (1), M represents a metal atom; X1 and X2 each independently represents a sulfur atom or an oxygen atom; R1 represents a divalent organic group; m represents an integer of 0 or 1 or greater; p represents an integer of 1 to n; n represents a valence of a metal atom M; and Y's each independently represents an inorganic or organic residue, where when n-p is 2 or greater, Y's may be bonded to each other to form a ring containing a metal atom M), and a thiol compound.

Abstract: Disclosed is a polymerizable composition containing a compound represented by the general formula (1) below and a bluing agent, wherein, in the general formula (1) below, M represents a metal atom; X1 and X2 each independently represent a sulfur atom or an oxygen atom; R1 represents a divalent organic group; m represents 0 or an integer of not less than 1; p represents an integer of not less than 1 but not more than n; n represents the valence of the metal atom M; Ys independently represent an inorganic or organic residue, and when n?p is not less than 2, Ys may combine together to form a ring containing the metal atom M.

Abstract: Disclosed is a polymerizable composition containing a compound represented by the following general formula (1), wherein, in the formula, M represents P, P?O or P?S; X1 and X2 each independently represent a sulfur atom or an oxygen atom; R1 represents a divalent organic group; m represents 0 or an integer of not less than 1; n represents an integer of not less than 1 but not more than 3; p and q represent (1, 0) or (0, 1); and Y represents an inorganic or organic residue.