Patents by Inventor Shinichi Usukura

Shinichi Usukura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder composition, electronic board, and bonding method
    Patent number: 10913132
    Abstract: A solder composition contains: flux composition containing (A) rosin-based resin, (B) activator, and (C) solvent; and (D): solder powder with a melting point of 200 to 250 degrees C. The component (A) contains (A1) rosin-based resin with a softening point of 120 degrees C. or more and an acid number of 220 mgKOH/g or more and (A2) rosin-based resin with a softening point of 100 degrees C. or less and an acid number of 20 mgKOH/g or less. The component (C) contains (C1) hexanediol solvent with a melting point of 40 degrees C. or more and a boiling point of 220 degrees C. or less and (C2) solvent with a viscosity of 10 mPa·s or less at 20 degrees C. and a boiling point of 270 degrees C. or more. A content of the component (A1) ranges from 15 to 25 mass % with respect to the flux composition (100 mass %).
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: February 9, 2021
    Assignee: TAMURA CORPORATION
    Inventors: Nobuhiro Yamashita, Jun Aoki, Shinichi Usukura, Satoshi Okumura
  • SOLDER COMPOSITION, ELECTRONIC BOARD, AND BONDING METHOD
    Publication number: 20190061070
    Abstract: A solder composition contains: flux composition containing (A) rosin-based resin, (B) activator, and (C) solvent; and (D): solder powder with a melting point of 200 to 250 degrees C. The component (A) contains (A1) rosin-based resin with a softening point of 120 degrees C. or more and an acid number of 220 mgKOH/g or more and (A2) rosin-based resin with a softening point of 100 degrees C. or less and an acid number of 20 mgKOH/g or less. The component (C) contains (C1) hexanediol solvent with a melting point of 40 degrees C. or more and a boiling point of 220 degrees C. or less and (C2) solvent with a viscosity of 10 mPa·s or less at 20 degrees C. and a boiling point of 270 degrees C. or more. A content of the component (A1) ranges from 15 to 25 mass % with respect to the flux composition (100 mass %).
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Inventors: Nobuhiro Yamashita, Jun Aoki, Shinichi Usukura, Satoshi Okumura