Abstract: Provided is a solderable conductive paste that cures at low temperature, that is excellent in adhesiveness with an ITO layer, and that is inexpensive. The conductive paste of the present invention includes: flaky silver-coated copper powder; a phenoxy resin; a hexamethylene diisocyanate-based polyisocyanate compound and/or a blocked isocyanate compound; a phosphorus-containing organic titanate; and an alkanolamine, in which a content of the flaky silver-coated copper powder is from 88 parts by weight to 92 parts by weight with respect to 100 parts by weight of a total amount of the flaky silver-coated copper powder, the phenoxy resin, and the hexamethylene diisocyanate-based polyisocyanate compound and the blocked isocyanate compound.

Abstract: A first conductive type well layer is formed on a surface of a first conductive type semiconductor substrate. A second conductive type impurity diffusion layer having the conductive type opposite from the first conductive type is formed on a surface of this first conductive type well layer. A second conductive type well layer is formed below the first conductive type well layer. This second conductive type well layer is provided at its both ends with terminals comprising second conductive type well layers passing through the first conductive type semiconductor substrate to reach its surface.

Abstract: The invention provides a conductive, flexure-resistant electromagnetic-shielded flexible printed circuit assembly obtainable by forming a copper foil circuit on a heat-resistant plastic film, disposing successively thereon an undercoat layer, a metal-powder-containing electromagnetic paste shield layer and an overcoat layer, with the ground pattern of the copper foil circuit being electrically connected to the above shield layer through the undercoat layer at appropriate intervals.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array in which memory cells constituted by semiconductor storage elements are divided into a plurality of memory cell blocks each having a common source line and a common digit line, a peripheral circuit for addressing the memory cells and outputting data from the memory cells, a data detecting circuit for detecting, for each memory cell block, the presence/absence of a semiconductor storage element in which the threshold voltage of a transistor constituting the memory cell is the ground potential or less, and a source potential setting circuit capable of changing the source potential setting condition of each memory cell block in accordance with the detection result from the data detecting circuit.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array in which memory cells constituted by semiconductor storage elements are divided into a plurality of memory cell blocks each having a common source line and a common digit line, a peripheral circuit for addressing the memory cells and outputting data from the memory cells, a data detecting circuit for detecting, for each memory cell block, the presence/absence of a semiconductor storage element in which the threshold voltage of a transistor constituting the memory cell is the ground potential or less, and a source potential setting circuit capable of changing the source potential setting condition of each memory cell block in accordance with the detection result from the data detecting circuit.

Abstract: The invention relates to an electroconductive coating composition with excellent conductivity, adhesion to copper foil and solder dip resistance which is suitable for the formation of a jumper circuit and an electromagnetic shield layer, a printed circuit board fabricated with the above composition, and a durable electromagnetic-shielded flexible printed circuit assembly, wherein said coating composition comprises, by weight, 100 parts of copper metal powder coated with 0.05-0.2 parts of titanate or/and zirconate, 5-30 parts of resole phenolic resin, 0.5-4 parts of a chelating agent, 0.1-5 parts of an adhesion improving agent and 0.5-7 parts of a conductivity improving agent. This composition is less expensive than the silver paste, superior to the latter in the conductivity and adhesion to copper foil of the coating film and in solder dip resistance, thus being suited for the construction of a jumper circuit and an electromagnetic shield layer. It lends itself well to the mounting of IC, MSI, LSI, etc.

Abstract: A conductive paint having a good adhesion to a molding of metallic oxide comprises: 100 parts by weight of silver-plated copper powder containing silver plating in the amount of not more than 30 wt %; 13.6-6.0 parts by weight of phenolic resin (solid content); 0.2-0.7 part by weight of one selected from saturated fatty acids, unsaturated fatty acids, metallic salts thereof, and coupling agents containing saturated fatty acids or unsaturated fatty acids; 1.0-4.0 parts by weight of triethanolamine; and 0.1-1.0 part by weight of dihydroxybenzene. The phenolic resin is a resol phenolic resin having an infrared spectrum that satisfies the following relationships:(A) 1/n=0.8-1.2(B) m/n=0.8-1.2(C) b/a=0.8-1.2(D) c/a=1.2-1.5wherein 1, m, n, a, b and c are, respectively, infrared transmittances of 2-monosubstitution product, 2,4-disubstitution product, 2,4,6-trisubstitution product, methylol group, dimethylenether, and phenol group.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: A printed circuit board capable of preventing electromagnetic interference comprises a base plate composed of an insulating material. On the main surface of the base plate, a first electric conductive layer is formed by etching copper foil, which includes a signal electrode portion and a ground electrode portion. On the first electric conductive layer, an insulating layer such as a solder resist film is formed except for a part of the ground electrode portion, and on this layer, a second electric conductive layer is formed by screen-printing a copper ink so as to cover almost all of the first electric conductive layer. A part of the second electric conductive layer is connected to the ground electrode portion of the first electric conductive layer so that the second electric conductive layer acts as an electromagnetic shield. The copper ink is a mixture of copper powder, binder and other materials. A solder layer may be formed on the second electric conductive layer composed of the copper ink.

Abstract: A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.