Abstract: There is provided an endoscope and an endoscope flexible section that can secure bending rigidity and have the resistance against high temperature-and-pressure steam during sterilization. The endoscope flexible section includes a spiral tube, a net-like tube, and an outer cover member. The spiral tube is formed by winding a belt-like member made of metal, in a spiral shape. The net-like tube is formed in an annular shape on the periphery of the spiral tube by braiding thin metal wires. The outer cover member is formed on the periphery of the net-like tube. In the outer cover member, a polyparaxylene resin layer is formed in a pattern on the periphery of a cover layer that covers the periphery of the net-like tube and is made of fluororubber. The polyparaxylene resin layer is a pattern of the plural rings that are disposed in a circumferential direction at predetermined intervals.

Abstract: An endoscope has a long slender insertion section to be inserted in a body cavity. The insertion section is composed by connecting a flexible portion to a distal portion having a CCD image sensor with a bending portion. Inserted through the insertion section are an air/water tube, a signal cable and other long slender contents. The air/water tube is enlarged in diameter in an area of the bending portion, and increases a filling rate of the contents in the bending portion.

Abstract: A process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a metal strip. The metal strip is then punched to cut and remove the metal plane, which is then laminated and heat-pressed to another metal strip. After completely adhered, the other metal strip is punched to remove a multi-layer lead frame.

Abstract: A process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a metal strip. The metal strip is then punched to cut and remove the metal plane, which is then laminated and heat-pressed to another metal strip. After completely adhered, the other metal strip is punched to remove a multi-layer lead frame.