Patents by Inventor Shinichiro Arikawa

Shinichiro Arikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor device terminal having a gold bump electrode
    Patent number: 5298459
    Abstract: A semiconductor device provided with an external connection terminal composed of a metal bump electrode. A first metal film is formed on the entire surface of the semiconductor device, a second metal film on the first metal film, and a third metal film on the second metal film. A resist film is selectively formed on the third metal film. A metal bump electrode is formed on the third metal film, at a portion at which the resist film is not present by electrolytic plating while using the third metal film as a conductive plating electrode and the resist film as a mask. The resist film is removed and the metal films are etched while using the metal bump electrode as a mask.
    Type: Grant
    Filed: March 5, 1991
    Date of Patent: March 29, 1994
    Assignee: Seiko Epson Corporation
    Inventors: Shinichiro Arikawa, Hiroaki Murakami