Patents by Inventor Shinichiro Imabayashi

Shinichiro Imabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same
    Patent number: 5387493
    Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.
    Type: Grant
    Filed: October 18, 1990
    Date of Patent: February 7, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Shinichiro Imabayashi, Hitoshi Oka, Isamu Tanaka, Hiroshi Kikuchi, Makio Watanabe
  • Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition
    Patent number: 5268255
    Abstract: A printed circuit board has a resist layer made from a photo-setting resist composition containing:(A) a polyfunctional unsaturated compound which is solid at room temperature,(B) a polyfunctional unsaturated compound which is liquid at room temperature,(C) a photopolymerization initiator,(D) an epoxy resin,(E) at least one member selected from the group consisting of:(i) a curing agent for the epoxy resin and either melamine or the derivative thereof, and(ii) a compound having a 2,4-diamino-s-triazine ring and an imidazole ring in the molecule.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: December 7, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Kikuchi, Makio Watanabe, Shinichiro Imabayashi, Reiko Yano, Isamu Tanaka, Hitoshi Oka, Yukihiro Taniguchi, Shigeru Fujita
  • Photocurable diallyl phthalate resin composition and printed circuit board using the same
    Patent number: 5091283
    Abstract: A photo curable diallyl phthalate resin composition characterized by containing 0.1 to 10 parts by weight of an agent for preventing back side undesirable curing and 20 to 100 parts by weight of a filler per 100 parts by weight of a diallyl phthalate prepolymer is particularly suitable for a partly additive process for forming a solder resist effective for preventing back side undesirable curing by ultraviolet light and having resistance to release of substances from the solder resist for deteriorating properties of plated copper film as well as for giving good mechanical properties.
    Type: Grant
    Filed: March 27, 1990
    Date of Patent: February 25, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Isamu Tanaka, Hitoshi Oka, Makio Watanabe, Hiroshi Kikuchi, Shinichiro Imabayashi, Yukihiro Taniguti