Abstract: A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.

Abstract: A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.

Abstract: A piezoelectric sound generator includes a piezoelectric device consisting of a metal diaphragm and a piezoelectric porcelain plate affixed to the diaphragm, a pair of connecting members having resistors connected to the piezoelectric device in series, a leakage magnetic flux coil connected in parallel to the piezoelectric device and the resistors in series, and a resin case. The resin case encases the piezoelectric device and containing the resistors, and has a spool for retaining the leakage magnetic flux coil. In addition, the resin case embraces a portion of the connecting members. This piezoelectric sound generator is manufactured by the steps of: soldering the resistors to the connecting members; forming the resin case in an insertion mold into which the connecting members have been placed, whereby a portion of the connecting members is embraced by the resin case; and attaching the piezoelectric device and the coil to the resin case.