Patents by Inventor Shinichiro Matsushita

Shinichiro Matsushita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6951677
    Abstract: A laminate with a peelable top layer is provided. The laminate comprises a substrate such as a porous board, the top layer such as a plastic top layer or a decorated metal plate, and a bonding layer between the top layer and the substrate. At least one of the substrate and the top layer is porous. An adhesive for forming the bonding layer comprises (A) an aqueous dispersion containing a polymer, which demonstrates properties that a dried film of the aqueous dispersion has a tensile strength of 1 to 28 MPa and a percentage elongation of 100 to 2000%, and (B) a water-based adhesive composition containing microspheres with thermal expansion capability, each of which is composed of a polymer shell encapsulating a gas. By use of this adhesive, the bonding layer provides a high bonding strength between the top layer and the substrate. When irradiating the laminate with ultraviolet or far infrared, while heating, the top layer can be easily peeled off from the laminate.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: October 4, 2005
    Assignees: Matsushita Electric Works, Ltd., Konishi Co., Ltd.
    Inventors: Hiroyuki Ishikawa, Sumiya Shimotsuma, Shinichiro Matsushita, Keiichi Hamada
  • Patent number: 6908654
    Abstract: A laminate with a peelable top layer is provided. The laminate comprises a substrate such as a porous board, the top layer such as a plastic top layer or a decorated metal plate, and a bonding layer between the top layer and the substrate. At least one of the substrate and the top layer is porous. An adhesive for forming the bonding layer comprises (A) an aqueous dispersion containing a polymer, which demonstrates properties that a dried film of the aqueous dispersion has a tensile strength of 1 to 28 MPa and a percentage elongation of 100 to 2000%, and (B) a water-based adhesive composition containing microspheres with thermal expansion capability, each of which is composed of a polymer shell encapsulating a gas. By use of this adhesive, the bonding layer provides a high bonding strength between the top layer and the substrate. When irradiating the laminate with ultraviolet or far infrared, while heating, the top layer can be easily peeled off from the laminate.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: June 21, 2005
    Assignees: Matsushita Electric Works, Ltd., Konishi Co., Ltd.
    Inventors: Hiroyuki Ishikawa, Sumiya Shimotsuma, Shinichiro Matsushita, Keiichi Hamada
  • Publication number: 20050003131
    Abstract: A laminate with a peelable top layer is provided. The laminate comprises a substrate such as a porous board, the top layer such as a plastic top layer or a decorated metal plate, and a bonding layer between the top layer and the substrate. At least one of the substrate and the top layer is porous. An adhesive for forming the bonding layer comprises (A) an aqueous dispersion containing a polymer, which demonstrates properties that a dried film of the aqueous dispersion has a tensile strength of 1 to 28 MPa and a percentage elongation of 100 to 2000%, and (B) a water-based adhesive composition containing microspheres with thermal expansion capability, each of which is composed of a polymer shell encapsulating a gas. By use of this adhesive, the bonding layer provides a high bonding strength between the top layer and the substrate. When irradiating the laminate with ultraviolet or far infrared, while heating, the top layer can be easily peeled off from the laminate.
    Type: Application
    Filed: July 8, 2004
    Publication date: January 6, 2005
    Applicants: Matsushita Electric Works, Ltd., Konishi Co., Ltd.
    Inventors: Hiroyuki Ishikawa, Sumiya Shimotsuma, Shinichiro Matsushita, Keiichi Hamada
  • Publication number: 20020094403
    Abstract: A laminate with a peelable top layer is provided. The laminate comprises a substrate such as a porous board, the top layer such as a plastic top layer or a decorated metal plate, and a bonding layer between the top layer and the substrate. At least one of the substrate and the top layer is porous. An adhesive for forming the bonding layer comprises (A) an aqueous dispersion containing a polymer, which demonstrates properties that a dried film of the aqueous dispersion has a tensile strength of 1 to 28 MPa and a percentage elongation of 100 to 2000%, and (B) a water-based adhesive composition containing microspheres with thermal expansion capability, each of which is composed of a polymer shell encapsulating a gas. By use of this adhesive, the bonding layer provides a high bonding strength between the top layer and the substrate. When irradiating the laminate with ultraviolet or far infrared, while heating, the top layer can be easily peeled off from the laminate.
    Type: Application
    Filed: October 22, 2001
    Publication date: July 18, 2002
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Hiroyuki Ishikawa, Sumiya Shimotsuma, Shinichiro Matsushita, Keiichi Hamada