Patents by Inventor Shinichiro MISAKA

Shinichiro MISAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11201068
    Abstract: A heat treatment apparatus of heating a substrate mounted on a mounting plate heated by a heating part includes: plural types of physical quantity detecting parts for detecting plural types of physical quantities, respectively; a state estimating part for estimating an occurrence probability occurring for each of abnormality modes by a neural network, and including an input layer to which a group of time-series detection values obtained for each of physical quantity detection values detected respectively by the physical quantity detecting parts is inputted; and a selecting part for selecting one of correspondence processes based on the occurrence probability of each of the abnormality modes estimated by the state estimating part. One of the physical quantity detection values is a temperature detection value detected by a temperature physical quantity detecting part for detecting a temperature of the mounting plate among the physical quantity detecting parts.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: December 14, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Junnosuke Maki, Shinichiro Misaka
  • Patent number: 11142823
    Abstract: A substrate processing apparatus that places a substrate on a placing portion and performs a heating processing on the substrate includes a plurality of heating control regions that are set plurally along a circumferential direction of the placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature, and an adjusting unit that adjusts a relative direction of a circumferential direction of the substrate with respect to an arrangement of the circumferential direction of the plurality of heating control regions based on information on deformation of the substrate different in height from a plane orthogonal to a center axis of the substrate in the circumferential direction.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: October 12, 2021
    Assignee: Tokyo Electron Limited
    Inventor: Shinichiro Misaka
  • Publication number: 20190153602
    Abstract: A substrate processing apparatus that places a substrate on a placing portion and performs a heating processing on the substrate includes a plurality of heating control regions that are set plurally along a circumferential direction of the placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature, and an adjusting unit that adjusts a relative direction of a circumferential direction of the substrate with respect to an arrangement of the circumferential direction of the plurality of heating control regions based on information on deformation of the substrate different in height from a plane orthogonal to a center axis of the substrate in the circumferential direction.
    Type: Application
    Filed: May 30, 2017
    Publication date: May 23, 2019
    Applicant: Tokyo Electron Limited
    Inventor: Shinichiro Misaka
  • Publication number: 20190006208
    Abstract: A heat treatment apparatus of heating a substrate mounted on a mounting plate heated by a heating part includes: plural types of physical quantity detecting parts for detecting plural types of physical quantities, respectively; a state estimating part for estimating an occurrence probability occurring for each of abnormality modes by a neural network, and including an input layer to which a group of time-series detection values obtained for each of physical quantity detection values detected respectively by the physical quantity detecting parts is inputted; and a selecting part for selecting one of correspondence processes based on the occurrence probability of each of the abnormality modes estimated by the state estimating part. One of the physical quantity detection values is a temperature detection value detected by a temperature physical quantity detecting part for detecting a temperature of the mounting plate among the physical quantity detecting parts.
    Type: Application
    Filed: June 26, 2018
    Publication date: January 3, 2019
    Inventors: Junnosuke MAKI, Shinichiro MISAKA
  • Patent number: 10049905
    Abstract: A substrate heat treatment apparatus includes: a placement unit on which a substrate is placed; a heat treatment unit for heating or cooling the substrate on the placement unit; a plurality of temperature sensors positioned correspondingly to a plurality of locations of the substrate on the placement unit; and a control unit. The control unit is configured to control the heat treatment unit based on temperatures detected by the temperature sensors, to calculate a position of a thermal center of gravity of the substrate based on the temperatures detected by the temperature sensors, and to detect heat treatment condition of the substrate based on the position of the thermal center of gravity.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: August 14, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Koudai Higashi, Shinichiro Misaka
  • Publication number: 20160093519
    Abstract: A substrate heat treatment apparatus includes: a placement unit on which a substrate is placed; a heat treatment unit for heating or cooling the substrate on the placement unit; a plurality of temperature sensors positioned correspondingly to a plurality of locations of the substrate on the placement unit; and a control unit. The control unit is configured to control the heat treatment unit based on temperatures detected by the temperature sensors, to calculate a position of a thermal center of gravity of the substrate based on the temperatures detected by the temperature sensors, and to detect heat treatment condition of the substrate based on the position of the thermal center of gravity.
    Type: Application
    Filed: September 22, 2015
    Publication date: March 31, 2016
    Inventors: Koudai HIGASHI, Shinichiro MISAKA