Abstract: Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical insulation, mechanical strength, flexibility and workability can be obtained.

Abstract: A method of producing sealing film for photovoltaic cell module including a layer composed of at least one substance selected from the group consisting of metals, metal oxides, and inorganic compounds; and a polyester film having a thermal shrinkage ratio within (0±2)% at 150° C. in both length-wise and width-wise directions, and difference between the thermal shrinkage ratios at 150° C. in the length-wise and width-wise directions of 2% or less.

Abstract: Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical in sulation, mechanical strength, flexibility and workability can be obtained.

Abstract: A seal film for solar cell module includes a resin film layer including a biaxially oriented film layer formed of a resin composition containing poly-p-phenylene sulfide as a major component; and a gas barrier layer formed of at least one selected from the group consisting of a metal, a metal oxide, an inorganic compound, and an organic compound. In the seal film for solar cell module, longitudinal and width direction heat shrink ratios at 150° C. of the seal film for solar cell module both fall within a range of ?2.0% to +2.0%, and an absolute value of a difference between the longitudinal and width direction heat shrink ratios at 150° C. is 2.0% or less.

Abstract: A photovoltaic cell module sealing film including a layer composed of at least one substance selected from the group consisting of metals, metal oxides, and inorganic compounds; and a polyester film having a thermal shrinkage ratio within (0±2) % at 150° C. in both length-wise and width-wise directions, and a difference between the thermal shrinkage ratios at 150° C. in the length-wise and width-wise directions of 2% or less.

Abstract: In a sheet wherein a fabric sheet (A) is impregnated with a resin composition (B) containing poly-p-phenylene sulfide as a major component, by controlling the orientation degree of the resin composition (B) within the range between 0.3 and 0.9, heat resistance, thermal dimensional stability, dielectric characteristics and mechanical properties when bent are largely improved, so that the resin-impregnated fabric sheet may suitably be used as an insulation substrate for circuit boards and for multilayer wiring boards to which high densification of the circuits and decrease in the thickness are demanded.

Abstract: A laminated polyphenylene sulfide film having excellent adhesiveness, especially heatsealability, and good mechanical properties and heat resistance, as well as a process for producing the same are disclosed. A central layer is constituted by a biaxially oriented polyphenylene sulfide film and a surface layer is constituted by phenylene sulfide copolymer containing a copolymerization unit other than p-phenylene sulfide unit in an amount of not less than 3 mol % and less than 50 mol %, so that the film has an improved adhesiveness and heatsealability while retaining the heat resistance and mechanical properties of biaxially oriented polyphenylene sulfide films.

Abstract: A laminate comprising a non-oriented polyphenylenesulfide film and a biaxially oriented polyphenylenesulfide film bonded on at least one surface of the non-oriented polyphenylenesulfide film without using an adhesive, and process for producing it. The delamination of the laminate can be prevented and the tear strength can be increased by suppressing the crystallization of the non-oriented polyphenylenesulfide film. Since an adhesive is not interposed and the main component of the layers of the laminate is polyphenylenesulfide, the laminate can have excellent heat resistance, chemical resistance, electrical insulating property, wet heat resistance and processability with a good balance.

Abstract: A laminate comprising a non-oriented polyphenylenesulfide film and a biaxially oriented polyphenylenesulfide film bonded on at least one surface of the non-oriented polyphenylenesulfide film without using an adhesive, and process for producing it. The delamination of the laminate can be prevented and the tear strength can be increased by suppressing the crystallization of the non-oriented polyphenylenesulfide film. Since an adhesive is not interposed and the main component of the layers of the laminate is polyphenylenesulfide, the laminate can have excellent heat resistance, chemical resistance, electrical insulating property, wet heat resistance and processability with a good balance.

Abstract: A poly-p-phenylene sulfide resin composition comprising poly-p-phenylene sulfide as a principal component and 0.05 to 40 wt % (based on the total weight of the composition) of at least one metal component selected from the group consisting of zinc, lead, magnesium, manganese, barium and tin. The plastic materials prepared from the composition of this invention are greatly improved in resistance to copper contact and thermal resistance in closed air environment, and therefore are very useful for electrical insulation.