Abstract: A circuit board includes an interconnect and an insulating layer that covers the interconnect. The interconnect includes a first interconnect that is formed to serve as a recognition mark of which planar shape is a predetermined shape. The insulating layer has a through-hole of which planar shape is variant and that penetrates the insulating layer in a thickness direction of the insulating layer such that an entire upper surface of the first interconnect is exposed. The through-hole includes a first through-hole of which planar shape is a predetermined shape and that penetrates the insulating layer in the thickness direction such that the entire upper surface of the first interconnect is exposed and a second through-hole that serves as part of an inner wall surface of the first through-hole and that penetrates the insulating layer in the thickness direction.

Abstract: A semiconductor apparatus includes a first substrate having a first major surface and a plurality of first conductive pads on the first major surface, a second substrate having a second major surface opposing the first major surface, and having a plurality of second conductive pads on the second major surface, a semiconductor device disposed between the first substrate and the second substrate and mounted on the first major surface of the first substrate, and a plurality of bonding members that bond the first conductive pads and the second conductive pads together, wherein in a plan view normal to the first major surface, the first substrate has a rectangular plane shape with a first side and a second side each extending parallel to a first direction, and a third side and a fourth side each extending parallel to a second direction perpendicular to the first direction.

Abstract: A semiconductor apparatus includes a first substrate having a first surface and a first conductive pad on the first surface, a second substrate having a second surface opposing the first surface, and having a second conductive pad on the second surface, a semiconductor device disposed between the first substrate and the second substrate and mounted on the first surface of the first substrate, and a conductive core ball in contact with the first conductive pad and the second conductive pad, wherein a maximum dimension of the conductive core ball in a first direction perpendicular to the first surface is smaller than a maximum diameter of the conductive core ball in a plane parallel to the first surface, and wherein the conductive core ball includes a first contact surface in direct contact with the first conductive pad, and a second contact surface in direct contact with the second conductive pad.

Abstract: A circuit board includes an interconnect and an insulating layer that covers the interconnect. The interconnect includes a first interconnect that is formed to serve as a recognition mark of which planar shape is a predetermined shape. The insulating layer has a through-hole of which planar shape is variant and that penetrates the insulating layer in a thickness direction of the insulating layer such that an entire upper surface of the first interconnect is exposed. The through-hole includes a first through-hole of which planar shape is a predetermined shape and that penetrates the insulating layer in the thickness direction such that the entire upper surface of the first interconnect is exposed and a second through-hole that serves as part of an inner wall surface of the first through-hole and that penetrates the insulating layer in the thickness direction.