Patents by Inventor Shinichiro Sudo

Shinichiro Sudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the production of semiconductor device
    Patent number: 6333206
    Abstract: The present invention provides a process for the production of a semiconductor device comprising a semiconductor element provided on a printed circuit board with a plurality of connecting electrode portions provided interposed therebetween, the gap between said printed circuit board and said semiconductor element being sealed with an underfill resin layer.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: December 25, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Satoshi Ito, Masaki Mizutani, Hiroshi Noro, Shinichiro Sudo, Takashi Fukushima, Makoto Kuwamura
  • Method of producing semiconductor device and encapsulating pellet employed therein
    Patent number: 5976916
    Abstract: A method of production of a semiconductor device such as a plastic pin grid array (PPGA) and a plastic ball grid array (PBGA) having a cavity-fill form. In this method, first, a semiconductor element (3) is placed in a cavity (6) formed in a multiple step-like substrate (2). Under this state, a pellet (7), which is in a solid state at a normal temperature, made of an encapsulating resin composition containing specific components, and has specific characteristics, is placed on the semiconductor element (3). Next, the semiconductor device is heated so that the pellet can melt to fill the cavity (6) with the composition, thereby encapsulating the semiconductor device (3). According to the present invention, a semiconductor device having low stress performance and excellent moisture-proof reliability can be efficiently produced.
    Type: Grant
    Filed: November 7, 1996
    Date of Patent: November 2, 1999
    Assignee: Nitto Denko Corporation
    Inventors: Makoto Kuwamura, Kazuhiro Ikemura, Shinya Akizuki, Takashi Fukushima, Shinichiro Sudo, Satoshi Ito
  • Semiconductor device
    Patent number: 5565709
    Abstract: A semiconductor device comprising a semiconductor element encapsulated with a cured resin having at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytical measurement, the interval between the peaks being at least 20.degree. C. The semiconductor device encapsulated with the cured resin does not cause a warp and is excellent in the TCT test characteristics and the cracking resistance.
    Type: Grant
    Filed: November 2, 1995
    Date of Patent: October 15, 1996
    Assignee: Nitto Denko Corporation
    Inventors: Takashi Fukushima, Satoshi Ito, Makoto Kuwamura, Shinya Akizuki, Kazuhiro Ikemura, Shinichiro Sudo