Patents by Inventor Shinichiro Watanabe

Shinichiro Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12178111
    Abstract: A vapor deposition mask includes a silicon substrate including a first region that has a first thickness and that includes a part in which a plurality of through-holes is arranged, and a second region that is arranged at an outer circumference of the first region and that has a second thickness that is greater than the first thickness. The silicon substrate has an inner wall that constitutes a step between the first region and the second region. An outer edge of the inner wall has a curve portion in a plan view, and the inner wall has a plurality of steps in a cross-section view.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: December 24, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shinichiro Watanabe, Takahiro Yajima, Tatsuya Saito, Tatsuro Uchida
  • Publication number: 20240351332
    Abstract: A piezoelectric actuator includes a piezoelectric element including a first electrode, a piezoelectric layer, and a second electrode arranged in this order from a substrate, a first wiring electrically connected to the first electrode, a second wiring electrically connected to the second electrode, a first layer covering the piezoelectric element, a second layer arranged between the piezoelectric element and the first wiring and between the piezoelectric element and the second wiring, and a third layer arranged to cover the first wiring, the second wiring, and a periphery of the piezoelectric layer when viewed from a direction perpendicular to a surface of the substrate, wherein the first layer, the second layer, and the third layer are arranged in this order from the substrate, and wherein the third layer has higher moisture resistance than the second layer.
    Type: Application
    Filed: April 18, 2024
    Publication date: October 24, 2024
    Inventors: SHINICHIRO WATANABE, TAKASHI IKEDA, SHOGO TAZAWA
  • Patent number: 11984811
    Abstract: A power supply control device that controls a switching element of a switching power supply apparatus which includes a transformer having a primary winding, a secondary winding, and an auxiliary winding, the switching element coupled to the primary winding, and a capacitor coupled to the auxiliary winding, includes: a power supply terminal coupled to one end of the capacitor; a switch and a resistor coupled in series between the power supply terminal and a ground; a first control circuit that controls the switch; and a second control circuit that controls the switching element, in which the first control circuit performs control to turn on the switch when a first voltage applied to the power supply terminal continuously exceeds a first reference voltage for a first time, and the second control circuit performs control to turn off the switching element when the first voltage exceeds a second reference voltage higher than the first reference voltage.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: May 14, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shinichiro Watanabe, Katsumi Inoue, Kanji Aoki
  • Patent number: 11948910
    Abstract: A manufacturing method of a semiconductor apparatus includes preparing an intermediate member that includes a first member having a first substrate comprising a semiconductor element formed thereon, a second member having a second substrate, the second substrate including a part of a circuit electrically connected to the semiconductor element and having a linear expansion coefficient different from that of the first substrate, and a third member having a third substrate showing such a linear expansion coefficient that a difference between itself and the linear expansion coefficient of the first substrate is smaller than a difference between the linear expansion coefficients of the first substrate and the second substrate, and includes bonding the first member and the second member together. A first bonding electrode containing copper electrically connected to the semiconductor element and a second bonding electrode containing copper electrically connected to the circuit are bonded together.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: April 2, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Shinichiro Watanabe, Youichi Fukaya
  • Publication number: 20240084434
    Abstract: A vapor deposition mask made of a semiconductor substrate, comprising a plurality of openings to pass vapor deposition particles, wherein an aperture portion of which opening width is smallest is disposed between an edge of the opening on a vapor deposition source side and an edge of the opening on a substrate side, the opening width on the substrate side is larger than that of the aperture portion, and at least a part of an inner wall of each of the plurality of openings has a uneven shape.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: TATSURO UCHIDA, TAKAHIRO YAJIMA, SHINICHIRO WATANABE
  • Publication number: 20230235819
    Abstract: A vehicle control system is provided. The vehicle control system includes a shift-by-wire device for shifting a shift gear of a speed variator mounted in a vehicle according to a requirement of an electrical signal; a vehicle speed detecting member for detecting a vehicle speed of the vehicle; a seat belt detecting member for detecting whether a seat belt provided in the vehicle is fastened or taken off; a door open/close member for detecting whether a door provided in the vehicle is opened or closed; a presence detecting member for detecting a presence state of a passenger in the vehicle; and an automatic parking control device for controlling the shift-by-wire device to shift the shift gear to a park gear when output results of one of the door open/close member and the presence detecting member, the vehicle speed detecting member, and the seat belt detecting member satisfy predetermined conditions.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 27, 2023
    Applicant: Honda Motor Co., Ltd.
    Inventors: Yurina MORIMOTO, Taichi KITAMURA, Shinichiro WATANABE, Toshimi KANEKO
  • Publication number: 20220384387
    Abstract: A manufacturing method of a semiconductor apparatus includes preparing an intermediate member that includes a first member having a first substrate comprising a semiconductor element formed thereon, a second member having a second substrate, the second substrate including a part of a circuit electrically connected to the semiconductor element and having a linear expansion coefficient different from that of the first substrate, and a third member having a third substrate showing such a linear expansion coefficient that a difference between itself and the linear expansion coefficient of the first substrate is smaller than a difference between the linear expansion coefficients of the first substrate and the second substrate, and includes bonding the first member and the second member together. A first bonding electrode containing copper electrically connected to the semiconductor element and a second bonding electrode containing copper electrically connected to the circuit are bonded together.
    Type: Application
    Filed: August 10, 2022
    Publication date: December 1, 2022
    Inventors: Shinichiro Watanabe, Youichi Fukaya
  • Publication number: 20220364217
    Abstract: A deposition mask according to the present invention includes a first substrate that is a single-crystal substrate, wherein a first region that is at least a portion of the first substrate, includes a plurality of rectangular areas each of which has one or a plurality of openings, a substrate thickness in the rectangular area is smaller than a substrate thickness in an area that is a part of the first region and is not the rectangular area, and an angle ?1 between a side of the rectangular area and a cleavage direction of the first substrate is in a range of 0°<?1<90°.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 17, 2022
    Inventors: Takahiro Yajima, Yutaka Setomoto, Shinichiro Watanabe
  • Publication number: 20220311346
    Abstract: A power supply control device that controls a switching element of a switching power supply apparatus which includes a transformer having a primary winding, a secondary winding, and an auxiliary winding, the switching element coupled to the primary winding, and a capacitor coupled to the auxiliary winding, includes: a power supply terminal coupled to one end of the capacitor; a switch and a resistor coupled in series between the power supply terminal and a ground; a first control circuit that controls the switch; and a second control circuit that controls the switching element, in which the first control circuit performs control to turn on the switch when a first voltage applied to the power supply terminal continuously exceeds a first reference voltage for a first time, and the second control circuit performs control to turn off the switching element when the first voltage exceeds a second reference voltage higher than the first reference voltage.
    Type: Application
    Filed: March 24, 2022
    Publication date: September 29, 2022
    Inventors: Shinichiro Watanabe, Katsumi Inoue, Kanji Aoki
  • Patent number: 11444055
    Abstract: A manufacturing method of a semiconductor apparatus includes preparing an intermediate member that includes a first member having a first substrate comprising a semiconductor element formed thereon, a second member having a second substrate, the second substrate including a part of a circuit electrically connected to the semiconductor element and having a linear expansion coefficient different from that of the first substrate, and a third member having a third substrate showing such a linear expansion coefficient that a difference between itself and the linear expansion coefficient of the first substrate is smaller than a difference between the linear expansion coefficients of the first substrate and the second substrate, and includes bonding the first member and the second member together. A first bonding electrode containing copper electrically connected to the semiconductor element and a second bonding electrode containing copper electrically connected to the circuit are bonded together.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: September 13, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shinichiro Watanabe, Youichi Fukaya
  • Patent number: 11391625
    Abstract: An element configured to oscillate or detect an electromagnetic wave, the element comprising: a first dielectric portion having cylindrical shape and including a loop antenna on a first end surface thereof; a second dielectric portion connected to a second end surface of the first dielectric portion which is different from the first end surface; and an electrode portion which is disposed between the second dielectric portion and a substrate and is configured to reflect the electromagnetic wave.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: July 19, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yoshinori Tateishi, Shinichiro Watanabe
  • Publication number: 20220131116
    Abstract: A vapor deposition mask includes a silicon substrate including a first region that has a first thickness and that includes a part in which a plurality of through-holes is arranged, and a second region that is arranged at an outer circumference of the first region and that has a second thickness that is greater than the first thickness. The silicon substrate has an inner wall that constitutes a step between the first region and the second region. An outer edge of the inner wall has a curve portion in a plan view, and the inner wall has a plurality of steps in a cross-section view.
    Type: Application
    Filed: October 26, 2021
    Publication date: April 28, 2022
    Inventors: Shinichiro Watanabe, Takahiro Yajima, Tatsuya Saito, Tatsuro Uchida
  • Publication number: 20210066241
    Abstract: A manufacturing method of a semiconductor apparatus includes preparing an intermediate member that includes a first member having a first substrate comprising a semiconductor element formed thereon, a second member having a second substrate, the second substrate including a part of a circuit electrically connected to the semiconductor element and having a linear expansion coefficient different from that of the first substrate, and a third member having a third substrate showing such a linear expansion coefficient that a difference between itself and the linear expansion coefficient of the first substrate is smaller than a difference between the linear expansion coefficients of the first substrate and the second substrate, and includes bonding the first member and the second member together. A first bonding electrode containing copper electrically connected to the semiconductor element and a second bonding electrode containing copper electrically connected to the circuit are bonded together.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Inventors: Shinichiro Watanabe, Youichi Fukaya
  • Publication number: 20200072663
    Abstract: An element configured to oscillate or detect an electromagnetic wave, the element comprising: a first dielectric portion having cylindrical shape and including a loop antenna on a first end surface thereof; a second dielectric portion connected to a second end surface of the first dielectric portion which is different from the first end surface; and an electrode portion which is disposed between the second dielectric portion and a substrate and is configured to reflect the electromagnetic wave.
    Type: Application
    Filed: August 23, 2019
    Publication date: March 5, 2020
    Inventors: Yoshinori Tateishi, Shinichiro Watanabe
  • Patent number: 10569541
    Abstract: A liquid ejection head includes a first substrate and a second substrate. The first substrate includes a pressure chamber communicating with an ejection port that ejects liquid, a diaphragm that forms part of a wall constituting the pressure chamber, and at least one piezoelectric element configured to generate energy for displacing the diaphragm to eject liquid through the ejection port. The second substrate has a cavity containing the piezoelectric element. The first substrate and the second substrate are joined together with an adhesive. A liquid repellent portion surrounding the piezoelectric element is disposed on a surface of the first substrate where the piezoelectric element is disposed.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: February 25, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shinichiro Watanabe
  • Patent number: 10557439
    Abstract: An injection device, a combustor, and a rocket engine include a device main body partitioned into a fuel manifold and an oxidant manifold, and a plurality of injectors arranged at predetermined intervals in the device main body to inject fuel and oxidant into a combustion chamber, each of the injectors includes a LOx channel including a proximal end portion communicating with the oxidant manifold and a distal end portion communicating with the combustion chamber, a restrictor provided on the proximal end portion of the LOx channel and a GH2 channel including a proximal end portion communicating with the fuel manifold and a distal end portion communicating with the combustion chamber, and the restrictors have different shapes.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: February 11, 2020
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Mitsunori Isono, Kazufumi Ikeda, Hiroyasu Manako, Shinichiro Watanabe, Hideto Kawashima
  • Publication number: 20190160814
    Abstract: A liquid ejection head includes a first substrate and a second substrate. The first substrate includes a pressure chamber communicating with an ejection port that ejects liquid, a diaphragm that forms part of a wall constituting the pressure chamber, and at least one piezoelectric element configured to generate energy for displacing the diaphragm to eject liquid through the ejection port. The second substrate has a cavity containing the piezoelectric element. The first substrate and the second substrate are joined together with an adhesive. A liquid repellent portion surrounding the piezoelectric element is disposed on a surface of the first substrate where the piezoelectric element is disposed.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 30, 2019
    Inventor: Shinichiro Watanabe
  • Patent number: 10266639
    Abstract: The present invention provides a polyisocyanate composition comprising a modified polyisocyanate obtained by a reaction between a polyisocyanate and a polyalkylene glycol alkyl ether having a specific structure. In the polyisocyanate composition, the average number of isocyanate functional groups is 1.8 or more and 4.0 or less, the moiety derived from the polyalkylene glycol alkyl ether in the modified polyisocyanate is contained in an amount of 10 mass % or more and 18 mass % or less based on the total amount of the polyisocyanate composition, and the polydispersity index of molecular weight distribution of the moiety derived from the polyalkylene glycol alkyl ether in the modified polyisocyanate is 1.05 or more and 2.00 or less.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: April 23, 2019
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Kazuko Nakajima, Shinichiro Watanabe, Shigetoshi Otoyama
  • Patent number: 10209224
    Abstract: A probe is provided in which penetration of an acoustic medium into a support layer of an optical reflection member through a pinhole or a scratch on an optical reflection layer is suppressed, occurrence of a solvent crack is suppressed, and noise due to photoacoustic waves that occurs on a receiving surface can be suppressed. The probe includes an element having at least one cell in which a vibration film containing one electrode out of two electrodes that are provided so as to interpose a space therebetween is vibratably supported. The probe further includes a support layer disposed on the vibration film, and an optical reflection layer disposed on the support layer. A protection layer against an acoustic medium is formed on the optical reflection layer.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: February 19, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Shinichiro Watanabe, Atsushi Kandori, Kazutoshi Torashima
  • Patent number: 10206622
    Abstract: A biological information analyzing system includes: a reception unit receiving pulse wave information which is collected by a pulse wave measurement device worn by a user; a processing unit performing analysis processing with respect to atrial fibrillation of the user on the basis of the pulse wave information and generating browsing information of an analysis result of the analysis processing; and an output unit outputting the generated browsing information.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: February 19, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Atsushi Narusawa, Shinichiro Watanabe