Abstract: A probe apparatus includes a stage, a first and a second imaging device, a first and a second imaging optical unit, and a projection optical unit. The stage is movable in horizontal and vertical directions. The first imaging device picks up an image of a probe needle which is made to contact with an electrode of a device formed on a surface of the substrate. The first and second imaging optical units include optical systems for performing an image pickup by using the first and second imaging devices, respectively. The second imaging device picks up an image of the electrode held on the stage. The projection optical unit includes an optical system that projects an optical target mark, used in a position alignment of the first and the second imaging device, onto each of image forming units of the first and second imaging devices at the same time.

Abstract: A method of controlling a substrate inspection apparatus, which includes a stage configured to mount a substrate thereon and move in first and second moving directions and a camera configured to photograph the stage. The method includes: calculating in each quadrant divided by X and Y axis defining a coordinate system of an image photographed by the camera, a deviation of the X axis in a rotational direction with respect to the first moving direction or a deviation of the Y axis in the rotational direction with respect to the second moving direction; correcting a position of a photographed target in the coordinate system of the image photographed by the camera based on the calculated deviation in the rotational direction; and performing an alignment of the stage based on the corrected position of the target.

Abstract: A contact position of a probe needle with respect to electrode pads 71 to 75 of a semiconductor device is inspected in advance when performing an inspection by a prober on the semiconductor device formed on a wafer W placed on a stage 11. A reticle 31 on which shapes 61 to 65 indicating positions of the probe needles are formed is placed instead of the probe needles at a position where the probe needles are arranged. The semiconductor device formed on the wafer W is imaged by the imaging unit 33 through the reticle 31. A positional relationship between the shapes formed on the reticle 31 and the electrode pads 71 to 75 is analyzed from the image. When necessary, a position of the stage 11 is adjusted such that centers of the shapes 61 to 65 and centers of the electrode pad 71 to 75 are coincident.

Abstract: A contact position of a probe needle with respect to electrode pads 71 to 75 of a semiconductor device is inspected in advance when performing an inspection by a prober on the semiconductor device formed on a wafer W placed on a stage 11. A reticle 31 on which shapes 61 to 65 indicating positions of the probe needles are formed is placed instead of the probe needles at a position where the probe needles are arranged. The semiconductor device formed on the wafer W is imaged by the imaging unit 33 through the reticle 31. A positional relationship between the shapes formed on the reticle 31 and the electrode pads 71 to 75 is analyzed from the image. When necessary, a position of the stage 11 is adjusted such that centers of the shapes 61 to 65 and centers of the electrode pad 71 to 75 are coincident.

Abstract: A probe apparatus includes a stage, a first and a second imaging device, a first and a second imaging optical unit, and a projection optical unit. The stage is movable in horizontal and vertical directions. The first imaging device picks up an image of a probe needle which is made to contact with an electrode of a device formed on a surface of the substrate. The first and second imaging optical units include optical systems for performing an image pickup by using the first and second imaging devices, respectively. The second imaging device picks up an image of the electrode held on the stage. The projection optical unit includes an optical system that projects an optical target mark, used in a position alignment of the first and the second imaging device, onto each of image forming units of the first and second imaging devices at the same time.

Abstract: A method of controlling a substrate inspection apparatus, which includes a stage configured to mount a substrate thereon and move in first and second moving directions and a camera configured to photograph the stage. The method includes: calculating in each quadrant divided by X and Y axis defining a coordinate system of an image photographed by the camera, a deviation of the X axis in a rotational direction with respect to the first moving direction or a deviation of the Y axis in the rotational direction with respect to the second moving direction; correcting a position of a photographed target in the coordinate system of the image photographed by the camera based on the calculated deviation in the rotational direction; and performing an alignment of the stage based on the corrected position of the target.

Abstract: A bonding device for bonding substrates together, includes: a processing vessel configured to accommodate and bond first and second substrates; a first holding unit fixed within the processing vessel and configured to hold the first substrate on a lower surface thereof; a second holding unit located below the first holding unit within the processing vessel and configured to hold the second substrate on an upper surface thereof; a moving mechanism configured to move the second holding unit in a horizontal direction and a vertical direction; a first image pickup unit located in the first holding unit and configured to pick up an image of a front surface of the second substrate held in the second holding unit; and a second image pickup unit located in the second holding unit and configured to pick up an image of a front surface of the first substrate held in the first holding unit.

Abstract: A bonding device for bonding substrates together, includes: a first holding unit configured to hold a first substrate on a lower surface thereof; a second holding unit located below the first holding unit and configured to hold a second substrate on an upper surface thereof; a moving mechanism configured to move the first holding unit or the second holding unit in a horizontal direction and a vertical direction; a first image pickup unit located in the first holding unit and configured to pick up an image of the second substrate held in the second holding unit; and a second image pickup unit located in the second holding unit and configured to pick up an image of the first substrate held in the first holding unit, at least one of the first image pickup unit and the second image pickup unit including an infrared camera.

Abstract: A probe apparatus in which a wafer having IC chips arrayed with electrode pads is supported by a pedestal, and the pedestal is moved relatively to a probe card in the X, Y, Z directions to bring the electrode pads into contact with probes of the probe card so as to perform an electric measurement of the part to be inspected, the apparatus includes a parameter setting part for setting a distance in the Z direction between the probe and the electrode pad when the pedestal is moved along the X, Y planes to specify the initial position of the chip, a memory unit for storing the distance in the Z direction set by the parameter setting part, and a control unit for moving the pedestal in the Z direction in a manner to be apart from the probe card on the basis of the distance in the Z direction stored in the memory unit to move the chip to the initial position, and moving relatively the pedestal in the Z direction from the position to the probe card so as to contact the electrode pad of the chip with the probe.

Abstract: A probe system tests the electrical characteristics of chips arranged in a matrix on a semiconductor wafer. An XYZ stage movable in the directions of three-dimensional axes is disposed under a probe card having probes to be brought into contact with the electrode pads of the chips. A wafer table rotatable within a horizontal plane is disposed on the XYZ stage. A first image pickup means for picking up the probe images is mounted on the XYZ stage. A second image pickup means for picking up a wafer image is disposed above the table. The second image pickup means is movable horizontally to and from a use position under the probe card. A target is supported and moved by a driving member mounted on the XYZ stage, for aligning the focal points and optical axes of the first and second image pickup means. The target is moved between forward and retreat positions within and outside the field of view of the first image pickup means.

Abstract: A probe system tests the electrical characteristics of chips arranged in a matrix on a semiconductor wafer. An XYZ stage movable in the directions of three-dimensional axes is disposed under a probe card having probes to be brought into contact with the electrode pads of the chips. A wafer table rotatable within a horizontal plane is disposed on the XYZ stage. A first image pickup means for picking up the probe images is mounted on the XYZ stage. A second image pickup means for picking up a wafer image is disposed above the table. The second image pickup means is movable horizontally to and from a use position under the probe card. A target is supported and moved by a driving member mounted on the XYZ stage, for aligning the focal points and optical axes of the first and second image pickup means. The target is moved between forward and retreat positions within and outside the field of view of the first image pickup means.