Patents by Inventor Shinji Asari
Shinji Asari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220372624Abstract: A control apparatus is included in a film forming apparatus that includes: a rotation table disposed in a vacuum container and configured to rotate around a central shaft of a table surface, thereby revolving a substrate on a disposing surface provided on a part of the table surface; a stage configured to rotate around the central shaft of the disposing surface, thereby rotating the substrate on the disposing surface; and a gas supply unit configured to supply a gas into the vacuum container. The control apparatus includes: a display control unit configured to display a setting screen for setting a first parameter that controls a rotation of the substrate; and a process execution unit configured to form a film on the substrate while controlling the rotation of the substrate based on the set first parameter.Type: ApplicationFiled: May 18, 2022Publication date: November 24, 2022Inventors: Yohei MATSUMOTO, Naohide ITO, Takehiro FUKADA, Shinji ASARI
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Publication number: 20220230852Abstract: A plasma processing apparatus includes a process chamber. A turntable is disposed in the process chamber and is configured to receive a substrate along a circumferential direction thereof. A process gas supply nozzle is configured to supply a process gas to the turntable. A plasma antenna is disposed on the process chamber at a position covering at least a part of the process gas supply nozzle. An ion trap plate is disposed over the process gas supply nozzle at a position overlapping at least a part of the plasma antenna in the process chamber.Type: ApplicationFiled: January 20, 2022Publication date: July 21, 2022Inventors: Hitoshi KATO, Hiroyuki KIKUCHI, Shinji ASARI, Yuji SAWADA
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Patent number: 10096504Abstract: A method for managing an atmosphere in a storage container in a processing apparatus including a substrate transfer region and a container transfer region which are partitioned by a partition wall; a load port; a container keeping rack; and a cover opening/closing mechanism, includes substituting the internal atmosphere of the storage container that stores non-processed substrates with the inert gas for using the cover opening/closing mechanism; transferring the storage container of which the internal atmosphere has been substituted with the inert gas, to the container keeping rack and placing and keeping the storage container on the container keeping rack; and putting the storage container on standby on the container keeping rack while maintaining the atmosphere substituted with the inert gas.Type: GrantFiled: April 8, 2014Date of Patent: October 9, 2018Assignee: Tokyo Electron LimitedInventors: Katsuhiko Oyama, Yasushi Takeuchi, Shinji Asari
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Patent number: 9425074Abstract: A heat treatment apparatus performs a heat treatment on a plurality of target objects held by a holding unit while allowing an inert gas to flow upwardly in a vertical processing container with at least one heating unit provided in the vicinity of the processing container. The heat treatment apparatus includes: a main temperature control unit configured to control the heating unit; an inert gas passage through which the inert gas flows into the processing container; an inert gas heating unit installed in the inert gas passage and configured to heat the inert gas; a first temperature measuring unit installed in the inert gas heating unit; and a temperature controller configured to control the inert gas heating unit based on temperatures measured by the first temperature measuring unit.Type: GrantFiled: June 20, 2013Date of Patent: August 23, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Shinji Asari, Hidekazu Sato, Tomohiro Shiobara
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Patent number: 9103029Abstract: A processing apparatus for processing objects, includes: a processing container structure having a bottom opening and including a processing container having a processing space for housing the objects, the container having a nozzle housing area on one side of the processing space and a slit-like exhaust port on the opposite side of the processing space from the nozzle housing area; a lid for closing the bottom opening of the processing container structure; a support structure for supporting the objects and which can be inserted into and withdrawn from the processing container structure; a gas introduction means including a gas nozzle housed in the nozzle housing area; an exhaust means including a plurality of exhaust systems for exhausting the atmosphere in the processing container structure; a heating means for heating the objects; and a control means for controlling the gas introduction means, the exhaust means and the heating means.Type: GrantFiled: June 16, 2011Date of Patent: August 11, 2015Assignee: Tokyo Electron LimitedInventors: Yu Wamura, Yuichiro Morozumi, Izumi Sato, Shinji Asari
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Publication number: 20140373387Abstract: A heat treatment apparatus performs a heat treatment on a plurality of target objects held by a holding unit while allowing an inert gas to flow upwardly in a vertical processing container with at least one heating unit provided in the vicinity of the processing container. The heat treatment apparatus includes: a main temperature control unit configured to control the heating unit; an inert gas passage through which the inert gas flows into the processing container; an inert gas heating unit installed in the inert gas passage and configured to heat the inert gas; a first temperature measuring unit installed in the inert gas heating unit; and a temperature controller configured to control the inert gas heating unit based on temperatures measured by the first temperature measuring unit.Type: ApplicationFiled: June 20, 2013Publication date: December 25, 2014Inventors: Shinji ASARI, Hidekazu SATO, Tomohiro SHIOBARA
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Publication number: 20140305540Abstract: A method for managing an atmosphere in a storage container in a processing apparatus including a substrate transfer region and a container transfer region which are partitioned by a partition wall; a load port; a container keeping rack; and a cover opening/closing mechanism, includes substituting the internal atmosphere of the storage container that stores non-processed substrates with the inert gas for using the cover opening/closing mechanism; transferring the storage container of which the internal atmosphere has been substituted with the inert gas, to the container keeping rack and placing and keeping the storage container on the container keeping rack; and putting the storage container on standby on the container keeping rack while maintaining the atmosphere substituted with the inert gas.Type: ApplicationFiled: April 8, 2014Publication date: October 16, 2014Applicant: Tokyo Electron LimitedInventors: Katsuhiko OYAMA, Yasushi TAKEUCHI, Shinji ASARI
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Publication number: 20130337394Abstract: According to one aspect of the present disclosure, provided is a heat treatment apparatus configured to heat treat a plurality of objects to be treated which are held and supported by a holding and supporting unit while an inert gas is allowed to flow in a vertical type processing chamber from a bottom to a top thereof, wherein the processing chamber has a heating unit installed therearound. The heat treatment apparatus includes a gas supply system configured to supply the inert gas, wherein the gas supply system includes a gas supply header portion located in a lower end of the processing chamber to allow the inert gas to flow along a circumferential direction of the lower end; and a gas introduction portion in communication with the gas supply header portion to introduce the inert gas into the processing chamber.Type: ApplicationFiled: June 14, 2013Publication date: December 19, 2013Inventors: Shinji ASARI, Hidekazu SATO, Hideki TAKAHASHI
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Publication number: 20120199067Abstract: An atmosphere in a reaction pipe is replaced by supplying a purge gas into the reaction pipe from a slit of a third gas injector when process gases are switched, by providing the third gas injector including the slit along a length direction of the reaction pipe in addition to first and second gas injectors including gas ejection holes for respectively supplying process gases, such as s Zr-based gas and an O3 gas, into the reaction pipe.Type: ApplicationFiled: February 6, 2012Publication date: August 9, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Yuichiro MOROZUMI, Izumi SATO, Shinji ASARI
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Publication number: 20110309562Abstract: A support structure for supporting a plurality of objects to be processed and to be disposed in a processing container structure in which a processing gas flows from the bottom to the top or from the top to the bottom, includes: a top plate portion; a bottom portion; and a plurality of support posts connecting the top plate portion and the bottom portion. A plurality of support portions for supporting the objects to be processed are formed in each support post along the longitudinal direction, and the pitch of the support portions is set larger on the downstream side than on the upstream side in the flow direction of the processing gas. The support structure can enhance the in-plane uniformity of the thickness of a film formed on a processing object.Type: ApplicationFiled: June 16, 2011Publication date: December 22, 2011Applicant: Tokyo Electron LimitedInventors: Shinji Asari, Mitsuhiro Okada
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Publication number: 20110312188Abstract: A processing apparatus for processing objects, includes: a processing container structure having a bottom opening and including a processing container having a processing space for housing the objects, the container having a nozzle housing area on one side of the processing space and a slit-like exhaust port on the opposite side of the processing space from the nozzle housing area; a lid for closing the bottom opening of the processing container structure; a support structure for supporting the objects and which can be inserted into and withdrawn from the processing container structure; a gas introduction means including a gas nozzle housed in the nozzle housing area; an exhaust means including a plurality of exhaust systems for exhausting the atmosphere in the processing container structure; a heating means for heating the objects; and a control means for controlling the gas introduction means, the exhaust means and the heating means.Type: ApplicationFiled: June 16, 2011Publication date: December 22, 2011Applicant: Tokyo Electron LimitedInventors: Yu WAMURA, Yuichiro Morozumi, Izumi Sato, Shinji Asari
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Publication number: 20110303152Abstract: A support structure for supporting a plurality of objects to be processed and to be disposed in a processing container structure in which a processing gas flows horizontally from one side to the opposite side, includes a top plate section; a bottom section; and a plurality of support posts connecting the top plate section and the bottom section, wherein a plurality of support portions for supporting the objects to be processed are formed in each support post at a predetermined pitch along the longitudinal direction, and the distance between the topmost support portion of the support portions of each support post and the top plate section as well as the distance between the lowermost support portion of the support portions of each support post and the bottom section are set not more than the pitch of the support portions. The support structure can prevent the occurrence of a turbulent gas flow in the top and bottom areas of the processing container structure.Type: ApplicationFiled: June 14, 2011Publication date: December 15, 2011Applicant: Tokyo Electron LimitedInventors: Shinji ASARI, Izumi Sato, Yuichiro Morozumi
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Patent number: 7632354Abstract: A thermal processing system with improved gas flow and method for injecting a process gas into a thermal processing system. The thermal processing system has an injection section with injection outlets that inject process gas into a processing space and a delivery section that delivers process gas to the injection section. The delivery section may be coupled with the injection section at an inlet disposed between opposite ends of the injection section. A fluid lumen of the injection section may have a larger cross-sectional area than a fluid lumen of the delivery section. The thermal processing system may include an inner tube, which surrounds the processing space, having a slit through which the processing space communicates with an annular pumping space defined between the inner tube and an outer tube of the thermal processing system.Type: GrantFiled: August 8, 2006Date of Patent: December 15, 2009Assignee: Tokyo Electron LimitedInventors: Anthony Dip, Shinji Asari, Meenakshisundaram Gandhi
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Publication number: 20080035055Abstract: A thermal processing system with improved gas flow and method for injecting a process gas into a thermal processing system. The thermal processing system has an injection section with injection outlets that inject process gas into a processing space and a delivery section that delivers process gas to the injection section. The delivery section may be coupled with the injection section at an inlet disposed between opposite ends of the injection section. A fluid lumen of the injection section may have a larger cross-sectional area than a fluid lumen of the delivery section. The thermal processing system may include an inner tube, which surrounds the processing space, having a slit through which the processing space communicates with an annular pumping space defined between the inner tube and an outer tube of the thermal processing system.Type: ApplicationFiled: August 8, 2006Publication date: February 14, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Anthony Dip, Shinji Asari, Meenakshisundaram Gandhi